Description
Sputtering Target for Sputtering Deposition Equipment. Made in U.S.A.
1 | sputtering target NiSi 2/1 at% 2″x.110 |
2 | Sputtering Target, 3″ x .250″ MAK gun w/ keeper. W90Ti10 wt% |
3 | sputtering target, Al 2″x.250″ |
4 | Sputtering Target, Al 2″x.250″ |
5 | Sputtering Target, Al 2″x.250″ |
6 | Sputtering Target, Al2O3 2″x.3mm” |
7 | Sputtering Target, Al2O3, 2″ x .250″ w/ copper backing plate |
8 | Sputtering Target, AlCu 99/1 2″x.250″ |
9 | Sputtering Target, AlMn 50/50 at% 2″x.125″ |
10 | Sputtering Target, AlNd 97/3 wt% 2″x.250″ |
11 | sputtering target, AlNd 98/2 wt% 2″x.250″ |
12 | Sputtering Target, AlNi 22.3/77.7 wt% 2″x.200″ |
13 | Sputtering Target, AlSi 99.8/0.2 2″x.225″ |
14 | Sputtering Target, AlTi 96.5/3.5 wt % 2″x.125″ |
15 | Sputtering Target, AlTi 96.5/3.5 wt% 2″x.125″ |
16 | Sputtering Target, Aluminum (Al) 2″x.250″ |
17 | Sputtering Target, AZO 2″x.125″ |
18 | Sputtering Target, AZO 2″x.125″ |
19 | Sputtering Target, AZO 2″x.250″ |
20 | sputtering target, BiIn 10/1 at% 2″x.150″ |
21 | Sputtering Target, BiIn 4/1 at% 2″x5mm |
22 | Sputtering Target, BiSb 1/3 at% 2″x.250″ |
23 | Sputtering Target, BiSb 1/3 at% 2″x3/16″ |
24 | Sputtering Target, C amorphous 2″x.25″ |
25 | sputtering target, Chromium (Cr) 2″x.250″ |
26 | Sputtering Target, Co70Fe15Ni15 at%, 2″ x .125″ |
27 | Sputtering Target, CoAl 1/1 at% 2″x.250″ |
28 | Sputtering Target, CoFe 50/50 wt% 2″x.125″ |
29 | Sputtering Target, CoFe 68.9/31.1 wt% 2″x.110″ |
30 | Sputtering Target, CoFe 80/20 wt% 2″x.040″ |
31 | Sputtering Target, CoFe 90/10 at% 2″x3mm |
32 | Sputtering Target, CoFe 95/5 at% 2″x.09″ |
33 | sputtering target, CoFe 95/5 at% 2″x.145″ |
34 | Sputtering Target, CoFe 95/5 at% 2″x.145″ |
35 | Sputtering Target, CoFeAl 2/1/1 2″x.125″ |
36 | Sputtering Target, CoGd 95/5 wt% 2″x.175″ |
37 | Sputtering Target, CoNi 20/80 at% 2″x.120″ |
38 | Sputtering Target, CoNi 20/80 at% 2″x.150″ |
39 | Sputtering Target, CoNi 55/45 2″x.240″ |
40 | Sputtering Target, CoTaZr 90/5/5 at% 2″x.110″ |
41 | sputtering target, CoTi 1/1 at% 2″x.250″ |
42 | sputtering target, CoTi 1/1 at% 2″x.250″ |
43 | sputtering target, Cr 2″x.250″ |
44 | Sputtering Target, Cr 2″x.250″ |
45 | Sputtering Target, Cr2O3 2″x.125″ |
46 | Sputtering Target, Cu50Ni50 wt%, 2″ x .250″ |
47 | Sputtering Target, CuAl 40/60 2″x.250″ |
48 | Sputtering Target, CuGa 75/25 at% 2″x.250″ |
49 | Sputtering Target, CuGa 85/15 at% 2″x.250″ |
50 | Sputtering Target, CuSe 2″x.125″ |
51 | Sputtering Target, CuZnSnSSe 20/10/20/25/25 2″x.125″ |
52 | Sputtering Target, CuZnSnSSe 25/12.5/12.5/25/25 2″x.125″ |
53 | Sputtering Target, Fe 2″ x .060″ |
54 | Sputtering Target, Fe 2″x.025″ |
55 | Sputtering Target, Fe, 2″ x .250″ bonded to Cu backing plate |
56 | sputtering target, FeAl 96.5/3.5 2″x.090 |
57 | Sputtering Target, FeAl 96.5/3.5 2″x.090″ |
58 | Sputtering Target, FeAl 96/4 at% 2″x.090″ |
59 | Sputtering Target, FeAl 96/4 at% 2″x.090″ |
60 | Sputtering Target, FeAl 97.5/2.5 2″x.090″ |
61 | sputtering target, FeB 7/3 at% 2″x.125″ |
62 | Sputtering Target, FeCo 65/35 at% 2″x.235″ |
63 | Sputtering Target, FeMo 85/15 at% 2″x.120″ |
64 | Sputtering Target, FeSn 45/55 at% 2″x.125″ |
65 | Sputtering Target, FeTa 90/10 2″x.100″ |
66 | sputtering target, FeTb 30/70 wt% 2″x.120″ |
67 | sputtering target, GeTe 1/1 at% 2″x.125″ |
68 | Sputtering Target, ITO (In2O3(90)SnO2(10) 2″x.250″ bonded to Cu backing plate |
69 | Sputtering Target, Mg 2″x.250″ |
70 | Sputtering Target, MnAl 48/52 at% 2″x6mm |
71 | Sputtering Target, Mo 2″x.250″ |
72 | Sputtering Target, Mo 2″x.250″ |
73 | Sputtering Target, MoCr 85/15 at% 2″x.250″ |
74 | Sputtering Target, MoCu12 wt% 2″x.125″ |
75 | Sputtering Target, NbGe 75/25 at% 2″x.125″ |
76 | Sputtering Target, NbTi 70/30 wt% 2″x.060″ |
77 | Sputtering Target, Ni 2″x.125″ |
78 | Sputtering Target, Ni 2″x.250″ |
79 | sputtering target, Ni/Ti 10/90 wt% 2″x.250″ |
80 | Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
81 | Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
82 | Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
83 | Sputtering Target, Ni10Ti90 wt%, 2″ x .250″ |
84 | Sputtering Target, Ni10Ti90 wt%, 2″ x .250″ |
85 | Sputtering Target, Ni20Ti80 wt %, approx 3″x.25″w/ 4″ copper backing plate |
86 | Sputtering Target, Ni80Al20 wt%, 2″ x .250″ |
87 | Sputtering Target, Ni90Ti5Al5 wt %, approx 3″x.25″w/ 4″ copper backing plate |
88 | Sputtering Target, Ni95Ti5 wt %, approximately 3″x.25″w/ 4″ copper backing plate |
89 | Sputtering Target, Ni95Ti5 wt% 2″x.250″ |
90 | Sputtering Target, NiaF 2″x.125″ |
91 | Sputtering Target, NiFe 7/3 at% 2″x.125″ |
92 | sputtering target, NiFe 79/21 at% 2″x.125″ |
93 | Sputtering Target, NiGe 45/55 at% 2″x.250″ |
94 | Sputtering Target, NiGe 60/40 at% 2″x.250″ |
95 | Sputtering Target, NiMnSn 50/36/14 at% 2″x.125″ |
96 | Sputtering Target, NiMoRe 77.6/20/2.4 at% 2″x.250″ |
97 | sputtering target, NiSi 2/1 at% 2″x.110″ |
98 | sputtering target, NiTi 10/90 wt% 2″x.250 |
99 | Sputtering Target, NiTi 10/90 wt% 2″x.250″ |
100 | sputtering target, NiTi 25/75 wt% 2″x.250″ |
101 | sputtering target, NiTi 25/75 wt% 2″x.250″ |
102 | Sputtering target, NiTi 50/50 at% 2″x.170″ |
103 | Sputtering Target, NiTi 50/50 at% 2″x.170″ |
104 | Sputtering Target, Sb 2″x.125″ |
105 | Sputtering Target, Sb 2″x.125″ |
106 | Sputtering Target, Sc, 2″ x .040″ |
107 | Sputtering Target, Si 2″x.125″ |
108 | Sputtering Target, Si76.4Al6.6B17 wt %, 2.92″x .200″ w/ 4″ copper backing plate |
109 | Sputtering Target, Si92Al8 wt% 1.75″ x .125″ bonded to 2″ copper backing plate |
110 | Sputtering Target, Sn92.5Mg7.5 wt %, approx 3″x.25″w/ 4″ copper backing plate |
111 | Sputtering Target, SnO2 2″x.125″ |
112 | Sputtering Target, SnS 2″x.125″ |
113 | Sputtering Target, SnS2 2″x.125″ |
114 | Sputtering Target, SnS2 2″x.125″ |
115 | Sputtering Target, Te 2″x.250″ |
116 | Sputtering Target, Ti 2″x.250″ |
117 | Sputtering Target, Ti47.3Sn52.7 wt %, approx 3″x.25″w/ 4″ copper backing plate |
118 | Sputtering Target, Ti50Ta50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
119 | Sputtering Target, Ti75Sn25 wt %, approx 3″x.25″w/ 4″ copper backing plate |
120 | Sputtering Target, Ti95.3Y4.7 wt %, approx 3″x.25″w/ 4″ copper backing plate |
121 | Sputtering Target, Y 1.75″ x .125″ bonded to 2″ copper backing plate |
122 | Sputtering target, Yttrium 2″x.063″ |
123 | Sputtering Target, Zinc 2″ x .250″ |
124 | Sputtering Target, Zn 2″x.250″ |
125 | Sputtering Target, Zn target, 2″ x .250″ in plated copper cup |
126 | sputtering target, ZnAl 98/2 wt% 2″x.250″ |
127 | Sputtering Target, ZnO 2″x.125″ |
128 | Sputtering Target, ZnO target, 2″ x .250″ in copper cup |
129 | Sputtering Target, ZnO/AlO3 98/2 wt% 2″x.125″ |
130 | Sputtering Target, ZnOAl2O3 99.9/0.1 wt% 2″x.125″ |
131 | Sputtering Target, ZnOMgO 10 at% 2″x.125″ |
132 | Sputtering Target, Zr 2″x.250″ |
133 | Sputtering Target, Zr 2″x.250″ |
134 | Sputtering Target,ZnO 2″ x .250″ bonded to Cu backing plate |
Condition: New
Location: CA USA
Valid Time: Subject to prior sale. This item is only for end user
ID-SS380EB20221207