Description
Refurbished & Upgraded TES-600 / MRC 603, 643 Fast Cycle Load Lock Sputtering System
SemiStar Corp. offers a refurbished and upgraded Materials Research Corporation (MRC) 603,643, TES-600 Fast Cycle Load Lock Sputtering System for semiconductor, compound semiconductor, university, research institute, optical coating, and advanced materials thin film deposition applications.
This system was originally based on the MRC 603 / MRC 643 / MRC 693 sputtering platform and was later completely rebuilt, refurbished, and upgraded by Technical Engineering Services (T.E.S.) into a TES-600 fast cycle load lock sputtering system.
The system includes modern PC-based control, GE Fanuc automation hardware and software, Advanced Energy Pinnacle II DC power supply, RF power supply, RF matching network, updated electronics, and TES-style painted frame configuration for improved reliability, maintainability, and repeatable process control capability.
Depending on customer budget and project requirements, the system may be sold as:
- AS-IS condition
- Complete working system with functional test
- Refurbished with OEM specifications and installation support if applicable
Photos shown are for reference only. Actual configuration, installed options, accessories, and condition may vary. Final specifications are subject to formal quotation.
Availability
- TES-600 / MRC 693 Fast Cycle Load Lock Sputtering System
- Original system platform: MRC 603 / MRC 643 / MRC 693
- Completely rebuilt and upgraded by TES
- TES-style painted frame and cabinet configuration
- Located in Morgan Hill, California, USA
- Available AS-IS, functional tested, or refurbished condition
- Warranty available under formal quotation terms
- Installation and startup support available if applicable
- Subject to prior sale
OEM Information
- OEM: Materials Research Corporation (MRC) / Technical Engineering Services (TES)
- Model: MRC 693 / MRC 603 (TES-600)
- Location: 380 Tennant Ave, Suite 7, Morgan Hill, CA, USA
Current Configuration
- MRC 693 rebuilt as TES-600 sputtering system
- Fast cycle load lock sputtering platform
- PC-based controller upgrade
- GE Fanuc automation control hardware and software
- Planar flat screen monitor
- Advanced Energy Pinnacle II DC power supply
- RF power supply
- RF matching network
- Modern electronic control upgrades
- TES-style painted frame and cabinet system
- Vacuum process chamber and load lock system
- Magnetron sputtering platform
System Description
The TES-600 series sputtering system is a fast cycle load lock sputtering platform originally based on the MRC 600/900 sputtering architecture. The TES-600 utilizes a horizontal process configuration with dual-level load lock operation for improved throughput and contamination reduction.
The fast cycle load lock allows completed substrate pallets to be exchanged without venting the process chamber, helping reduce contamination of sputtering targets and chamber surfaces while significantly improving throughput and pumpdown time.
The substrate pallet travels in linear motion in front of rectangular magnetron cathodes to provide excellent deposition uniformity and target utilization. Depending on configuration, substrate deposition uniformity of approximately ±5% may be achievable.
T.E.S. Upgrade
Technical Engineering Services (T.E.S.) completely rebuilt and upgraded this MRC sputtering platform into a TES-600 system using modern industrial automation and updated electronic subsystems.
- PC-based control system
- GE Fanuc automation control hardware
- GE Fanuc automation software
- Modern operator interface
- Advanced Energy Pinnacle II DC power supply
- New RF power supply
- RF matching network
- Modern electronic component upgrades
- TES-style painted frame and cabinet configuration
- Improved maintainability and long-term supportability
- Reduced dependence on obsolete original electronics
Sputtering Configuration
- Fast cycle load lock sputtering system
- Horizontal process configuration
- Dual-level load lock operation
- Linear pallet substrate transport
- Support for up to three rectangular magnetron cathodes
- Compatible with 5” x 15” rectangular magnetron cathodes
- RF sputtering capability
- DC sputtering capability
- RF substrate etching capability
- Substrate heating capability in process chamber
Automation and Software
- Recipe-based process automation
- GE Fanuc system automation control
- Automatic substrate transfer capability
- Repeatable process operation
- Operator-friendly process control interface
- Production-style process sequencing capability
Vacuum and Load Lock System
- Fast cycle load lock configuration
- Automatic substrate transfer capability
- Reduced process chamber contamination
- Reduced pumpdown time
- High vacuum process chamber operation
- Automatic atmosphere-to-process chamber transfer
- Typical base pressure reference: 9 × 10-7 torr in less than 7 minutes, depending on configuration and condition
Typical Applications
- RF magnetron sputtering
- DC magnetron sputtering
- Metal thin film deposition
- Optical coating applications
- Semiconductor thin film deposition
- Compound semiconductor processing
- Research and development sputtering
- Production sputtering applications
- Substrate RF etching applications
- University and institute research
Reference TES-600 / TES-900 Information
| System Type | Fast cycle load lock sputtering system |
| Original Platform | MRC 603 / MRC 643 / MRC 693 |
| TES Configuration | TES-600 horizontal process platform |
| Load Lock | Dual-level fast cycle load lock |
| Substrate Motion | Linear pallet scanning transport |
| Cathode Support | Up to three 5” x 15” rectangular magnetron cathodes |
| Uniformity | Reference ±5% achievable depending on process and configuration |
| Automation | GE Fanuc automation hardware and software |
| DC Power Supply | Advanced Energy Pinnacle II |
| Base Pressure Reference | 9 × 10-7 torr in less than 7 minutes, reference only |
Refurbishment and Support Options
- AS-IS condition available
- Functional tested system available
- Full refurbishment with OEM specifications available
- Vacuum chamber cleaning and leak check
- RF and DC power system inspection
- Automation system inspection
- Vacuum pump and load lock inspection
- Safety interlock verification
- Final functional test before shipment
- Warranty available under formal quotation terms
- Installation and startup support if applicable
Facility Requirements
- Customer responsible for facility preparation
- Electrical power required
- Cooling water required
- Compressed air may be required
- Vacuum pump exhaust connection required
- Process gas connections required
- Rigging, utilities, exhaust, and local code compliance are customer responsibility unless otherwise specified
RFQ Information Requested
- Substrate size and material
- Target materials
- Film thickness and uniformity requirements
- RF and DC sputtering requirements
- Substrate heating requirements
- Gas configuration requirements
- Facility location and utilities
- Installation and training requirements
- Expected purchase timeline
Important Notes
- All configurations and specifications are subject to final inspection and formal quotation.
- Actual system configuration may vary from reference TES information.
- Installed cathodes, power systems, vacuum systems, and automation packages may vary.
- All OEM names and trademarks belong to their respective owners.
- Website information is for reference only and is not final purchase specification.
Contact SemiStar
SS380-MSP-275
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