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STS ICP AOE Pro Etcher

Description

Refurbished STS / SPTS Multiplex ICP AOE Pro Advanced Oxide Etcher

SemiStar Corp. offers a refurbished STS / SPTS Multiplex ICP AOE Pro Advanced Oxide Etcher based on current inventory and original equipment configuration. STS, later known as SPTS Technologies and now associated with KLA through the SPTS product line, is widely recognized for semiconductor plasma etch, oxide etch, MEMS, dielectric etch, fused silica processing, and advanced semiconductor R&D applications.

This STS Multiplex ICP AOE Pro system was previously used by a USA-based end-user customer in an R&D environment for shallow and deep etching applications. According to the previous owner, the system was in normal operation with no known issues when removed from service after installation of a replacement tool.

The STS / SPTS AOE Pro platform is designed for advanced oxide etch and ICP plasma etch applications requiring stable plasma generation, dielectric etch capability, backside helium cooling, and high selectivity process performance.

Refurbished systems are supplied based on current inventory and original equipment configuration. Installation, startup assistance, and warranty may be available depending on system condition, final configuration, and project scope.

Photo shown is for reference only. Actual system appearance and configuration may vary.

Available System Configuration

Item Configuration
System STS Multiplex ICP AOE Pro Advanced Oxide Etcher
Wafer Size 100mm, 150mm
Etched Materials SiO2, quartz, Pyrex, fused silica, Si3N4, bulk silicon
Mask Materials Si, photoresist, Cr, Ti, Ni
ICP Coil Power 3000W, 13.56MHz, Advanced Energy
Bias RF Power 1000W, 13.56MHz, ENI
Chuck / Cooling Platen backside helium cooling with standard 8-pin clamp and lip seal
Process Gases C4F8, SF6, O2, H2, CF4, plus two open gas slots
Process Pressure 2–80 mTorr
Temperature Capability Platen -20°C to 120°C, walls 100°C, lid 120°C
Wafer Conversion Converted to 100mm with ceramic parts from quartz configuration
Condition Complete / Working at Removal
Status De-installed

Typical Applications

  • Advanced oxide etch
  • ICP dielectric etch
  • Quartz and fused silica etch
  • MEMS process development
  • Shallow and deep oxide etch
  • Pyrex etch applications
  • Si3N4 etch
  • Semiconductor R&D and university research

Typical Process Performance

Application Typical Performance
2.5µm isolated trenches on 8–10µm TEOS Etch rate >2000Å/min SiO2, selectivity >4:1 SiO2:PR, variability ±3%, sidewalls 85–90°
5µm features on 3–10µm SiO2 Etch rate >3000Å/min SiO2, selectivity >7.5:1 SiO2:PR, variability ±2%, sidewalls 89–90°

System and Process Notes

The STS / SPTS Multiplex ICP AOE Pro configuration is intended for advanced oxide etch and dielectric etch applications requiring stable ICP plasma generation, backside helium cooling, low-temperature processing capability, and fluorine-based etch chemistry. Final process performance depends on substrate type, mask material, wafer loading, recipe, facility conditions, and operator process development.

Because STS / SPTS systems were configured for specific applications, final suitability should be reviewed based on wafer size, target material, feature size, etch depth, aspect ratio, and facility capability.

Related STS / SPTS Inventory

SemiStar may also have other STS / SPTS Multiplex plasma etch systems available, including Bosch Process DRIE, HRM deep silicon etch, ICP RIE, and M/PLEX metal etch configurations. Please contact SemiStar for current inventory and configuration details.

Important Notes

  • Refurbished equipment availability is subject to prior sale.
  • Refurbished systems are supplied based on current inventory and original equipment configuration.
  • Actual configuration, process capability, installation scope, warranty, and delivery schedule must be confirmed by quotation.
  • SemiStar does not provide spare parts or service support for STS systems not sold by SemiStar.
  • All OEM names, trademarks, and model names belong to their respective owners.
  • All website information is for reference only and is not a purchase specification. Final configuration, scope, price, and terms are based on SemiStar’s official quotation.

Request a Quote for STS / SPTS AOE Pro Etcher

Please contact SemiStar with your target application and required configuration. Helpful information includes wafer size, substrate material, etch material, feature size, etch depth, process gases, facility limitations, budget, and expected purchase timeline.

Contact SemiStar

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