Description
Refurbished Plasma-Therm 700 Series Wafer Batch Plasma Etcher Deposition System
SemiStar Corp. offers one refurbished Plasma-Therm 700 Series Wafer Batch Plasma Etcher and PECVD Deposition System located at our Morgan Hill, California, USA facility. This system is available in refurbished condition with OEM specifications, subject to final inspection, configuration confirmation, and prior sale.
The Plasma-Therm 700 Series is a dual-chamber wafer batch plasma processing platform configured with one isotropic plasma etcher chamber and one PECVD deposition chamber. The system is suitable for semiconductor, MEMS, university, compound semiconductor, nanotechnology, and advanced materials plasma process applications.
Product photos are for reference only. Actual system configuration, accessories, cosmetic condition, utilities, installed options, and software configuration should be confirmed by SemiStar’s final quotation and inspection report.
Availability
| Equipment Model | Plasma-Therm 700 Series Wafer Batch Plasma Etcher Deposition System |
| Equipment Type | Wafer Batch Plasma Etcher and PECVD Deposition System |
| Category | Etch / Plasma Etcher / PECVD / Batch Plasma Processing |
| Manufacturer / OEM | Plasma-Therm |
| Condition | Refurbished, used good condition |
| Chamber Configuration | Two chambers: one isotropic plasma etcher chamber and one PECVD deposition chamber |
| Process Type | Batch wafer plasma processing |
| Quantity | 1 set |
| Location | Morgan Hill, California, USA |
| Lead Time | Estimated 6–10 weeks depending on PO timing and final PO conditions |
| Warranty | 6 months after shipment, subject to final quotation terms |
| Installation / Training | Available if necessary; scope and cost to be confirmed |
| Price | Contact SemiStar by filling out the inquiry form below |
| Validity | Subject to prior sale without notice |
System Description
The Plasma-Therm 700 Series wafer batch platform is designed for plasma etching and plasma enhanced deposition applications. The system configuration includes one isotropic plasma etcher chamber and one PECVD deposition chamber, providing flexible plasma processing capability for semiconductor research, pilot production, and university laboratory applications.
The isotropic plasma etcher chamber is suitable for plasma etching, resist strip, descum, cleaning, and related isotropic plasma processing applications. The PECVD chamber supports plasma enhanced deposition processes for dielectric and passivation film applications.
Current Configuration
- Plasma-Therm 700 Series wafer batch plasma system
- Dual chamber configuration
- One isotropic plasma etcher chamber
- One PECVD deposition chamber
- Batch wafer processing capability
- 8 gas lines with 8 MFCs installed
- Industrial plasma processing platform
- Research and pilot production capability
Installed Gas Configuration
| Gas | MFC Range | Quantity |
|---|---|---|
| NH3 (Ammonia) | 100 SCCM | 2 |
| N2 (Nitrogen) | 1 SLM | 4 |
| N2 (Nitrogen) | 200 SCCM | 1 |
| N2 (Nitrogen) | 2 SLM | 1 |
The system is configured with 8 gas lines and 8 MFCs. Final gas assignment by chamber and actual process configuration should be confirmed during final inspection and quotation review.
Typical Applications
- Isotropic plasma etching
- Batch wafer plasma processing
- Photoresist strip and descum
- Surface cleaning and plasma treatment
- PECVD dielectric film deposition
- Passivation film deposition
- MEMS process development
- University and research institute plasma research
- Advanced materials plasma processing
Batch Processing Capability
- Wafer batch plasma processing platform
- Dual chamber configuration for process flexibility
- Suitable for research and pilot production environments
- Actual wafer quantity and substrate capability depend on installed hardware and process configuration
RF Power and Process Information
The Plasma-Therm 700 Series platform commonly uses 13.56 MHz RF plasma processing architecture for stable plasma etching and PECVD applications. Final installed RF generator configuration, matching network configuration, heater capability, and process temperature capability should be confirmed during final inspection and refurbishment review.
Facility Requirements
- Electrical power requirements to be confirmed during final configuration review
- Process gas cabinets and gas delivery systems required
- Vacuum pump and exhaust requirements to be reviewed
- Cooling water/chiller requirements to be confirmed
- Facility exhaust and scrubber compatibility required
- Customer responsible for utilities, facility preparation, gas safety systems, exhaust, abatement, and local code compliance unless specifically included in quotation
Refurbishment and Support
SemiStar can provide the equipment in refurbished condition with OEM specifications. Refurbishment scope, functional testing, installation, training, utilities integration, and warranty scope will be confirmed based on the final purchase order and customer requirements.
The standard offering includes a 6-month warranty after shipment unless otherwise stated in the official quotation. Installation and training can be quoted separately if required.
RFQ Information Requested
To help us recommend the best final configuration and support scope, please provide:
- Substrate size and material
- Target etch or PECVD process
- Required film type or plasma chemistry
- Required gas configuration changes if any
- Expected process throughput and wafer quantity
- Need for installation, startup, or training support
- Facility readiness and utility information
- Expected purchase timeline and budget range
Important Notes
- Subject to prior sale without notice.
- Final specifications subject to SemiStar official quotation and inspection confirmation.
- All OEM names, trademarks, and model names belong to their respective owners.
- SemiStar is not the OEM. Product information is provided for reference only and should not be used as final purchase specifications.
- Final purchase specifications, refurbishment scope, warranty terms, installation scope, and commercial terms must follow SemiStar’s official quotation.
Contact SemiStar
SS220-MSP-195
Other available models:
| Plasma-Therm | Dual Chamber 790 PECVD (on side Low Freq. & other side 13.56Mhz) could be converted to both sides 13.56MHz |
| Plasma-Therm | 790 PECVD upper Electrode Low Freq. & Lower electrode High Freq. |
| Plasma-Therm | 790 RIE Parts tool |
| Plasma-Therm | 790 PECVD |
| Plasma-Therm | 790 PECVD |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | SLR 720 RIE |
| Plasma-Therm | VLR VersaWorks Cluster tool- one chamber PECVD |
| Plasma-Therm | VLN (Versaline) ICP – single wafer manual load |
| Plasma-Therm | VLN (Versaline) ICP – two wafer Brooks handler – manual load |
| YESHMDS | Class 10 – all Stainless Steel |
ID-SS5732W and OEM Module-2