Refurbished Branson/IPC 2000 3000 4000 Series Manual Plasma Asher Plasma Etcher Descum Semiconductor Equipment

SemiStar Corp. offers refurbished Branson/IPC 2000, 3000, and 4000 Series manual plasma asher, plasma etcher, and descum semiconductor equipment for qualified end-user customers. These systems include desktop and stand-alone manual load / unload plasma processing platforms used for photoresist ashing, descum, dry cleaning, surface treatment, and plasma etching applications.

Typical Branson/IPC models may include the following. Different models may have different chamber sizes, wafer capacity, RF power, gas configuration, dimensions, weight, and facility requirements.

2000 Series

• Branson/IPC 2000
• Branson/IPC 2100
• Branson/IPC 2100/4
• Branson/IPC P2100
• Branson/IPC S2000
• Branson/IPC S2100

3000 Series

• Branson/IPC 3000
• Branson/IPC 3000S
• Branson/IPC 3000/3
• Branson/IPC 3100
• Branson/IPC P3075
• Branson/IPC S3003
• Branson/IPC S3100LP
• Branson/IPC L3100
• Branson/IPC L3200

4000 Series

• Branson/IPC 4000
• Branson/IPC 4055
• Branson/IPC 4055/2
• Branson/IPC 4100
• Branson/IPC 4150
• Branson/IPC S4075

Other Larger / Special Models

• Branson/IPC 7102
• Branson/IPC 7104
• Branson/IPC 9104
• Branson/IPC 9104/A
• Branson/IPC L1818
• Dionex Gas / Branson IPC systems

Photo is for reference only. Actual system configuration and appearance may vary.

System Description

Branson/IPC manual plasma systems are compact RF plasma processing platforms used for semiconductor, MEMS, compound semiconductor, university, and research applications. These systems are commonly used for plasma ashing, plasma descum, dry cleaning, surface activation, and plasma etching.

The basic concept is similar across the Branson/IPC manual equipment family: the operator manually loads samples or wafers into the chamber, the system evacuates the chamber, process gas is introduced, RF power generates plasma, and the process is completed under controlled pressure, gas flow, and time.

Because Branson/IPC systems were manufactured in many desktop, stand-alone, quartz chamber, metal chamber, and customized configurations, final specifications must be confirmed based on the exact model, serial number, chamber type, RF generator, gas configuration, and customer application.

Configuration Capability

• Manual load / unload plasma processing equipment
• Desktop or stand-alone configuration depending on exact model
• Plasma asher or plasma etcher configuration depending on chamber type
• Quartz chamber configuration typically used for plasma ashing and descum applications
• Metal chamber configuration typically used for plasma etching applications
• Small sample to 8 inch wafer capability depending on model and chamber configuration
• Single-wafer or multi-wafer batch processing capability depending on fixture and chamber design
• RF plasma processing capability
• RF generator power varies by configuration
• Gas configuration varies by model and installed gas lines
• Vacuum pressure monitoring capability
• Timed process operation
• Automatic, semi-automatic, or manual operation depending on controller configuration
• PC controller upgrade option available for selected working systems, subject to evaluation

Applications

• Photoresist ashing
• Plasma descum, cleaning
• Dry plasma cleaning
• Plasma surface treatment
• Surface activation
• Plasma etching
• Polymer removal
• Organic residue removal
• Small sample processing
• MEMS process applications
• Compound semiconductor R&D
• University and research institute applications
• Semiconductor process development

Typical Process Capability

Typical Branson/IPC manual plasma system process capability may include low-pressure RF plasma processing, controlled process gas flow, vacuum pressure monitoring, and timed process operation.

• Process Type: Plasma ashing, descum, dry cleaning, surface treatment, or plasma etching depending on configuration
• Loading: Manual load / unload
• Wafer / Sample Size: Small samples up to 8 inch wafers depending on model and chamber configuration
• Chamber Type: Quartz chamber for ashing / descum or metal chamber for etching depending on model
• RF Power: Configuration dependent
• Gas Lines: Configuration dependent
• Wafer Quantity Per Run: Configuration dependent

Actual performance depends on the final system configuration, chamber type, wafer size, substrate material, process gas, sample loading, recipe, refurbishment scope, and customer facility conditions.

Facility Requirements

Facility requirements should be confirmed before PO and may vary depending on the exact model and configuration. Typical facility items may include:

• Power: Final power requirement to be confirmed based on exact system configuration
• Vacuum: Vacuum pump capability required
• Cooling: Cooling water or chiller may be required for RF generator depending on configuration
• Process Gases: Customer process gases depending on ashing, descum, cleaning, or etching application
• CDA / N₂: May be required depending on system configuration
• Exhaust: Process exhaust and pump exhaust required
• Dimensions / Weight: Depend on exact model and configuration
• Utilities: Final utility requirements to be confirmed with SemiStar before shipment
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers or water temperature controllers if applicable, process gas supply, exhaust, CDA / N₂, power connection, and related facility support items unless otherwise specified in quotation.

PC Controller Upgrade Service

In addition to offering refurbished Branson/IPC manual plasma systems, SemiStar may provide PC controller upgrade solutions for selected customer-owned working systems. Upgrade scope may include a new PC controller, updated interface, control electronics, power supply, gas control integration, MFC integration, and touch screen monitor depending on system condition and configuration.

PC controller upgrade feasibility must be reviewed case by case based on the exact model, current system condition, original wiring, installed options, documentation, and available parts.

RFQ Information Required

To help us recommend the correct Branson/IPC configuration and provide an accurate quotation, please provide the following information:

• End user company name and contact information
• Preferred model, if any
• Application: plasma ashing, descum, dry cleaning, surface treatment, or plasma etching
• Wafer size or sample size
• Wafer material or sample material
• Quantity per run requirement
• Preferred chamber type: quartz chamber asher / descum or metal chamber etcher
• Required process gases
• Process specifications and target results
• Throughput requirement
• RF power requirement, if known
• Vacuum pump requirement or existing pump information
• Have you used Branson/IPC or similar plasma systems before? If yes, please provide model information.
• Budget range
• Purchase timeline
• Any special facility or installation requirements

Contact SemiStar

SS380-MSP-45-95