Description

Refurbished Lam Rainbow 4520i Oxide Plasma Etcher Semiconductor Equipment

SemiStar Corp. offers refurbished Lam Research Lam Rainbow 4520i plasma etcher and RIE ICP semiconductor equipment for qualified end-user customers. The Lam Rainbow 4520i is a fully automated, single-wafer plasma etching system commonly used for silicon dioxide (SiO₂) and dielectric etch applications.

The Rainbow 4520i is part of the Lam Rainbow etcher family. Compared with Rainbow 4420 systems commonly used for polysilicon / SiN_x etch, the Rainbow 4520 / 4520i platform is generally used for oxide and dielectric etch applications. Rainbow 4620 and 4720 platforms are generally associated with metal etch applications.

Photo is for reference only. Actual system configuration and appearance may vary.

Availability

• Condition: Refurbished with OEM specification
• OEM: Lam Research
• Model: Rainbow 4520i
• System Type: Single-wafer plasma etcher
• Primary Application: SiO₂ / dielectric etch
• Wafer Size: Typically up to 200 mm / 8-inch depending on configuration
• Quantity: 1 set
• Location: Morgan Hill, CA, USA
• Lead Time: Typically 10–20 weeks after PO, depending on refurbishment scope, parts availability, and production schedule
• Validity: Subject to prior sale
• Sales Policy: Available to qualified end users only
• Warranty: 6 months standard warranty; extended warranty available at additional cost
• Installation: Optional, quoted separately

System Description

The Lam Rainbow 4520i is a computer-controlled, automated plasma etcher designed for single-wafer semiconductor processing. The system is typically configured for oxide and dielectric etch processes and may include cassette-based wafer handling, loadlock operation, RF plasma processing, endpoint detection, backside helium cooling, and recipe-based process control depending on final configuration.

The “i” version is generally considered a later or improved Rainbow 4520 platform, with enhanced system integration, operator interface, automation, and control features depending on the specific tool configuration.

Configuration Capability

• Single-wafer plasma etch processing
• Oxide / dielectric etch platform
• Automatic wafer handling
• Cassette interface
• Loadlock configuration
• Vacuum plasma process chamber
• RF plasma generation and matching network
• Recipe-based process control
• Endpoint detection capability depending on configuration
• ESC / electrostatic chuck capability depending on configuration
• Backside helium cooling capability depending on configuration
• Operator interface with monitor and front control panel
• SECS / communication capability depending on configuration

Applications

• SiO₂ etching
• Dielectric etching
• Oxide contact / via etch process development
• Semiconductor wafer processing
• Research, pilot line, and production support applications
• University, research institute, and semiconductor fab applications

Typical Process Capability

Typical Rainbow 4520i process capability may include controlled process gas flow, controlled chamber pressure, RF plasma processing, wafer temperature control, backside helium cooling, endpoint detection, and automatic wafer transfer.

• Etch Type: Plasma oxide / dielectric etch
• Wafer Handling: Automated single-wafer operation
• Wafer Size: Configuration-dependent, commonly up to 200 mm
• Process Control: Recipe-based control
• Endpoint: Available depending on configuration
• Backside Cooling: Helium backside cooling capability depending on configuration
• Chamber: Vacuum plasma process chamber

Actual process performance depends on final system configuration, wafer size, film stack, process gas chemistry, chamber condition, refurbishment scope, customer process recipe, and facility conditions.

Facility Requirements

Facility requirements must be confirmed before PO and may vary depending on the final system configuration.

• Power: To be confirmed based on final system configuration
• Vacuum: Vacuum pump capability required
• Cooling: Chiller or cooling water support may be required depending on configuration
• Process Gases: To be confirmed based on customer oxide / dielectric etch process requirements
• Exhaust: Chamber exhaust, gas panel exhaust, cabinet exhaust, and vacuum pump exhaust may be required
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers or cooling water if applicable, process gas supply, exhaust, CDA / N₂, power connection, and related facility support items unless otherwise specified in quotation.

Refurbishment and Support Capability

SemiStar may provide refurbishment, parts sourcing, configuration review, installation support, and service support for Lam Rainbow 4520i systems on a case-by-case basis. Support feasibility depends on system condition, documentation, software status, parts availability, and project scope.

RFQ Information Required

To help us recommend the correct configuration and provide a more accurate quotation, please do your best to provide the following information. If some information is not available at this stage, that is normally acceptable and we can discuss together later.

• End user company name and contact information
• Wafer size and wafer shape
• Wafer material
• Wafer thickness and wafer bow condition if applicable
• Film materials to be etched
• Oxide / dielectric material type, such as SiO₂, TEOS, PSG, BPSG, or other films
• Etch type: isotropic or anisotropic etching
• Target etch depth
• Target etch rate
• Required etch uniformity
• Critical dimension / profile control requirements
• Selectivity requirements
• Required process gases
• Current process recipe if available
• Current equipment model being used
• Etch process specifications and target results
• Endpoint detection requirement
• ESC / backside helium cooling requirement
• Throughput requirement
• Required cassette type and wafer handling configuration
• SECS/GEM communication requirement
• Vacuum pump preference or existing facility pump information
• Power and facility limitations if any
• Special contamination or particle control requirements
• Special process safety requirements
• Do you need refurbishment only, upgrade, parts support, or complete system?
• Have you used Lam Rainbow 4520i, Rainbow 4520, or similar oxide plasma etcher equipment before? If yes, please provide model information and whether the system met your requirements.
• Budget range
• Expected purchase timeline
• Any special facility, installation, training, or acceptance requirements

Important Notes

• Final configuration, price, lead time, warranty, and availability are subject to confirmation at the time of quotation and PO.
• System availability is subject to prior sale.
• This equipment is offered to qualified end users only.
• All trademarks, model names, and OEM names belong to their respective owners.
• SemiStar is not the OEM. Refurbishment, upgrades, parts, and services are provided by SemiStar unless otherwise stated.
• SemiStar only provides spare parts and field service support for equipment sold or upgraded by SemiStar.

Contact SemiStar

SS6098-MSP