Description

Refurbished Lam Research TCP 9400SE Plasma Etcher Semiconductor Equipment

SemiStar Corp. offers refurbished Lam Research Lam TCP 9400SE plasma etcher and RIE ICP semiconductor equipment for qualified end-user customers. The Lam TCP 9400SE is a single-wafer plasma etch system used for semiconductor wafer processing and process development applications.

The available system is currently configured for 150 mm wafer processing with fixed gap ESC, 200 mm VAT valve, Edwards 1303 turbo pump, 8-gas orbital gas box, and RFG 1250 Halo and RFDS generators.

Photo is for reference only. Actual system configuration and appearance may vary.

Availability

• Condition: Refurbished
• OEM: Lam Research
• Model: TCP 9400SE
• System Type: Single-wafer plasma etcher
• Current Wafer Size: 150 mm
• Available Wafer Size Options: 100 mm to 200 mm
• Quantity: 1 set
• Lead Time: To be confirmed based on PO timing, refurbishment scope, selected options, parts availability, and production schedule
• Validity: Subject to prior sale
• Sales Policy: Available to qualified end users only
• Installation and Startup: Available as an option
• Warranty: Available as an option

Current Configuration

• 150 mm wafer configuration
• Fixed gap ESC
• 200 mm VAT valve
• Edwards 1303 turbo pump
• 8-gas orbital gas box
• RFG 1250 Halo generator
• RFDS generator

Available Options

• 100 mm to 200 mm wafer size configuration options
• PTX / VCI upgrade
• Installation and startup support
• Warranty options

System Description

The Lam Research TCP 9400SE is a plasma etch platform designed for single-wafer semiconductor processing. The system configuration may support wafer handling, vacuum process control, RF plasma generation, electrostatic chucking, gas delivery, and process recipe control depending on final refurbishment and configuration.

SemiStar can review the final system configuration, available options, facility requirements, and refurbishment scope with the customer before quotation and PO.

Applications

• Semiconductor plasma etching
• Silicon and dielectric etch process development depending on configuration
• University and research institute process applications
• Compound semiconductor and silicon wafer processing depending on customer process requirements
• R&D, pilot line, and fab support applications

Typical Process Capability

Typical TCP 9400SE process capability may include controlled process gas delivery, RF plasma processing, vacuum pressure control, ESC wafer clamping, turbo-pumped vacuum operation, and recipe-based plasma etch control.

• Wafer Handling: Single-wafer operation
• Wafer Size: Current 150 mm configuration; 100 mm to 200 mm options available
• Chuck: Fixed gap ESC
• Vacuum Control: 200 mm VAT valve
• Vacuum Pump: Edwards 1303 turbo pump
• Gas Box: 8-gas orbital gas box
• RF: RFG 1250 Halo and RFDS generators

Actual process performance depends on final system configuration, wafer size, wafer material, film stack, process gas chemistry, chamber condition, refurbishment scope, customer process recipe, and facility conditions.

Facility Requirements

Facility requirements must be confirmed before PO and may vary depending on the final system configuration and selected options.

• Power: To be confirmed based on final system configuration
• Vacuum: Turbo pump and backing pump support required
• Cooling: Cooling water or chiller support may be required depending on configuration
• Process Gases: To be confirmed based on customer process requirements and gas box configuration
• Exhaust: Chamber exhaust, gas box exhaust, cabinet exhaust, and pump exhaust may be required
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps or backing pumps if not included, chillers or cooling water if applicable, process gas supply, exhaust, CDA / N₂, power connection, and related facility support items unless otherwise specified in quotation.

Refurbishment and Support Capability

SemiStar may provide refurbishment, configuration review, upgrade options, parts sourcing, installation startup, and service support for Lam TCP 9400SE systems on a case-by-case basis. Support feasibility depends on system condition, documentation, software status, selected options, parts availability, and project scope.

RFQ Information Required

To help us recommend the correct configuration and provide a more accurate quotation, please do your best to provide the following information. If some information is not available at this stage, that is normally acceptable and we can discuss together later.

• End user company name and contact information
• Required wafer size: 100 mm, 150 mm, 200 mm, or other
• Wafer material
• Wafer thickness and wafer bow condition if applicable
• Film materials to be etched
• Etch type: isotropic or anisotropic etching
• Target etch depth
• Target etch rate
• Required etch uniformity
• Critical dimension / profile control requirements
• Selectivity requirements
• Required process gases
• Current process recipe if available
• Current equipment model being used
• Etch process specifications and target results
• Endpoint detection requirement
• ESC requirement
• Throughput requirement
• Required cassette type and wafer handling configuration
• PTX / VCI upgrade requirement
• Vacuum pump preference or existing facility pump information
• Power and facility limitations if any
• Special contamination or particle control requirements
• Special process safety requirements
• Do you need refurbishment only, upgrade, parts support, installation/startup, warranty, or a complete system package?
• Have you used Lam TCP 9400SE, TCP 9400, or similar plasma etcher equipment before? If yes, please provide model information and whether the system met your requirements.
• Budget range
• Expected purchase timeline
• Any special facility, installation, training, or acceptance requirements

Important Notes

• Final configuration, price, lead time, warranty, and availability are subject to confirmation at the time of quotation and PO.
• System availability is subject to prior sale.
• This equipment is offered to qualified end users only.
• All trademarks, model names, and OEM names belong to their respective owners.
• SemiStar is not the OEM. Refurbishment, upgrades, parts, and services are provided by SemiStar unless otherwise stated.
• SemiStar only provides spare parts and field service support for equipment sold or upgraded by SemiStar.

Contact SemiStar

SS6098-MSP