Different Plasma Sources

Description

Nano-Master Main Equipment: Thin Film | Etch | Cleaning | Space Simulation | Hybrid

Different Plasma Sources
We offer a different kinds of plasma sources to fit your application, ranging from hollow cathode plasma sources to inductively coupled plasma sources.

NANO-MASTER Four Antenna Planar ICP Source . Novel Four Antenna Coil Design for Planar Inductively Coupled Plasma Source for DRIE, ICP-RIE Applications. (Download Brochure)
NANO-MASTER Shower Head Plasma Source SH-1000RF Shower Head Source
- Gases through RF Plate
- Secondary Plate to introduce other gasses to plasma
- Water Cooled
- Up to 600 W
- 0.02 Torr to 8 Torr operation
- 8″ active area
- ISO 250 Flange
Hollow Cathode 13.56 MHz RF Plasma Sources
- Features:
  - Operation over an extended power and pressure range.
  - High plasma and radical species densities with excellent homogenity (1011 cm^-3).
  - Compatible with chemical reactive and non-reactive gases
  - Cw and pulsed power operation
  - Low contamination
- Options
  - Linear type also available in 600 mm and 900 mm
- Applications:
  - Plasma enhanced chemical vapor deposition (PECVD)
  - Plasma polymerization, plasma cleaning, plasma etching
  - Surface modification
SLAN (SLot ANtenna) 2.45 GHz Microwave Plasma Sources
- Features:
  - High plasma densities
  - Pressure range from 10^-5 mbar up to atmospheric pressure
  - Compatible with chemically reactive and non-reactive gases
  - Low contamination
  - ECR and non-ECR operation
  - Cw and pulsed operation
- Options
  - Available in 4, 16 and 67 cm diameters
- Applications:
  - Plasma enhanced chemical vapor deposition (PECVD)
  - Plasma polymerization, plasma cleaning, plasma etching
  - Surface modification
  - Material science
Inductively Coupled Plasma Source ICP-P 200 (13.56 MHz)
- Features:
  - Planar coil with 200 mm diameter
  - Extended power range (3-1200 W)
  - Low ion energy with narrow energy spread
  - High plasma and radical densities
  - Low contamination
  - Cw and pulsed operation
- Applications:
  - Plasma enhanced chemical vapor deposition (PECVD)
  - Plasma polymerization, plasma cleaning, plasma etching
  - Surface modification
  - MaterialS science