Description

New Plasma Asher Descum Equipment for Compound materials

The New Plasma Asher/Descum equipment represents the industry standard in single-wafer photoresist removal and the mainstay of the highly successful plasma descum system for GaAs, SiC, GaN,InP,GaInP etc. Developed in cooperation with many of the world’s leading compound materials IC producers, the New Plasma Asher/Descum equipment has been designed for optimum performance, non-parts obsolescence, and low cost of ownership.

The New Plasma Asher/Descum equipment is a plasma ash/descum system with an integrated robotic wafer transfer engineered for fragile substrates. It is controlled by advanced Control Software. It is uses RF generated plasma to ash the photoresist.

The wafers to be processed are in a cassette and placed on the cassette station. The operator selects a recipe and starts the process run. The integrated solid robot takes a wafer from the cassette and places it on the centering station. It then places the wafer into the chamber. Once the wafer has been processed, it is returned to the cassette.

Compared with other plasma asher descum systems, the New Plasma Asher/Descum equipment is more robust, more reliable and to modernize many of the key electronic components.

Plasma Asher Descum Systems Applications :

Photoresist Stripping
- High dose implant (As⁺, B⁺, P⁺)
- Rework
- Post-polysilicon etch
- Post-metal etch
- Post-oxide etch
Controlled Resist Removal
- Post-develop descum (pre-etch)
- Dry/wet process capability
- Uniformity capability (<5% 1σ)
GaAs, InP wafer Strip and Descum
Thin Film Head Resist Cleaning
Opto-Electronic Devices Cleaning
MEMS (Micro Systems Technology)

Key Features of the new plasma asher descum equipment:

Production proven for more than 40 years for compound materials wafer dur to much better performance.
Designed with III-V Production in mind!
Downstream chamber structure.
The integrated solid robotic wafer transfer is much more reliable .
The control boards were redesigned with modern components and added features.
The temperature control system for heating the chuck uses the Eurotherm controller. If the software detects the temperature is not within tolerance, it will turn off the current to the chuck heater and abort the process.
Designed for 2” to 6” circular wafers. 8 inch is also optional.
A light spectrum monitor (optional) is used to determine the endpoint by monitoring the illuminated intensity of the plasma.
Wafer centering/cooling station.
NO OBSOLETE PARTS.
Industrial grade computer, touch screen GUI, and large hard disk drive.
Small Footprint

Software Features

Automated calibration of all subsystems from within the control software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the chambers.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.
Simple and easy to use menu screens which allow a process cycle to be easily defined and executed.
Troubleshooting features which allow engineers and service personnel to activate individual subassemblies and functions independently of other subsystems.
The control software runs on almost any Pentium class PC computer with a parallel (printer) port. The computer interfaces to the system with only 1 cable, the control interface cable. There is also an interface cable to the robot controller. There is also an interface cable for the Eurotherm controller.
The interface board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.

Safety Features

The system incorporates several features to prevent damage to wafers or injury to personnel.

There is a watchdog timer on the interface board. This turns off the process parameters if the communication between the computer and the system is interrupted or the software freezes.
The RF system is interlocked to prevent their inadvertent operation when the chamber door is open.
Pneumatic: The pneumatics is used to operate the Positive Shut-off valves and the chamber door. If there is no air pressure, the shut-off valves will close. If the power is removed from the system, then the pneumatic gas valves close automatically.
EMO (Emergency Off): When the EMO is depressed, the power to the entire machine is turned off.
Water Flow Switch: The water needs to flow at the recommended rate that is specified in the Installation manual. When a process starts, it will check the water flow rate. If the flow rate drops below this, the process will not run and an alarm will be issued.

Please contact us if you are interested in the New Plasma Asher/Descum equipment .Appreciate your time.

ID-220

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