Description
Semiconductor equipment in USA. These are subject to prior sale without notice. Appreciate your time.
| 1 | Applied Materials | Precision 5000 Mark II | P5000 Mark II | CVD |
| 2 | Applied Materials/Semitool | Semitool LT210C Gold Deplater | LT210C 6-2 | Gold Deplater |
| 3 | Applied Materials/Semitool | Semitool LT210C Gold Deplater | LT-210C 2-2-1 | Gold Deplater |
| 4 | Applied Materials/Semitool | Semitool Raider ECD210 Electroplating Deposition | Raider ECD210 / R310PD23SRD6CFD06AY03 | Electroplater |
| 5 | Applied/Materials/Semitool | Semitool SAT211 Photoresist | SAT 211 | Gold Acid Spray Etch |
| 6 | Axcelis | Axcelis GSD200E2 180KeV High Current Implanter | GSD200E2 | Implant |
| 7 | BioRad | BioRad QS2200A FTIR | QS2200A | Spectrometer |
| 8 | Cognex | Wafer ID Reader | Optical Inspect | |
| 9 | DNS | DNS 80 B Coat/Track | SK-80BW-BVP | Coat/develop |
| 10 | DNS | DNS 60A Spin/Expose/Develop | SKW-60A-BVPE | Spin/Expose/Develop |
| 11 | DNS | DNS Planar Pulsar Chemical Resist/Strip | 6SCW-60A-AV | Coater |
| 12 | DNS | DNA Planar Pulsar Chemical Resist/Strip | 6SCW-60A-AV | Coater |
| 13 | EVG | EVG 850 Automated Production Bonding System | 850 | Wafer Bonder |
| 14 | EVG | EVG 850 Automated Production Bonding System | 850 | Wafer Bonder |
| 15 | EVG | EVG 850 Automated Debonding System | 850 | Wafer DeBond |
| 16 | EVG | EVG 850 Automated Debonding System | 850 | Wafer DeBond |
| 17 | EVG | EVG 150 Automated Resist Processing System | 150 | Spray Resist |
| 18 | KLA-Tencor | KLA-Tencor AIT8010 Patterned Wafer Surface Inspection | AIT8010 | Defect Review |
| 19 | Logitech LTD | Logitech LTD 1WBT5 Wafer Bonder | 1WBT5 | Wafer Bonder |
| 20 | PlasmaTherm | Plasma-Therm Veralock ICP Etcher (2) Chamber | Versalock | ICP Etch |
| 21 | PlasmaTherm | Plasma-Therm Versaline ICP Etcher (1) Chamber | Versaline | ICP Etch |
| 22 | PlasmaTherm | Plasma-Therm Versaline ICP Etcher (4) Chamber | Versaline | ICP Etch |
| 23 | Plasma-Therm | Plasma-Therm Versaline Deposition PECVD / HDPCVD (3) Chamber | Versaline | Deposition CVD |
| 24 | Santa Clara Plastics | Wet bench | 6 Inch Wetbench | Wet Etch |
| 25 | Suss | Suss Gamma Coat/Develop Cluster | GAMMA | Coat/Develop |
| 26 | SVG | SVG 8826/28/6 Dual Coat/Track | 8826/28/36 | Coat/Track |
| 27 | Temescal | Temescal Evaporator Deposition System | 4400 | Emmitter Metal Evap |
| 28 | Temescal | Temescal Evaporator Deposition System | 4400 | Emmitter Metal Evap |
| 29 | Temescal | Temescal Evaporator Deposition System | 5700 | Emmitter Metal Evap |
| 30 | Ultron | Ultron UH108 Wafer Backlapping Film Applicator | UH108 | Taper |
| 31 | Ultron | Ultron UH108 Wafer Backlapping Film Applicator | UH108 | Taper |
| 32 | Ultron | Ultron UH108 Wafer Backlapping Film Applicator | UH108 | Taper |
| 33 | Yield Engineering Systems | YES Vacuum Oven | 58TA | Photo Oven |
SS5880
