Description

Refurbished Lam Rainbow 4420 Plasma Etcher Semiconductor Equipment

SemiStar Corp. offers refurbished Lam Research Lam Rainbow 4420 plasma etcher plasma etcher semiconductor equipment for qualified end-user customers. The Lam Rainbow 4420 is a fully automated, single-wafer plasma etching system designed for semiconductor wafer processing applications.

The Rainbow 4420 supports 4-inch, 5-inch, 6-inch, and 8-inch wafer processing depending on configuration, and features automatic wafer handling, cassette interface, electrostatic chuck capability, programmable electrode spacing, backside helium cooling, endpoint detection, and computer-controlled operation.

Photo is for reference only. Actual system configuration and appearance may vary.

Availability

• Condition: Refurbished with OEM specification
• OEM: Lam Research
• Model: Rainbow 4420
• Wafer Size: 200 mm / 8-inch configuration; other wafer sizes depend on final configuration
• Location: USA
• Lead Time: Typically 10–12 weeks after PO, to be confirmed based on PO timing, refurbishment scope, parts availability, and current production schedule
• Validity: Subject to prior sale
• Sales Policy: Available to qualified end users only
• Warranty: 6 months standard warranty; extended warranty available at additional cost
• Installation: Optional, quoted separately

System Description

The Lam Rainbow 4420 is a computer-controlled, fully automated, single-wafer plasma etcher. The system is designed for poly plasma etching and supports either manual or automatic operation. The system monitors alarm conditions and provides operator prompts, machine status, and process information through the operator interface.

The system includes wafer transport modules, cassette indexers, loadstation, shuttle, lifter / spinner assembly, edge detection, loadlocks, wafer handling arms, process chamber, RF system, gas panel, vacuum system, temperature control, AC/DC distribution, and operator control panels.

Configuration Capability

• Single-wafer plasma etch processing
• 4-inch, 5-inch, 6-inch, and 8-inch wafer capability depending on configuration
• 200 mm wafer configuration currently listed
• Two cassette interface with Hine 38F indexers
• Automatic wafer transport and alignment
• Electrostatic chuck capability
• Programmable electrode spacing
• Top powered electrode configuration
• Backside helium cooling
• Endpoint detection: monochromator 405 nm / 520 nm
• RF match type: Lam
• RF generator: ENI OEM-650A
• System software: Envision Version 1.5.1
• SECS I interface
• Orbitally welded gas box
• On-board AC distribution: fused type
• Vacuum pump included; no warranty on pump unless otherwise specified
• Chiller and RF included; no warranty unless otherwise specified

Gas Configuration

The listed system includes the following gas configuration. Final gas configuration must be confirmed during quotation and refurbishment review.

• Gas #1: N₂, 200 sccm, Unit 1200A
• Gas #2: CHF₃, 50 sccm, Unit 1200A
• Gas #3: N₂, 300 sccm, Aera
• Gas #4: N₂, 500 sccm, Unit UFC 1660
• Gas #5: CF₄, 150 sccm, Unit 1200A
• Gas #6: SF₆, 150 sccm, Unit 1200A
• Gas #7: He, 1 slm, Unit UFC 1660
• Gas #8: O₂, 200 sccm, Unit UFC 1660

Applications

• Plasma etching
• Poly etch applications
• Semiconductor wafer processing
• Research, pilot line, and semiconductor fab applications
• Compound semiconductor and silicon wafer process development depending on recipe and configuration

Typical Process Capability

Typical Rainbow 4420 process capability may include automatic wafer handling, controlled process gas flow, controlled chamber pressure, RF plasma processing, backside helium cooling, endpoint detection, and recipe-based process control.

• Wafer Handling: Fully automated single-wafer operation
• Wafer Size: 4-inch, 5-inch, 6-inch, and 8-inch depending on configuration
• Endpoint: Monochromator endpoint detection or timed process control depending on configuration
• RF Generator: ENI OEM-650A
• Backside Cooling: Helium backside cooling capability
• Process Chamber: Vacuum plasma process chamber with powered electrode and electrostatic chuck capability

Actual performance depends on final system configuration, wafer type, film material, process recipe, etch target, refurbishment scope, and customer facility conditions.

Facility Requirements

Facility requirements must be confirmed before PO and may vary depending on the final system configuration.

• Power: 208 VAC, 3-phase, 5-wire
• Vacuum: Vacuum pump capability required
• Cooling: Chiller or cooling water support may be required depending on configuration
• Process Gases: N₂, CHF₃, CF₄, SF₆, He, O₂, and other gases depending on process configuration
• Exhaust: Chamber exhaust, gas cabinet / gas panel exhaust, cabinet exhaust, and vacuum pump exhaust may be required
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers or cooling water if applicable, process gas supply, exhaust, CDA / N₂, power connection, and related facility support items unless otherwise specified in quotation.

Refurbishment and Support Capability

SemiStar may provide refurbishment, parts sourcing, configuration review, installation support, and service support for Lam Rainbow 4420 systems on a case-by-case basis. Support feasibility depends on system condition, documentation, software status, parts availability, and project scope.

RFQ Information Required

To help us recommend the correct configuration and provide a more accurate quotation, please do your best to provide the following information. If some information is not available at this stage, that is normally acceptable and we can discuss together later.

• End user company name and contact information
• Wafer size and wafer shape
• Wafer material
• Wafer thickness and wafer bow condition if applicable
• Film materials to be etched
• Etch type: isotropic or anisotropic etching
• Target etch depth
• Target etch rate
• Required etch uniformity
• Critical dimension / profile control requirements
• Selectivity requirements
• Required process gases
• Current process recipe if available
• Current equipment model being used
• Etch process specifications and target results
• Endpoint detection requirement
• CLAMP or ESC / backside helium cooling requirement
• Throughput requirement
• Required cassette type and wafer handling configuration
• SECS/GEM communication requirement
• Vacuum pump preference or existing facility pump information
• Power and facility limitations if any
• Special contamination or particle control requirements
• Special process safety requirements
• Do you need refurbishment only, upgrade, parts support, or complete system?
• Have you used Lam Rainbow 4420 or similar plasma etcher equipment before? If yes, please provide model information and whether the system met your requirements.
• Budget range
• Expected purchase timeline
• Any special facility, installation, training, or acceptance requirements

Important Notes

• Final configuration, price, lead time, warranty, and availability are subject to confirmation at the time of quotation and PO.
• System availability is subject to prior sale.
• This equipment is offered to qualified end users only.
• All trademarks, model names, and OEM names belong to their respective owners.
• SemiStar is not the OEM. Refurbishment, upgrades, parts, and services are provided by SemiStar unless otherwise stated.
• SemiStar only provides spare parts and field service support for equipment sold or upgraded by SemiStar.

Contact SemiStar

SS380-SS6098-MSP-345