Description
Refurbished Electroglas EG 4090 / 4090X / 4090u+ 200mm Wafer Prober Systems
SemiStar Corp. offers refurbished Electroglas EG 4090, EG 4090X, and EG 4090u+ 200mm wafer prober systems for semiconductor wafer probing, parametric test, wafer sort, MEMS, compound semiconductor, university, research institute, and production-support applications.
We currently have one EG 4090X, one EG 4090, and one Electroglas EG 4090u+ in stock. These systems are offered in refurbished condition only. Customer should send RFQ information so SemiStar can confirm the correct configuration, installed options, refurbishment scope, warranty, and installation support if applicable.
These systems are typically used for 8-inch / 200mm wafer probing applications. Final wafer size capability, chuck configuration, thermal capability, probe card interface, microscope/vision options, and tester interface must be confirmed based on the specific system configuration.
Photos shown are for reference only. Actual configuration, installed accessories, chuck type, thermal capability, probe card interface, software, tester interface, and condition may vary. Final specifications are subject to formal quotation.
Availability
- One Electroglas EG 4090 wafer prober system
- One Electroglas EG 4090X wafer prober system
- One Electroglas EG 4090u+ wafer prober system
- 200mm / 8-inch wafer probing platform
- Refurbished condition only
- Warranty available under formal quotation terms
- Installation and startup support available if applicable
- Subject to prior sale
Available Models
Electroglas EG 4090
- Production-proven 200mm automatic wafer prober platform
- Suitable for wafer sort and parametric test applications
- Automatic wafer handling and probing capability depending on configuration
- Thermal chuck capability depending on installed configuration
- Refurbished condition only
Electroglas EG 4090X
- 200mm wafer prober platform
- Suitable for semiconductor wafer probing and production-support applications
- Configuration subject to final inspection
- Refurbished condition only
Electroglas EG 4090u+
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- Extended-performance 200mm wafer prober platform
- Improved productivity and automation capability compared with earlier 4090 configurations
- Fine-pitch probing capability depending on installed options
- MicroTouch soft touchdown capability depending on installed configuration
- Thermal application capability depending on installed chuck and system configuration
- Refurbished condition only
Electroglas 4090u+ Current Configuration
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- Model: Electroglas 4090u+ (Electroglas 4090u plus / Electroglas 4090 u+)
- Operating System: Windows 2000
- Probe Card Holder: Rectangular
- Power Supply: 110 VAC
- Software Version: EGCMD 9.2.1 SP5
- Chuck Type: Nickel chuck
- Clean Type: Aux Pad
- LCD monitor configuration
- Hot chuck configuration
- OCR capability
- DPS configuration
The above configuration is based on the currently installed hardware/software of the available Electroglas 4090u+ system. Final installed options, interfaces, software, and operational capability are subject to final inspection and refurbishment scope.
System Description
The Electroglas 4090 series is a well-known family of 200mm automatic wafer probers used in semiconductor manufacturing and wafer-level test environments. These systems are designed for wafer probing, parametric test, wafer sort, fine-pitch probing, thermal test applications, and automated test cell operation.
The EG 4090u+ is an extended-performance version of the Electroglas 4090 platform. It was designed to improve test cell utilization, simplify probing operation, increase throughput, and expand application capability for advanced wafer probing requirements.
SemiStar offers these Electroglas probers in refurbished condition only. Final configuration and refurbishment scope will depend on customer RFQ requirements and the installed hardware on each available system.
Typical Capability
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- 200mm / 8-inch wafer probing
- Automatic wafer probing capability
- Parametric test applications
- Wafer sort applications
- Fine-pitch probing applications depending on configuration
- Thermal chuck applications depending on installed options
- Probe card alignment capability depending on configuration
- Automatic wafer alignment capability depending on configuration
- Tester interface capability depending on configuration
- Hands-off probing operation depending on installed options and final setup
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Typical Applications
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- Semiconductor wafer probing
- 200mm wafer sort
- Parametric wafer test
- Device characterization
- MEMS wafer probing
- Compound semiconductor wafer probing
- University and institute semiconductor test applications
- Production-support wafer test
- Fine-pitch device probing depending on system configuration
- Thermal wafer probing depending on chuck configuration
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Refurbishment Scope
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- System inspection and condition report
- Wafer handling inspection
- Chuck and stage inspection
- Motion system verification
- Microscope / vision system inspection if applicable
- Probe card interface inspection
- Controller and software inspection
- Electrical and safety interlock inspection
- Thermal chuck verification if applicable
- Functional test before shipment based on agreed quotation scope
- Warranty under formal quotation terms
- Installation and startup support if applicable
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Reference Configuration Items To Confirm
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- Wafer size: 200mm / 8 inch
- Chuck type
- Thermal chuck capability
- Probe card interface
- Microscope / vision system
- Wafer handling configuration
- Tester interface
- Software version
- PC / controller configuration
- Facility and utility requirements
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RFQ Information Requested
To recommend the correct refurbished Electroglas prober and configuration, please provide:
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- Required model: EG 4090, EG 4090X, or EG 4090u+
- Wafer size: 8 inch / 200mm
- Wafer material
- Probe card type and interface requirement
- Thermal chuck requirement and temperature range
- Tester model and interface requirement
- Vision / microscope requirements
- Automation and wafer handling requirements
- Application: wafer sort, parametric test, R&D, MEMS, compound semiconductor, or production support
- Installation and training requirements
- Facility location and available utilities
- Expected purchase timeline
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Facility Requirements
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- Customer is responsible for facility preparation
- Electrical power requirements to be confirmed based on final configuration
- Compressed air or vacuum may be required depending on wafer handling configuration
- Cooling may be required for thermal chuck applications
- Tester connection and communication interface are customer responsibility unless otherwise specified
- Rigging, utilities, local code compliance, and site readiness are customer responsibility unless otherwise specified
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Important Notes
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- Systems are sold in refurbished condition only.
- Final configuration is subject to inspection and formal quotation.
- Actual installed options may vary between the EG 4090, EG 4090X, and EG 4090u+ systems.
- 200mm / 8-inch wafer capability should be confirmed for the specific system before purchase.
- Thermal chuck, MicroTouch, fine-pitch probing, probe card alignment, and tester interface capabilities depend on installed hardware and software configuration.
- All OEM names and trademarks belong to their respective owners.
- Website information is for reference only and is not final purchase specification.
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