Typical NANOTECHNOLOGY Lab Fab Equipment

Description

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The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.

Lithography
Photoresists and Lithography Chemicals
Auto. Coat/Develop S-Cubed Flexi
Contact Aligners Optical Exposure
Contact Aligners SUSS MJB-3
Contact Aligner SUSS MA-6
DUV Flood Expose
Direct-Write Lithography
E-Beam Lithography System (JEOL JBX-6300FS)
E-Beam Lithography (Nabity v9)
Focused Ion-Beam Lithography (Raith Velion)
Maskless Aligner (Heidelberg MLA150)
Patterning Systems
Holographic Litho/PL Setup
Steppers Optical Exposure
Stepper GCA 6300, i-line
Stepper AutoStep 200, i-line
Stepper ASML DUV, Deep-UV
Thermal Processing for Photolithography
Ovens Labline
Oven Fisher
Oven Labline
High Temp Oven (Blue M)
Lithography Support
The Spinner Benches have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
POLOS spinners on Develop and Solvent benches
Spin/Rinse/Dryer
Vacuum Deposition
Physical Vapor Deposition (PVD)
TES FC-1800
Temescal FC-1800
CHA Mark 50
CHA Evaporator
Temescal BJD-1800
Varian 3120 E-Beam
Airco FC-1800
Temescal FC-1800
Thermal Evaporation
E-Beam Evaporation Sharon
E-Beam Evaporation Temescal
E-Beam Evaporation CHA
E-Beam Evaporation Plasys
Thermal Evaporation
Thermal Evaporation Solder
Sputter Deposition
Perkin-Elmer 4400
Perkin-Elmer 4450
Perkin-Elmer 2400
MRC 603 693 TES
Temescal BJD-1800
CPA S-Gun -Sputter
MRC 643 -Sputter
MRC 603 Sputter
MRC 8671 Sputtering
Emscope SC-650
Sputter AJA ATC 2000-F
Sputter AJA ATC 2200-V
Sputter AJA ATC 2200-V
Ion Beam Deposition Veeco NEXUS
SEM Sample Coater Hummer
Chemical Vapor Deposition CVD
SAVANNAH S200-ALD
PlasmaLab 80 Plus
Plasmalab 80+ DPCVD
PlasmaTherm 790
PlasmaTherm 720
PlasmaTherm 700
STS PECVD
PECVD PlasmaTherm 790
PECVD Advanced Vacuum
ICP-PECVD (Unaxis VLR)
Molecular Vapor Deposition
Atomic Layer Deposition Oxford FlexAL
Dry Etch
Reactive Ion Etching RIE
RIE ,MRC
RIE ,MRC
RIE PlasmaTherm
Plasma Etching and Cleaning
Plasma Clean YES EcoClean
Tegal 901e
Tegal 903e
Lam AutoEtch 490
Lam AutoEtch 590
Matrix 303
Matrix 403
PlasmaTherm 790 RIE
PlasmaTherm 720
Oxford 133 RIE
OXFORD 100 RIE
SAMCO RIE 10 NR
STS ICP Multiplex
STS ICP Bosch Process
STS ICP HRM
Lam Rainbow 4420
PlasmaTherm 700
Branson/IPC 3000
Branson/IPC L3200
Gasonics L3510
Gasonics Aura 3010
Gasonics Aura 1000
Gasonics Aura 3000
Gasonics Aura 2000
Matrix 105
Matrix 205
Matrix 209S
March PX-250
AST Barrel Asher
PlasmaEtch PE-100
Plasma Etch BT1
Technics 2000
Technics PE-IIA
Plasma Activation EVG 810
Ashers Technics PEII
Etch Monitoring
Laser Etch Monitoring Endpoint Detection
Optical Emission Spectra
Residual Gas Analyzer,RGA
ICP-RIE
ICP Etch Panasonic E646V
ICP Etch Panasonic E626I
ICP-Etch Unaxis VLR
Oxford ICP Etcher PlasmaPro 100 Cobra
Plasma-Therm SLR: Fluorine ICP PlasmaTherm/SLR Fluorine Etcher
Plasma-Therm DSE-iii PlasmaTherm/Deep Silicon Etcher
Ion Milling and Reactive Ion Beam Etching
CAIBE Oxford Ion Mill
Focused Ion-Beam Lithography Raith Velion
Other Dry Etching
UV Ozone Reactor
XeF2 Etch Xetch
Vapor HF Etch
Wet Processing
Wet Benches
Solvent Cleaning Benches
Spin Coat Benches
Develop Benches
Toxic Corrosive Benches
Wafer Toxic Corrosive Bench
HF/TMAH Processing Benches
Plating Bench
Gold Plating Bench
Critical Point Dryer
Spin Rinse Dryer SemiTool
Chemical-Mechanical Polisher Logitech
Mechanical Polisher Allied
Auto. Coat/Develop S-Cubed Flexi
Auto. Wet-Processing Spinners POLOS
Thermal Processing
Heatpulse 8108
Heatpulse 4100
Heatpulse 4100S
Heatpulse 610
Heatpulse 8800
Heatpulse 4108
Heatpulse 610I
Heatpulse 410
Heatpulse 310
Heatpulse 210
MPT RTP-3000
JETFIRST 100 -RTP
JETFIRST 150 -RTP
Jipelec Jetfirst 200
JETFIRST 200 RTP
AnnealSys AS-One
Rapid Thermal Annealer/Processor RTA AET RX6
Rapid Thermal Processor SSI Solaris 150
Tube Furnace Tystar 8300
Tube Furnace Wafer Bonding Thermco
Tube Furnace AlGaAs Oxidation Lindberg
Wafer Bonder SUSS SB6-8E
Wafer Bonder/Wax Mounting Logitech WBS2
OvensLabline
Oven Thermo-Fisher HeraTherm
Oven Labline)
High Temp Oven Blue M)
Packaging Back-end Fabrication Tools
Die Singulation / Down-sizing
Dicing Saw ADT
Manual Wafer Cleaver PELCO Flipscribe
Automated Wafer Cleaver Loomis LSD-155LT
Other Packaging
Vacuum Sealer
Wafer/Die Bonding
Flip-Chip Bonder Finetech
Wafer Bonder SUSS SB6-8E
Wafer Bonder/Wax Mounting Logitech WBS2
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
Optical Microscopy
Optical Microscopes – General Use
Fluorescence Microscope Olympus MX51
Deep UV Optical Microscope Olympus
Laser Scanning Confocal M-scope Olympus LEXT
Digital Microscope Olympus DSX1000
Near-IR Inspection Scope MJB-IR
Electron Microscopy
SEM JEOL IT800SHL
SEM JEOL IT800SHL w/ EDAX
SEM Sample Coater Hummer
Topographical Metrology
Step Profilometer KLA Tencor P-7
Step Profilometer DektakXT
Atomic Force Microsope Bruker ICON
Laser Scanning Confocal M-scope Olympus LEXT
Thin-Film/Material Analysis
Thickness + Optical Constants
Ellipsometer Woollam
Optical Film Thickness Microscope-Mounted Filmetrics F-40-UV
Optical Film Thickness & Wafer-Mapping Filmetrics F50
Reflection/Transmission Spectra & Optical Film Thickness Filmetrics F10-RT-UVX
Electrical Analysis
Resistivity Mapper CDE RESMAP
Probe Station & Source/Meter Units
Photo-emission & Thermal IR Microscope QFI
Other Properties
Film Stress Tencor Flexus
Particle Counts KLA/Tencor Surfscan
Photoluminescence PL Setup
Tencor Mgage-300
Tencor Mgage-200
Tencor Sonogage 200
KLA Tencor P-7
KLA Tencor P6
ResMap 178
Sloan Dektak II
Microscope AFX-II
Gaertner L117
Electroglas EG 4090u+
Electroglas EG 4090X
Electroglas EG 2001
Electroglas EG 1034
Cascade PS-21
HITACHI S-4700
F.E.I.Quanta 200
HEWLETT PACKARD,Agilent HP 4062UX