Description
The RTP-800S system is an advanced, stand-alone rapid thermal processing system with multi-gas capabilities. The system processes wafers up to 8″ in diameter. The integrated process control system features real time graphics, recipe management, data acquisition and display and has a comprehensive diagnostic function.
Key Features:
- Easy to use
- Wide temperature range
- Accurate temperature control
- Close temperature uniformity
- Process repeatability
LEADING PARTICULARS
- Wafer Size: up to 8″
- Temperature Range: 250-1250 deg. C
- Ramp Rate: 0-150 deg. C/sec.
- Temperature Control Repeatability: +/-2 deg.C
- Temperature Accuracy: +/-2 deg. C
FEATURES
- Quartz processing chamber
- Quartz tray
- Four-layer Tungsten Halogen Lamp Array Heating
- Zone Control with unique lamp arrangement ensures highly uniform heating of up to 8″ Silicon Wafers or 6” GaAs Wafers with 8″ O.D. Susceptor
- Closed-loop temperature control algorithim with temperature control stability of +/-2 deg. C from set point.
- Extended Range Pyrometer Plus (ERP+) internally cooled pyrometer for extended temperature range from 350 – 1250 Degrees C
- Pyrometer auto-calibration feature provides accurate temperature measurement.
- An impressive list of software features.
- Up to 10 channels MFC control.
TEMPERATURE CONTROL
The RTP-800S System features a closed-loop temperature control algorithim with a temperature control stability of from +/-2 deg. C from set point. This feature greatly simplifies programming complex multi-step cycles. Software diagnostics are provided to monitor each lamp and compensate for lamp aging effects
TEMPERATURE MEASUREMENT
The temperature measurement techniques available for the RTP-800S system are thermocouple and pyrometer. The type K thermocouple is useful for low-temperature processing and calibrating the pyrometer. The Extended Range Pyrometer Plus (ERP+) internally cooled pyrometer can be used to measure wafer temperatures in the range of 350-1250 deg. C. (Actual range depends upon process, wafer type and system configuration.)
SOFTWARE
An integrated software package has been developed to control the RTP-800S System. The software modules interactively serve to integrate the various functions and operations of this system. Software features allow convenient recipe creation and editing. Process data may be collected during a run cycle and stored in a data file for later display and analysis. The process and recipe data files can be internally stored as DIF (Data Interchange Format) which can be imported into popular software packages such as Lotus 1-2-3, as a worksheet for display, plotting and further analysis.
SOFTWARE FEATURES
- Real-Time Process Control
- Real-Time Graphics Display
- Real-Time Process Data Collection
- Recipe Editor
- Recipe Validation
- Process Data File Management
- Process Data File Display and Analysis
- System Diagnostics
- System Configuration Utilities
Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing,JIPELEC, ag2146,JetClip,JetStar, AST SHS2000, AST STEAG 2800, ssintegration, Rapid Thermal Oxide,JetFirst ,Mattson, annealsys, heatpulse ,ag 2146,Koyo Thermo Systems,AST STEAG-MATTSON 2800, heat pulse, Solaris, Eclipse ,modularpro, RLA-1000, AG Heatpulse, rapid thermal processor, Steag AST SHS2000, Solaris 75, Solaris75,STEAG Electronic Systems ,eng-sol, Annealsys, RLA-3000, Engineering Solutions ，Solaris 150, Rapid Thermal Annealer , AS-Master ,modularpro,RTO ,Modular Process Technology, Solaris150,AS-One,AS-Micro.Modular Process Technology supplies advanced RTP process solutions with the industry’s highest productivity. The MODULAR One™ multi-chamber RTP system enables high capacity manufacturing of leading edge devices and sets a new standard of performance and reliability for 300mm or 200mm wafer processing. Modular Process Technology also supplies the RTP-3000, a production 300mm or 200mm RTP system, the RTP-3000autoloader, a production susceptor solution for the compound semiconductor sector, the RTP-800S for pilot production, the RTP-600S for process monitoring and process development, and the UV-RTP and UV stand alone systems which incorporate UV-Ozone processing capability. The following is a list of our products:Rapid Thermal Processing Production System: MODULAR One™ (200 mm);Rapid Thermal Processing System: RTP-3000 (300 mm or 200mm or 200mm w/Susceptor Autoloader) ; Rapid Thermal Processing System: RTP-800S (200 mm); Rapid Thermal Annealing System: RTP-600S (150 mm) ;UV-RTP System: UV-RTP-600 (150 mm);UV-OZONE Cleaning System: UV-600 (150 mm)
Modular Process Technology is a semiconductor equipment manufacturer of Rapid Thermal Processing Systems, hybrid UV-RTP systems, and stand alone UV Ozone Cleaning Systems. There are many unique features incorporated into our product lines which make our products attractive to advanced research and development and manufacturing. Modular Process Technology has in-depth experience in fundamental materials science research and process development. Our extensive process technology is reflected in the quality of our system design and integration.
