Description
SOLD. Please check other plasma asher equipment.
Please contact us for the availability of the PVA Tepla PS-210 used semiconductor equipment.
Microwave Plasma Surface Treatment Etch System. The Microwave Plasma System 210 is ideal for: Plasma surface modification. Plasma cleaning of organic surfaces. Bond strength enhancement. Plasma etch applications. Plasma asher applications. Increased or decreased wettability. Any other plasma system application.
Controller: Windows® O/S based touchscreen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided. Microwave Power. Display: Color 10.4-inch touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.
Quartz Chamber: 9.5 in. dia. x 9 in. Four process gas inputs. Previous Gases Used: O2, CF4, N2, AR. Includes vacuum pump. 230V, 1 Ph, 50/60 Hz, CE
The items are subject to prior sale without notice. These items are only for end users.
SS5626
