Refurbished Plasma Etch BT-1 Plasma Asher Plasma Etcher RIE Surface Treatment Semiconductor Equipment

SemiStar Corp. offers refurbished PlasmaEtch Plasma Etch BT-1 plasma asher, plasma etcher, RIE, and surface treatment semiconductor equipment for qualified end-user customers. We currently have one unit in stock.

The Plasma Etch BT-1 is a large-chamber industrial batch plasma processing system suitable for plasma cleaning, plasma etching, reactive ion etching, plasma ashing, surface activation, and batch wafer or substrate processing applications.

Photo is for reference only. Actual system configuration and appearance may vary.

System Description

The Plasma Etch BT-1 is an industrial-grade plasma asher, plasma etcher, and RIE semiconductor equipment platform designed for large-area batch plasma processing.

The system uses a spacious aluminum vacuum chamber with stacked horizontal processing tracks / shelves for batch wafer, substrate, PCB, electronics, solar, semiconductor, and industrial plasma processing applications.

This unit is offered in refurbished condition or complete, working, functional test condition depending on final customer requirements. Final condition, test scope, warranty, and included accessories should be confirmed before quotation and PO.

Configuration Capability

• Industrial batch plasma processing system
• Plasma asher, plasma etcher, RIE, and plasma surface treatment capability
• Large aluminum vacuum chamber
• Stacked horizontal shelf / track configuration
• Chamber Size: Approximately 25 inch W x 25 inch H x 22 inch D based on OEM BT-1 specification
• Electrode / Track Configuration: Five stacked horizontal electrodes, approximately 20 inch W x 21 inch D with approximately 3 inch clearance, based on OEM BT-1 specification
• 600 W, 13.56 MHz RF power supply with automatic matching network, depending on final configuration
• Touchscreen / PLC-based control interface, depending on final configuration
• Vacuum gauge and process pressure monitoring capability
• Process gas: O₂ and Ar gas lines
• Vacuum pump configuration to be confirmed before quotation

Applications

• Plasma etching
• Reactive ion etching / RIE
• Plasma ashing
• Photoresist stripping
• Plasma descum
• Plasma cleaning
• Surface activation
• Surface modification
• Organic contamination removal
• Polymer removal
• PCB plasma treatment
• Electronics and solar substrate processing
• Batch wafer / substrate processing
• Semiconductor R&D and production support

Typical Process Capability

Typical Plasma Etch BT-1 process capability may include plasma cleaning, plasma etching, RIE, plasma ashing, surface activation, surface modification, and batch substrate treatment.

• Process Type: Plasma cleaning, plasma etching, RIE, plasma ashing, descum, and surface treatment
• Loading: Batch loading using horizontal chamber tracks / shelves
• Chamber Material: 6061-T6 aluminum based on OEM BT-1 specification
• Vacuum Gauge Range: 1–2000 mT based on OEM BT-1 specification

Actual performance depends on final system configuration, substrate size, substrate material, process gas, sample loading, recipe, selected condition, and customer facility conditions.

Facility Requirements

Facility requirements should be confirmed before PO and may vary depending on the exact system configuration. Typical facility items may include:

• Power: 120/208 VAC, 50/60 Hz, 3 phase, 5 wire, approximately 30 A, based on OEM BT-1 specification
• Vacuum: Vacuum pump capability required
• Process Gases: Regulated process gases depending on plasma cleaning, ashing, etching, or RIE application
• CDA: Compressed air may be required depending on configuration
• Exhaust: Chamber and vacuum pump exhaust required
• Cooling: Cooling or chiller requirements depend on final configuration and pump / RF generator setup
• Dimensions / Weight: Approximately 70 inch W x 36 inch D x 32 inch H and approximately 1200 lb based on OEM BT-1 specification; final dimensions and weight to be confirmed before shipment
• Utilities: Final utility requirements to be confirmed with SemiStar before shipment
• Facility Responsibility: Customer is responsible for facility preparation, vacuum pumps, chillers or water temperature controllers if applicable, process gas supply, exhaust, CDA, power connection, and related facility support items unless otherwise specified in quotation.

RFQ Information Required

To help us confirm whether this Plasma Etch BT-1 system is suitable for your application and provide an accurate quotation, please provide the following information:

• End user company name and contact information
• Application: plasma cleaning, plasma etching, RIE, plasma ashing, descum, or surface treatment
• Substrate / wafer size
• Substrate material
• Quantity per run requirement
• Required process gases
• Process specifications and target results
• Throughput requirement
• Vacuum pump requirement or existing pump information
• Preferred condition: refurbished or complete, working, functional test condition
• Have you used Plasma Etch BT-1 or similar batch plasma equipment before? If yes, please provide model information.
• Budget range
• Purchase timeline
• Any special facility or installation requirements

Contact SemiStar

SS380-MSP-45