Description
Oxford Plasmalab uEtch 300
– Up to 12″/300mm Wafer Capable
– Adixen ATH 400HPC Turbo Pump
– HP Computer with Pentium Dual Core Processor
– Setup to etch SiO2, Nitrides, or Polymers
– Lower Platten: 380mm diameter (may be upgraded tp 460mm)
– Advanced Energy RFG 1251 RF generator (13.56MHz)
– Plasma mode: RIE/PE recipe controlled
– Wafer stage temperature control: Neslab RTE-7 chiller
– Gas Box: 6 gas Lines
– Gas Box with 6 MKS 1179A MFC”s installed
– MFC 1 Gas: CHF3, Range: 100 SCCM
– MFC 2 Gas: CF4, Range: 100 SCCM
– MFC 3 Gas: O2, Range: 50 SCCM
– MFC 4 Gas: AR, Range: 100 SCCM
– MFC 5 Gas: N2, Range: 100 SCCM
– MFC 6 Gas:C4F8, Range: 100 SCCM
-Chamber heating jacket 20-80C manual control
-300mm Graphite Wafer Holder
-Alcatel 2033C corrosive roughing pump
– CE Marked
– EMO Button
– Chamber Up/Down Selector Switch
– Hoist Up/Down Buttons
– Operations Manuals & System Restore Disk
– Serial Number: 219819
– System Power: 208V, 3ph, 50/60Hz, 20A
Please contact us if you are interested in the Oxford Plasmalab uEtch 300 System. We do not own the items. These items are only for end user. They are subject to prior sales without notice. First come, first serviced. Appreciate your time.
