Description
CVC 601 sputter deposition system
The CVC has :Advance Energy ID 3500 Ion Beam Drive, We have two: Advance energy MDX magnetron Drive (one in tool, and one
spare), CVC Scienctific Products KR1 and KR3 RF sputtering power supplies and matching networks
Here is the list of targets Al, Al+1%Si, Al+1%Si+4%Cu, Co, Cu, Mo, MoSi,Nb, Si, SiO2, Ta, Ti, TiW, W
Description:
A cryopumped CVC 601 sputter deposition system allows deposition of a variety of metals. A full target list is available below. Both RF and DC magnetron sputtering are available. Materials can be co- deposited from two sources onto the rotating substrate. Eight-inch sputtering targets are used, allowing batch depositions over 3-inch to 6-inch wafers. Smaller pieces are easily used.
Capabilities:
- RF magnetron and DC magnetron sources
- Substrate bias for bias sputtering
- Cryopumped to 8E-8 Torr
- Substrate ion beam cleaning station
- Capacity: 10 – 3 inch wafers, 8 – 6 inch wafers
- Mass flow control for Argon, Nitrogen, and Oxygen
