Allied Vision Technologies parts equipment
Please contact us if you are interested in the following Allied Vision Technologies parts equipment. These items are only for end users and are subject to sale without notice. Appreciate your time.
| Item | OEM Name | Part Number | Description |
| 1 | Allied Vision Technologies | Marlin F-046B IRF | Allied Vision Technologies Marlin F-046B IRF Digital Camera |
All used equipment /parts trademarks belongs to the original equipment manufacturer. All rights reserved.
Metrology | Tester | Wafer Carriers
Main Refurbished Equipment
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System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean,Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher,Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean,Gasonics AE 2001, Gasonics AE 2000LL,Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Plasma RIE ,Reactive Ion Etch System, Reactive Ion Etch System, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915,Tegal 701,Tegal 703,Tegal 801,Tegal 803,Tegal 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SeriesIn-line Systems,SIV SeriesSDH-4550LR&D,CS-200, 300mm,ENTRON-EXENTRON-EX2,Evaporation Roll Coater,EW SeriesR&D/Pilot Production,Ei-5In-line Systems,Ei-H series,Si Processing,IMX-3500SOPHI-200/260 ,SiC,IH-860,Brazing Furnace,FB SeriesFHHn series ,Vacuum Sintering,FSC ,eriesVacuum,Induction Melting,FMI Series,Vacuum Heat Treatment,FHB-60CFHV Series,Single-Substrate,CC Series,CME Series,In-line Systems, ULGLAZE Series,Lyophilizer,DFB Series,Micropowder Dry, UPD-400D,FM Series,DFR Series,Centrifugal Type,CEH-400B,ULVAC,Rapid Thermal Process, Modular Process Technology, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG 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GmbH, Rapid Thermal Anneling System, Mini MBE System,Growth System, Research Linear Transfer System,RTA System,UHV Shuttle System, SemiTEq JSC, Molecular-Beam Epitaxy Systems (MBE),PVD Systems,RTP & RTA Systems,ICP/RIE/PECVD Systems,Components and accessories, STE RTP150, STE RTA100, STE ICP200 , ADVANCE RIKO, Inc., RTP-mini, Atmospheric Thermoelectric Module Evaluation System F-PEM,Mini Lamp Annealer MILA-5050,infrared lamp heating system, ULTECH CO.LTD,Real RTP-100,Real RTP-100,Real RTP-150,Real RTP-Mini,SPUTTER,DRY ETCHER,PECVD,ALD,E beam evaporator,Thermal Evaporator, SJ High Technology ,Tube RTA,R-8160,drawer type RTA, R-401, Dai-ichi Kiden Co.,Ltd., Combustion furnace,High vacuum heating system,Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system, Koyo Thermo Systems Co.,Ltd., Premtek Technology Co， 技鼎股份有限公司，技鼎股份有限公司，VF-5900 300mm Large Batch,VF-5700 300mm Mini Batch,VF-5300,8 inch,Large Batch,VF-5100,8 inch,Wide-Range Batch,VF-3000,8 inch,Low-Cost Mini Batch,VF-1000,Small Production and R&D,VFS-4000,Large Bore Vertical Furnace,Koyo Thermo Systems Co.,Ltd.,Model 200 Series Horizontal Furnaces for Mass Production and Experiments,Model 206A Horizontal Furnace for PV Production ,Model 206A Horizontal Furnace for PV ,Production,RLA-3100 Lamp Annealing System for Rapid Thermal Processing,RLA-1200 Lamp Annealing System for Rapid Thermal Processing,RLA-1200 Lamp Annealing System for Rapid Thermal Processing,SO2-12-F Heated-air Circulating Type Clean Oven for 300-mm Wafers,CLH Series High-Temperature Clean Ovens,CLH Series High-Temperature Clean Ovens,VFS-4000 Large Bore Vertical Furnace,VF-5300HLP Activation Annealing Furnace,VF-5300H Vertical Furnace for Gate Insulating Film Formation,VF-5300H Vertical Furnace for Gate Insulating Film Formation,RLA-4106-V Lamp Annealing System for Contact Annealing,RLA-4106-V Lamp Annealing System for Contact Annealing,VF-3000HLP Activation Annealing Furnace, VF-3000HLP 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Equipment，Eaton Reliance 850，SOLARIS 100,SOLARIS 200,SOLARIS 150,SOLARIS 150UV,surface science integration, ssi-rtp,ecm-usa,Jipelec JetLight,Jipelec JetFirst 100,Jipelec JetFirst 200,Jipelec JetFirst 300,Jipelec JetStar,Annealsys AS-Micro,Annealsys AS-150,Annealsys AS-100,Annealsys AS-One,Annealsys AS-Master,Annealsys AS-Premium,Annealsys Zenith-100, unitemp, Vacuum Solder System , VSS-450-300 ,RTP-100,RTP-100-EP,RTP-100-HV,RTP-100-HV-EP,RTP-150,RTP-150-EP,RTP-150-HV,RTP-200,VPO-300,VPO-300-HV, hot plate HP-220,hot plate , VSS-450-300, RSO-200, RSO-300, RSS-210-S, RSS-160-S, RSS-110-S , ULVAC, Real RTP-100,Real RTP-150,Real RTP-Mini, SJ High Technology Company, ULTECH, Mattson,Helios XP, Helios C200,Millios,Aspen III,Aspen II,Alpine, Plasma Asher, Descum, Clean, Novyka, Selective Etch Systems, Surface Treatment Systems, Interface Treatment Systems, paradigmE, inductively coupled plasma, ICP, SUPREMA, plasma dry strip , Dry Strip, Plasma ETCH,Plasma ETCH,Surface Treatment ,Ultra-Selective Materials Removal, Rapid Thermal Processing, Millisecond Anneal, Steag-AST RTA,Steag,Mattson-Steag, STEAG 100CS,STEAG Electronic Systems,rapid thermal processing , clean process, CVD ,post-CMP-cleaning,AST 3000,STEAMpulse, high-temperature thin and thick oxides, post-dielectric deposition anneals, selective oxidation , low-temperature copper anneals,Poseidon Double Tank Tool, DTT, ritical cleaning , pre-gate oxidation, pre-epi, pre-furnace,RTP, STEAG AST Elektronik,STEAG / MATTSON / AST 100,STEAG / MATTSON / AST 2800,STEAG / MATTSON / AST 2800E, ,STEAG / MATTSON / AST 2900,Spare Parts, STEAG / MATTSON / AST 3000, STEAG / MATTSON / AST 3000 plus,STEAG / MATTSON / AST Atoms, STEAG / MATTSON / AST Helios, STEAG / MATTSON / AST Helios 6000,STEAG / MATTSON / AST SHS 10MA,STEAG / MATTSON / AST SHS 10MA, STEAG / MATTSON / AST SHS 2000,STEAG / MATTSON / AST SHS 2800, STEAG / MATTSON / AST,STEAG / MATTSON / AST SHS 2800E, STEAG / MATTSON / AST SHS 3000,AST Steag Mattson SHS 1000VAC, RTP, Rapid Thermal Processor,JTEKT Thermo Systems,Crystec Technology,RTP/RTA system RLA 1200, RTP/RTA system RLA 3100, RTP/RTA system RLA 3300, Unity 2900, 0.18-micron thermal processing system, Zhengzhou KJ Technology,High Vacuum RTP-Rapid Annealing Furnace,RTP infrared tube heating tube furnace,RTP rapid annealing furnace,Custom RTP tube furnace,1200℃ RTP Annealing Tube Furnace with Slide-able Quartz Tube,Touch screen RTP rapid annealing furnace,900℃ Two Zone IR-Heating RTP Tube Furnace,900℃ RTP tube furnace with multi-channel proton flowmeter control system,1200℃ Crucible Movable Tube Furnace,Compact Atmosphere Controlled RTP Furnace with 4＂ ID Quartz Tube up to 1100ºC,900℃ Max Slideable RTP Tube Furnace,MATTSON AST Steag 2800,MATTSON AST Steag 2900,MATTSON AST Steag 3000,Steag RTP Systems, Steag Heatpulse 610,Applied Materials,Centura DPN HD,Producer Pyra Anneal,Vantage Astra DSA,Vantage RadOx RTP,Vantage Radiance Plus RTP,Steam oxidation,Applied Materials Centura RTP,Producer Pyra Anneal,radical oxidation,millisecond annealing,model-based controller,Vantage Vulcan RTP,SEMATECH Methodologies , 0.25 m Technology Thermal Applications,firstnano,EasyTube 2000,EasyTube 3000,EasyTube 3000EXT,EasyTube 101,EasyTube 6000, EasyTube 6308, Applied Materials Vantage RadiancePlus, AMAT Vantage RadiancePlus,Vantage RadiancePlus, 0.25 pm TECHNOLOGY,Lamp-based,Laser-based,Heater-based,irradiate the surface of the material,Veeco,Mattson Technology,Screen Holdings,AnnealSys,Applied Materials,Kokusai Electric,JTEKT Thermo Systems,Tokyo Electron,Centrotherm,Hitachi Kokusai Electric,Modular Process Technology,Shankar Muthukrishnan,Beyond the 100nm node, single-wafer RTP,single-wafer rapid thermal Processing, sub-100nm device design node,ultra-shallow junction activation and anneal,USJ, silicide contact formation, thermal oxidation STI formation, spike anneal ,spike annealing, within-wafer uniformity, wafer-to-wafer process uniformity, nickel silicide formation,radical-based oxidation process,rapid thermal processing spike anneal,300mm RTP spike anneal process,ramp-up methodologies, rampdown methodologies,Rapid thermal annealing apparatus,RTA furnace,Dai-ichi Kiden,Dai-ichi Kiden RSA, Combustion furnace, High vacuum heating system, Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system,CreaTec Fischer,Growth Systems,Mini MBE System,LT-STM/AFM,Evaporators,Centrotherm,centrotherm c.HORICOO 300 ,horizontal batch-type system,centrotherm c.HORICOO 200 , field-proven , ultra-versatile tube furnace system ,centrotherm c.VERTICOO , batch-type wafer processing , semiconductor device fabrication, atmospheric processes, LPCVD processes,centrotherm c.ACTIVATOR, high-temperature annealing, high-volume SiC device manufacturing, electrical activation , post implantation annealing ,SiC MOSFET , diode manufacturing,Cost-efficient dopant activation,Annealing of AlN seed layers , Annealing of AlN epitaxial layers,centrotherm c.OXIDATOR , high-temperature oxidation furnace , Rapid Thermal Processing system for silicon and compound semiconductors,c.RAPID 200,fully automatic loading system,centrotherm PECVD,c.PLASMA, c.DIFF,centrotherm highly versatile diffusion,wide band gap,c.CRYSCOO HTA,AP Systems,AP Systems Korea,KORONA RTP-12MP, KORONA RTP-12LPO , KORONA RTP-12LR/LPRR,Seebeck Coefficient / Electric Resistance Measurement System ZEM-3 series，Mini Lamp Annealer MILA-5050， Atmospheric Thermoelectric Module Evaluation System F-PEM，
