Varian 3290 Sputtering Deposition System

Varian 3290 Sputtering Deposition System. The 3290 system utilizes an innovative dual cathode magnetron sputtering source to provide excellent control of film thickness and uniformity on six-inch wafers. INDIVIDUAL WAFER PROCESSING. The 3290 processes waters individually with a fixed wafer-to-source geometry during all process steps. This assures excellent wafer-to-wafer repeatability. Only the wafer itself is introduced into the deposition chamber, maximizing system cleanliness. CASSETTE-TO-CASSETTE WAFER HANDLING. Wafers are automatically removed from the cassette, processed serially and replaced in the same cassette by a patented wafer handling system. Each wafer is held vertically throughout all process steps to minimize contamination and enhance yields. The 3290 system sets the pace for state-of-the-art wafer sputtering. This new system is based upon the widely accepted and field-proven design of the acclaimed 3280. It provides significant improvements for even greater performance and reliability.