Description
Matrix 105 Plasma Asher / Stripper / Descum
Matrix System One Stripper 105
The Matrix 105 Plasma Asher uses oxygen, plasma, and heat to remove photoresist on silicon, GaAs and other substrates. It can also be used to removed photoresist residue after development (descum). The Matrix 105 can process up to 6″ wafers, or pieces of wafers using special fixtures.
- Single wafer, single cassette, robotic asher and etcher
- Menu-driven microprocessor / controller
- Multi-step programming (three steps + over etch)
- Wafer pin lift assembly (up/down)
- Two mass flow controllers
- Wafer size range: 3-6 inch / 75-150 mm
- RF power supply: 600W, 13.56MHz, water-cooled
- Ash/Strip temperature range: 70-250°C
- Descum temperature range: 70-150°C
- Recipe cards included
SS331797264962