Description
Used semiconductor equipment Pump Chiller. These are only for end user. They are subject to prior sale without notice. Appreciate your time.
| Asset ID | Manufacturer | Model | Asset Type | Wafer Size |
| 1 | A-B Lasers Inc. (Rofin) | Waferlase Compact | Laser Scribe | 200mm |
| 2 | A-B Lasers Inc. (Rofin) | Waferlase | Laser Scribe | 200mm |
| 3 | Accretech/TSK | UF3000 | Production Wafer Prober | 300mm |
| 4 | Accretech/TSK | UF3000 | Production Wafer Prober | 300mm |
| 5 | Accretech/TSK | UF3000 | Production Wafer Prober | 300mm |
| 6 | Accretech/TSK | UF3000 | Production Wafer Prober | 300mm |
| 7 | Accretech/TSK | UF3000EX | Production Wafer Prober | 300mm |
| 8 | Accretech/TSK | UF300A | Production Wafer Prober | 300mm |
| 9 | Accretech/TSK | UF3000EX | Production Wafer Prober | 300mm |
| 10 | Accretech/TSK | UF3000EX | Production Wafer Prober | 300mm |
| 11 | Accretech/TSK | UF3000EX | Production Wafer Prober | 300mm |
| 12 | Accretech/TSK | UF3000 | Production Wafer Prober | 300mm |
| 13 | Accretech/TSK | UF3000 | Production Wafer Prober | 300mm |
| 14 | ADE Corporation | AFS-3220 | Wafer Characterization | 300mm |
| 15 | ADE Corporation | Microsense 6033 | Wafer Characterization | |
| 16 | Advanced Energy | ICP 20P | Power Supply | N/A |
| 17 | Advanced Thermal Sciences (ATS) | DEX-20A | Chiller/Heat Exchanger | N/A |
| 18 | Advantest | T5377 | Memory Tester | |
| 19 | Advantest | T5377 | Memory Tester | 300mm |
| 20 | Advantest | T5585 | Memory Tester | |
| 21 | Advantest | T5585 | Memory Tester | |
| 22 | Advantest | T5585 | Memory Tester | |
| 23 | Advantest | T5585 | Memory Tester | |
| 24 | Advantest | R3768 | Network Analyzer | N/A |
| 25 | Air Control, Inc. | Microvoid FH-45D-S | Fume Hood Workstation | N/A |
| 26 | Airgard | Cyclone | Abatement – Exhaust Management System | N/A |
| 27 | Alcatel | ADP 81 | Dry Pump | N/A |
| 28 | Alcatel | A1803H | Dry Pump | N/A |
| 29 | Alcatel | ADS 1802H | Dry Pump | N/A |
| 30 | Alcatel | ADS1802P | Dry Pump | N/A |
| 31 | Alcatel | A1803H | Dry Pump | N/A |
| 32 | Amray, Inc. | 3800c | SEM – Defect Review (DR) | 200mm |
| 33 | Amray, Inc. | 2030 | SEM – Defect Review (DR) | N/A |
| 34 | Anelva Corp. | Cosmos I-1201 PVD – Tungsten PVD Chamber Only | PVD (Physical Vapor Deposition) | |
| 35 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch | 300mm |
| 36 | Applied Materials (AMAT) | Centura AP DPS II Metal | Metal Etch | 300mm |
| 37 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch | 300mm |
| 38 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 39 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch | 300mm |
| 40 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch | 300mm |
| 41 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Minos Poly | Polysilicon Etch | 300mm |
| 42 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | 300mm |
| 43 | Applied Materials (AMAT) | Endura II Chamber: Extensa TTN Ta | PVD (Physical Vapor Deposition) | 300mm |
| 44 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | 300mm |
| 45 | Applied Materials (AMAT) | Centura AP iSprint | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 46 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | 300mm |
| 47 | Applied Materials (AMAT) | Producer Etch XT Dielectric | Dielectric Etch | 300mm |
| 48 | Applied Materials (AMAT) | Producer Etch XT Dielectric | Dielectric Etch | 300mm |
| 49 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch | 300mm |
| 50 | Applied Materials (AMAT) | Producer SE SACVD | SACVD (Chemical Vapor Deposition) | 300mm |
| 51 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) | 300mm |
| 52 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 53 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 54 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch | 300mm |
| 55 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch | 300mm |
| 56 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | 300mm |
| 57 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | 300mm |
| 58 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | 300mm |
| 59 | Applied Materials (AMAT) | Endura II Chamber: Ventura Cu | PVD (Physical Vapor Deposition) | 300mm |
| 60 | Applied Materials (AMAT) | Endura II Chamber: Ventura Cu | PVD (Physical Vapor Deposition) | 300mm |
| 61 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | 300mm |
| 62 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | 300mm |
| 63 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | 300mm |
| 64 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | |
| 65 | Applied Materials (AMAT) | Producer Etch eXT Poly | Polysilicon Etch | 300mm |
| 66 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 67 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) | 300mm |
| 68 | Applied Materials (AMAT) | Centris AdvantEdge G5 Mesa Poly | Polysilicon Etch | 300mm |
| 69 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 70 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch | |
| 71 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | |
| 72 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | |
| 73 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) | 300mm |
| 74 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) | |
| 75 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | |
| 76 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | 300mm |
| 77 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 78 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 79 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | 300mm |
| 80 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | 300mm |
| 81 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | 300mm |
| 82 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | 300mm |
| 83 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing | 300mm |
| 84 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing | 300mm |
| 85 | Applied Materials (AMAT) | Oasis Clean | Batch Wafer Processing | 300mm |
| 86 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 87 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 88 | Applied Materials (AMAT) | Producer GT APFe | PECVD (Chemical Vapor Deposition) | 300mm |
| 89 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | 300mm |
| 90 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly – Chamber Only | Polysilicon Etch | |
| 91 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 92 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | |
| 93 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | |
| 94 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | |
| 95 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | |
| 96 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | |
| 97 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) | |
| 98 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch | 300mm |
| 99 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) | |
| 100 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | |
| 101 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | 300mm |
| 102 | Applied Materials (AMAT) | Producer GT APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 103 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch | 300mm |
| 104 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 105 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 106 | Applied Materials (AMAT) | Producer SE SACVD | SACVD (Chemical Vapor Deposition) | 300mm |
| 107 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 108 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly – Chamber Only | Polysilicon Etch | 300mm |
| 109 | Applied Materials (AMAT) | Producer SE PECVD SILANE | PECVD (Chemical Vapor Deposition) | 300mm |
| 110 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 111 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch | 300mm |
| 112 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 113 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch | 300mm |
| 114 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) | 300mm |
| 115 | Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) | |
| 116 | Applied Materials (AMAT) | Reflexion LK | Multi-Process CMP | 300mm |
| 117 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Poly | Polysilicon Etch | 300mm |
| 118 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | 300mm |
| 119 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch | 300mm |
| 120 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) | 300mm |
| 121 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP | 300mm |
| 122 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | 300mm |
| 123 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch | 300mm |
| 124 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) | 300mm |
| 125 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) | 300mm |
| 126 | Applied Materials (AMAT) | Producer GT PECVD TEOS | PECVD (Chemical Vapor Deposition) | 300mm |
| 127 | Applied Materials (AMAT) | Reflexion LK Oxide | Dielectric CMP | 300mm |
| 128 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) | 300mm |
| 129 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch | 300mm |
| 130 | Applied Materials (AMAT) | Reflexion LK Copper | Copper CMP | 300mm |
| 131 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Metal | Metal Etch | 300mm |
| 132 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 133 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) | 300mm |
| 134 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) | 300mm |
| 135 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) | 300mm |
| 136 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 137 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 138 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 139 | ASM International | A412 Doped Poly | Vertical Furnace | 300mm |
| 140 | ASM International | Eagle XP EmerALD | ALD (Atomic Layer Deposition) | 300mm |
| 141 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) | 300mm |
| 142 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 143 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) | 300mm |
| 144 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) | |
| 145 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) | 300mm |
| 146 | ASM International | Eagle XP4 | ALD (Atomic Layer Deposition) | |
| 147 | ASM International | Eagle XP4 | ALD (Atomic Layer Deposition) | 300mm |
| 148 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 149 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 150 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 151 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 300mm |
| 152 | ASML | YieldStar S-100B | Overlay Measurement System | 300mm |
| 153 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace | 300mm |
| 154 | BOC Edwards | Spectra-N | Nitrogen Generator | N/A |
| 155 | Bold Technologies, Inc. | Bold Wet Bench | Batch Wafer Processing | 200mm |
| 156 | Brooks Automation, Inc. | MTX2000 | Wafer Sorter | 300mm |
| 157 | Brooks Automation, Inc. | MTX 4020 | Wafer Sorter | 300mm |
| 158 | Brooks Automation, Inc. | MTX 4020 | Wafer Sorter | 300mm |
| 159 | Brooks Automation, Inc. | MTX2000 | Wafer Sorter | 300mm |
| 160 | Brooks Automation, Inc. | MTX2000 | Wafer Sorter | 300mm |
| 161 | CAMECA | EX-300 | Implant Dosing Measurement | 300mm |
| 162 | Canon | Surpass 320 | Stripper/Asher | 300mm |
| 163 | Canon | Surpass 320 | Stripper/Asher | 300mm |
| 164 | Canon | FPA-6000 ES5 | 248nm (KrF) Scanner | 300mm |
| 165 | Canon | Surpass 300 | Stripper/Asher | 300mm |
| 166 | Canon | Surpass 300 | Stripper/Asher | 300mm |
| 167 | Canon | FPA-5500 iZa | i-Line Wide-Field Stepper | 300mm |
| 168 | Carl Zeiss Group | Axiotron 300 | Microscope | 300mm |
| 169 | Cascade | S300 | Engineering Wafer Prober | 300mm |
| 170 | Chroma ATE Inc. | 3380P | VLSI Tester | 200mm |
| 171 | COMCO INC | LA3250 | Lathe | N/A |
| 172 | Control Laser Corporation. | FALIT | Package Auto Decap System | |
| 173 | Cooljag Thermal Solutions | SP3-D/SQ | CPU Cooling Fan | N/A |
| 174 | Dage Precision Industries | 4000 | Bond / Wire Pull Tester | N/A |
| 175 | Dainippon Screen Mfg. Co. (DNS) | FC-3100 | Batch Wafer Processing | 300mm |
| 176 | Dainippon Screen Mfg. Co. (DNS) | SS-3000-AR | Wafer Scrubber | 300mm |
| 177 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | 300mm |
| 178 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | 300mm |
| 179 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | 300mm |
| 180 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | 300mm |
| 181 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing | 300mm |
| 182 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | |
| 183 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 184 | Dainippon Screen Mfg. Co. (DNS) | SU-3200 | Single Wafer Processing | 300mm |
| 185 | Dainippon Screen Mfg. Co. (DNS) | SS-3200 | Wafer Scrubber | 300mm |
| 186 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing | 300mm |
| 187 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing | 300mm |
| 188 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing | 300mm |
| 189 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing | 300mm |
| 190 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing | 300mm |
| 191 | Dainippon Screen Mfg. Co. (DNS) | SU-3100 | Single Wafer Processing | 300mm |
| 192 | Dainippon Screen Mfg. Co. (DNS) | FC-3100 | Batch Wafer Processing | 300mm |
| 193 | Dainippon Screen Mfg. Co. (DNS) | VM-3110 | Film Thickness Measurement System | 300mm |
| 194 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 195 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 196 | Dainippon Screen Mfg. Co. (DNS) | VM-3110 | Film Thickness Measurement System | 300mm |
| 197 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 198 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing | |
| 199 | Dainippon Screen Mfg. Co. (DNS) | VM-3110 | Film Thickness Measurement System | |
| 200 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | |
| 201 | Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) | 200mm |
| 202 | Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) | 200mm |
| 203 | Dainippon Screen Mfg. Co. (DNS) | WS-820C | Batch Wafer Processing | 200mm |
| 204 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | 200mm |
| 205 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | 200mm |
| 206 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | 200mm |
| 207 | Dainippon Screen Mfg. Co. (DNS) | FS-820L | Batch Wafer Processing | 200mm |
| 208 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 209 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 210 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 211 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 212 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber | 300mm |
| 213 | DAS | ESCAPE DUO | Chemical/Gas Treatment System | N/A |
| 214 | DAS | ESCAPE DUO | Chemical/Gas Treatment System | N/A |
| 215 | Despatch Industries | LND 2-11 | Cure Oven | N/A |
| 216 | Disco Hi-Tec | DFD6361 | Wafer Dicing Saw | 300mm |
| 217 | E.A. Fischione | 1010 | Plasma Cleaner | |
| 218 | Ebara | FREX300S2 | Multi-Process CMP | 300mm |
| 219 | Ebara | FREX300S2 | Multi-Process CMP | 300mm |
| 220 | Ebara | FREX300 Tungsten | Tungsten CMP | 300mm |
| 221 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm |
| 222 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm |
| 223 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm |
| 224 | Ebara | FREX300 Tungsten | Tungsten CMP | 300mm |
| 225 | Ebara | FREX300S Tungsten | Tungsten CMP | |
| 226 | Ebara | FREX300S Tungsten | Tungsten CMP | |
| 227 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm |
| 228 | Ebara | FREX300S Dielectric | Dielectric CMP | 300mm |
| 229 | Edwards | HMB3000 | Booster of dry pump | N/A |
| 230 | Edwards | Atlas TPU+WESP | Abatement – Scrubber | N/A |
| 231 | Edwards | QDP40 | Dry Pump | N/A |
| 232 | Edwards | Atlas Etch | Abatement – Scrubber | N/A |
| 233 | Edwards | iL70 | Dry Pump | N/A |
| 234 | Edwards | iH80 | Dry Pump | N/A |
| 235 | Edwards | iH1800SC | Dry Pump | N/A |
| 236 | Edwards | iH1000 | Dry Pump | N/A |
| 237 | Edwards | iH600 | Dry Pump | N/A |
| 238 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System | |
| 239 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System | |
| 240 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System | |
| 241 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System | |
| 242 | Electro Scientific Industries | 9850TPIR+ | Laser Repair System | |
| 243 | Entegris | NU-J6101 | Batch Parts Clean (ultrasonic) | 300mm |
| 244 | Entegris | NU-J6101 | Batch Parts Clean (ultrasonic) | |
| 245 | Entegris | KA198-80M | Wafer Cassette | 200mm |
| 246 | ESCO Ltd. | EMD-WA1000S | Temperature Desorption Analyzer | 200mm |
| 247 | Espec | IPHH-201 | Environmental Chamber | N/A |
| 248 | Espec | IPHH-201 | Environmental Chamber | N/A |
| 249 | Espec | EGNU28-12CWL | Environmental Chamber | N/A |
| 250 | Espec | ESX-3CW | Environmental Chamber | N/A |
| 251 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | 200mm |
| 252 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | 200mm |
| 253 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | 200mm |
| 254 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | 200mm |
| 255 | Estek Automation SDN BHD | WIS-900 | Broadband Patterned Wafer Defect Inspection | 200mm |
| 256 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | 200mm |
| 257 | Estek Automation SDN BHD | WIS-800D | Broadband Patterned Wafer Defect Inspection | 200mm |
| 258 | Estek Automation SDN BHD | WIS-600B | Broadband Patterned Wafer Defect Inspection | 200mm |
| 259 | EVGA Corporation | Supernova 1300 G2 | PC Power Supplies | N/A |
| 260 | EVGA Corporation | 850 GQ | PC Power Supplies | N/A |
| 261 | FEI Company | Tecnai G2 F30 | TEM | N/A |
| 262 | FSI International | Zeta 300 G3 | Batch Wafer Processing | 300mm |
| 263 | FSI International | Excalibur | Batch Wafer Processing | 200mm |
| 264 | FSM | 900TC-VAC | Stress Measurement | 300mm |
| 265 | FTS Systems (SP Scientific) | RC311GLAM | Chiller/Heat Exchanger | N/A |
| 266 | Gatan | Model 691 PIPS | Specimen Preparation | N/A |
| 267 | GCA Tropel | Autosort Mark II 150 | Flatness Measurement | 150mm |
| 268 | General Electric (GE) | Phoenix aminer | X-ray Inspection | |
| 269 | GSI Lumonics | WaferMark 200HS | Laser Scribe | 200mm |
| 270 | Hitachi | RCF3550AZP1 | Chiller/Heat Exchanger | N/A |
| 271 | Hitachi (Semiconductor) | U-7050A | Metal Etch | 300mm |
| 272 | Hitachi (Semiconductor) | U-7050A | Metal Etch | 300mm |
| 273 | Hitachi (Semiconductor) | HL-800D | E-beam Lithography System | |
| 274 | Hitachi (Semiconductor) | U-702 | Metal Etch | 300mm |
| 275 | Hitachi (Semiconductor) | U-702 | Metal Etch | 300mm |
| 276 | Hitachi Kokusai Electric Inc. (HiKE / KSEC) | Aldinna | ALD (Atomic Layer Deposition) | 300mm |
| 277 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | 300mm |
| 278 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | 300mm |
| 279 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | 300mm |
| 280 | HSEB Dresden GMBH / Carl Zeiss | Axiospect 300 | Optical Review System | 300mm |
| 281 | IPEC | AvantGaard 676 | Multi-Process CMP | 200mm |
| 282 | Jabil Chad Automation | WaferMate200 | Wafer and Substrate Handling | 200mm |
| 283 | Jabil Chad Automation | WaferMate200 | Wafer and Substrate Handling | |
| 284 | JEOL | JWS-7555 | SEM – Defect Review (DR) | 200mm |
| 285 | JEOL | JFS-9855S | Focused Ion Beam System | 200mm |
| 286 | Jordan Valley Semiconductors LTD | JVX 7200 | X-ray Fluorescence Spectrometer | 300mm |
| 287 | JULABO GmbH | PRESTO W85 | Chiller/Heat Exchanger | N/A |
| 288 | Kaijo Corporation | SFT-300 | Batch Wafer Processing | |
| 289 | Kaijo Corporation | SFT-300 | Batch Wafer Processing | |
| 290 | Keysight / Agilent / Hewlett-Packard (HP) | 41000 | Parametric Tester | N/A |
| 291 | Keysight / Agilent / Hewlett-Packard (HP) | 4284A | LCR & Resistance Meter | |
| 292 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester | N/A |
| 293 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester | N/A |
| 294 | Keysight / Agilent / Hewlett-Packard (HP) | 4073A | Parametric Tester | N/A |
| 295 | KLA-Tencor Corp. | KLA-TENCOR DUAL SMIF HANDLER | Parts/Options | 200mm |
| 296 | KLA-Tencor Corp. | KLA-TENCOR DUAL SMIF HANDLER | Parts/Options | 200mm |
| 297 | KLA-Tencor Corp. | eS20XP | E-beam Inspection | 200mm |
| 298 | KLA-Tencor Corp. | eS37 | E-beam Inspection | 300mm |
| 299 | KLA-Tencor Corp. | WaferSight | Wafer Characterization | 300mm |
| 300 | KLA-Tencor Corp. | AIT UV | Darkfield Inspection | 300mm |
| 301 | KLA-Tencor Corp. | SpectraShape 8660 | Optical Review System | 300mm |
| 302 | KLA-Tencor Corp. | eS805 | E-beam Inspection | 300mm |
| 303 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) | 300mm |
| 304 | KLA-Tencor Corp. | eDR-5210 | SEM – Defect Review (DR) | 300mm |
| 305 | KLA-Tencor Corp. | ASET-F5x | Film Thickness Measurement System | 300mm |
| 306 | KLA-Tencor Corp. | Ultrapointe 1000 | Optical Review System | 200mm |
| 307 | KLA-Tencor Corp. | KLA-TENCOR DUAL OPEN HANDLER | Parts/Options | 200mm |
| 308 | KLA-Tencor Corp. | eS32 | E-beam Inspection | 300mm |
| 309 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace | 300mm |
| 310 | Kokusai | Quixace II Nitride | Vertical Furnace | 300mm |
| 311 | Kokusai | Quixace II ALD Oxide | Vertical Furnace | 300mm |
| 312 | Kokusai | Quixace II TEOS | Vertical Furnace | 300mm |
| 313 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 314 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 315 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 316 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 317 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 318 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 319 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 320 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 321 | Kokusai | ZESTONE POLY | Vertical Furnace | 300mm |
| 322 | Kokusai | Quixace II Nitride | Vertical Furnace | 300mm |
| 323 | Kokusai | Quixace Ultimate ALD SiN | Vertical Furnace | 300mm |
| 324 | Kokusai | Quixace II ALD Nitride | Vertical Furnace | 300mm |
| 325 | Kokusai | Quixace II ALD Nitride | Vertical Furnace | 300mm |
| 326 | Kokusai | Quixace II ALD Nitride | Vertical Furnace | 300mm |
| 327 | Kokusai | Quixace II CURE | Vertical Furnace | 300mm |
| 328 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace | 300mm |
| 329 | Kokusai | Quixace II Poly | Vertical Furnace | 300mm |
| 330 | Kokusai | Quixace II Poly | Vertical Furnace | 300mm |
| 331 | Kokusai | Quixace Nitride | Vertical Furnace | 300mm |
| 332 | Kokusai | Quixace II Poly | Vertical Furnace | 300mm |
| 333 | Kokusai | Quixace II Poly | Vertical Furnace | 300mm |
| 334 | Kokusai | Quixace II Poly | Vertical Furnace | 300mm |
| 335 | Kokusai | Quixace II Poly | Vertical Furnace | 300mm |
| 336 | Kokusai | Quixace Ultimate ALD SiO2 | Vertical Furnace | 300mm |
| 337 | Kokusai | Quixace II Doped Poly | Vertical Furnace | 300mm |
| 338 | Kokusai | Quixace II Doped Poly | Vertical Furnace | 300mm |
| 339 | Kokusai | Quixace II Doped Poly | Vertical Furnace | 300mm |
| 340 | Kokusai | Quixace II Nitride | Vertical Furnace | 300mm |
| 341 | Kokusai | Quixace II Nitride | Vertical Furnace | 300mm |
| 342 | Kokusai | Zestone-III(C) DJ-1223V | Vertical Furnace | 300mm |
| 343 | LAM Research | 2300 Exelan Flex | Dielectric Etch | 300mm |
| 344 | LAM Research | 2300 Exelan Flex EX | Dielectric Etch | 300mm |
| 345 | LAM Research | 2300 Exelan Flex EX | Dielectric Etch | 300mm |
| 346 | LAM Research | 2300 Exelan Flex EX+ – Chamber Only | Dielectric Etch | 300mm |
| 347 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch | 300mm |
| 348 | LAM Research | 2300 Exelan Flex | Dielectric Etch | 300mm |
| 349 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch | 300mm |
| 350 | LAM Research | 2300 Exelan Flex | Dielectric Etch | 300mm |
| 351 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch | 300mm |
| 352 | Lam Research | EOS | Single Wafer Processing | 300mm |
| 353 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma | |
| 354 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch | |
| 355 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch | |
| 356 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch | 300mm |
| 357 | LAM Research | 2300 Exelan Flex EX | Dielectric Etch | 300mm |
| 358 | LAM Research | 2300e5 Exelan Flex EX | Dielectric Etch | |
| 359 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma | 300mm |
| 360 | LAM Research | 2300 Coronus | Wafer Edge Cleaning – Plasma | 300mm |
| 361 | LAM Research | 2300 Exelan Flex | Dielectric Etch | 300mm |
| 362 | LAM Research | 2300 Versys KIYO Poly | Polysilicon Etch | 300mm |
| 363 | LAM Research | 2300 Exelan Flex | Dielectric Etch | 300mm |
| 364 | LAM Research | 2300 Exelan Flex 45 | Dielectric Etch | 300mm |
| 365 | Lam Research | EOS | Single Wafer Processing | 300mm |
| 366 | Leica Inc. | INS10 | Microscope | 200mm |
| 367 | Mattson Technology, Inc. | Helios | Standalone RTP Equipment | 300mm |
| 368 | Mattson Technology, Inc. | Aspen III ICP | Stripper/Asher | 300mm |
| 369 | Mattson Technology, Inc. | Aspen III ICP | Stripper/Asher | 300mm |
| 370 | Micromanipulator | P300J | Engineering Wafer Prober | 200mm |
| 371 | MicroTure Machine Tool Corp. | 4 Sigma Wafer Polisher | Wafer Polisher | 200mm |
| 372 | Micro-Vu | VERTEX 420 | Confocal Vision System | N/A |
| 373 | miscellaneous furniture | Office Tables and Chairs | Office | N/A |
| 374 | Mitsubishi | DWC-90 | Wire EDM (Electrical Discharge Machine) | N/A |
| 375 | MPI Corporation | LEDA P6801 | LED Die Prober | 200mm |
| 376 | MSI | N210-MD1G/D3 | Graphics Cards | N/A |
| 377 | MSI | GT 710-1GD3H LP | Graphics Cards | N/A |
| 378 | Muratec Murata Machinery, Ltd. | SRC330 | Wafer Stocker | 300mm |
| 379 | Nicolet | ECO 3000 | FT-IR | 300mm |
| 380 | Nikon | OPTIPHOT 200C | Microscope | 200mm |
| 381 | Nikon | AMI-3500 | Macro-Defect | 300mm |
| 382 | Nikon | OPTIPHOT 200C | Microscope | 200mm |
| 383 | Nikon | ECLIPSE L300N | Microscope | |
| 384 | Nikon | ECLIPSE L300N | Microscope | |
| 385 | Nikon | ECLIPSE L300N | Microscope | |
| 386 | Nikon | ECLIPSE L300N | Microscope | |
| 387 | Nikon | ECLIPSE L300N | Microscope | |
| 388 | Nikon | ECLIPSE L300N | Microscope | |
| 389 | Nikon | MICROSCOPE | Microscope | |
| 390 | Nikon | UM-2 | Microscope | |
| 391 | Nikon | OPTISTATION V | Optical Review System | 200mm |
| 392 | Nikon | OPTISTATION V | Optical Review System | 200mm |
| 393 | Nova Measuring Instruments, Inc. (Brook) | V2600 | Integrated CMP Endpoint / Film Measurement | 300mm |
| 394 | Novellus Systems Inc. | VECTOR Express – AHM | PECVD (Chemical Vapor Deposition) | 300mm |
| 395 | Novellus Systems Inc. | VECTOR SOLA UV Cure | PECVD (Chemical Vapor Deposition) | 300mm |
| 396 | Novellus Systems Inc. | VECTOR Express – PECVD TEOS | PECVD (Chemical Vapor Deposition) | 300mm |
| 397 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher | 300mm |
| 398 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher | 300mm |
| 399 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher | 300mm |
| 400 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher | 300mm |
| 401 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher | 300mm |
| 402 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher | 300mm |
| 403 | Novellus Systems Inc. | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) | 300mm |
| 404 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) | 300mm |
| 405 | Novellus Systems Inc. | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) | 300mm |
| 406 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) | 300mm |
| 407 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) | 300mm |
| 408 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) | 300mm |
| 409 | Novellus Systems Inc. | Concept Three Speed MAX | HDP CVD (Chemical Vapor Deposition) | 300mm |
| 410 | NPC incorporated | EL Inspection Machine | EL/PL Inspection | |
| 411 | Orient Service | 1862-WA | Chemical/Gas Treatment System | N/A |
| 412 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher | 300mm |
| 413 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher | 300mm |
| 414 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher | 300mm |
| 415 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher | 300mm |
| 416 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher | 300mm |
| 417 | Pfeiffer Vacuum GmbH | Various | Dry Pump | N/A |
| 418 | Philips / Technos | PW2830 | X-ray Fluorescence Spectrometer | 300mm |
| 419 | Philips / Technos | TREX 632 | X-ray Fluorescence Spectrometer | 300mm |
| 420 | Plasma-Therm I.P. Inc. | BatchTop VII PECVD | PECVD (Chemical Vapor Deposition) | 150mm |
| 421 | PVA TePla America, Inc. | M4L | Plasma Cleaner | N/A |
| 422 | R. Howard Strasbaugh | Fine Polisher | Wafer Polisher | 200mm |
| 423 | Raytex Corporation | RXW-1227 EdgeScan | Edge Defect | 300mm |
| 424 | RECIF Technologies | SPP300 | Wafer Sorter | 300mm |
| 425 | ReVera | RVX1000 | Film Thickness Measurement System | 300mm |
| 426 | ReVera | RVX1000 | Film Thickness Measurement System | 300mm |
| 427 | Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger | N/A |
| 428 | Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger | N/A |
| 429 | Robert Burkle GmbH | YPSATOR 2022-5S | Cooling Press | |
| 430 | Robert Burkle GmbH | YPSATOR 2022-5S | Cooling Press | |
| 431 | Robert Burkle GmbH | RCF-12M1800 | Roller Coater | |
| 432 | Rorze | RSC222 | Wafer Sorter | 300mm |
| 433 | Rorze | RSC222 | Wafer Sorter | 300mm |
| 434 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect | 300mm |
| 435 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect | 300mm |
| 436 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect | 300mm |
| 437 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect | 300mm |
| 438 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect | 300mm |
| 439 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect | 300mm |
| 440 | Rudolph Technologies, Inc. | MetaPULSE 300 | Film Thickness Measurement System | |
| 441 | S.E.S. CO., LTD. | BW3000X | Batch Wafer Processing | 300mm |
| 442 | S.E.S. CO., LTD. | BW3000X | Batch Wafer Processing | 300mm |
| 443 | SCREEN PRINTING ENTERPRISES, INC. | LPEH1-30/10 | Bake Oven | |
| 444 | Semiconductor Equipment Corp.(SEC) | Model 860 Eagle | Flip Chip Bonder | |
| 445 | Semitool Inc. | Raider ECD310 | ECD (Electro Chemical Deposition) | 300mm |
| 446 | Semitool Inc. | 270-ST | Spin Rinse / Dryer (SRD) | 150mm |
| 447 | SEZ Group | SP304 | Single Wafer Processing | 300mm |
| 448 | SEZ Group | SP4300 | Single Wafer Processing | 300mm |
| 449 | SEZ Group | SP203 | Single Wafer Processing | 200mm |
| 450 | SEZ Group | SP203 | Single Wafer Processing | 200mm |
| 451 | Shibaura Engineering Works Ltd. | CDE-300 | Metal Etch | 300mm |
| 452 | Showa Denko | abatement series | Chemical/Gas Treatment System | N/A |
| 453 | SilverStone Technology Co | SST-ST45SF | PC Power Supplies | N/A |
| 454 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 455 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 456 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 457 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 458 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 459 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 460 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 461 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 462 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch | |
| 463 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch | |
| 464 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch | |
| 465 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch | |
| 466 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch | |
| 467 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch | |
| 468 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch | |
| 469 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch | |
| 470 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch | |
| 471 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch | |
| 472 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch | |
| 473 | Sokudo Co., Ltd. | RF-300A | Multi Block (Resist Coater/Developer) | 300mm |
| 474 | Standard Research Systems | SR560 — Low-noise voltage preamplifier | Parts/Peripherals | N/A |
| 475 | Strasbaugh | 6DS-SP | Multi-Process CMP | 200mm |
| 476 | Strasbaugh | 6DS-SP | Multi-Process CMP | 200mm |
| 477 | Struers | Hexamatic | Semi-Automatic Specimen Polisher | |
| 478 | TDK | AFM-1501 | Flip Chip Bonder | N/A |
| 479 | TDK | AFM-1501 | Flip Chip Bonder | N/A |
| 480 | TDK | AFM-1501 | Flip Chip Bonder | N/A |
| 481 | TDK | AFM-1501 | Flip Chip Bonder | N/A |
| 482 | TDK | AFM-1503 | Flip Chip Bonder | N/A |
| 483 | TDK | AFM-1503 | Flip Chip Bonder | N/A |
| 484 | TDK | AFM-1503 | Flip Chip Bonder | N/A |
| 485 | TDK | AFM-1503 | Flip Chip Bonder | N/A |
| 486 | Tecdia Inc. | TEC-1228AL | Wafer Breaker | N/A |
| 487 | Technos | TVD-900 ICP-MS | Spectrometry | |
| 488 | Thermaltake Technology | Toughpower 750W Gold | PC Power Supplies | N/A |
| 489 | Thermo Electron Corporation | Napco 8100-TD | Test Chamber | N/A |
| 490 | Thermo Fisher Scientific (Electron) | Theta 300 MKII | Wafer Characterization | 300mm |
| 491 | Thermo Scientific | UFP5030A | Freezers | |
| 492 | Thermo Scientific | PlasmaQuad XS | Spectrometry | |
| 493 | Tokyo Electron Ltd. (TEL) | UW300Z | Batch Wafer Processing | 300mm |
| 494 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch | 300mm |
| 495 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch | 300mm |
| 496 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 497 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 498 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 499 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 500 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 501 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch | 300mm |
| 502 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch | 300mm |
| 503 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 504 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 505 | Tokyo Electron Ltd. (TEL) | TELINDY IRAD ALD High-K | Vertical Furnace | 300mm |
| 506 | Tokyo Electron Ltd. (TEL) | Tactras Vigus | Dielectric Etch | 300mm |
| 507 | Tokyo Electron Ltd. (TEL) | Tactras Vigus | Dielectric Etch | 300mm |
| 508 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 509 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD | 300mm |
| 510 | Tokyo Electron Ltd. (TEL) | Telius 305 SCCM | Dielectric Etch | 300mm |
| 511 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD | 300mm |
| 512 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD | 300mm |
| 513 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace | 300mm |
| 514 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace | 300mm |
| 515 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 516 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 517 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 518 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 519 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 520 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 521 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 522 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace | 300mm |
| 523 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace | 300mm |
| 524 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace | 300mm |
| 525 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace | 300mm |
| 526 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing | 300mm |
| 527 | Tokyo Electron Ltd. (TEL) | Expedius+ | Batch Wafer Processing | |
| 528 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 529 | Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace | 300mm |
| 530 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 531 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 532 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 533 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 534 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace | 300mm |
| 535 | Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace | 300mm |
| 536 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | 300mm |
| 537 | Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch | 300mm |
| 538 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 539 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 540 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 541 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace | 300mm |
| 542 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 543 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 544 | Tokyo Electron Ltd. (TEL) | NS 300 | Wafer Scrubber | 300mm |
| 545 | Tokyo Electron Ltd. (TEL) | TELINDY Plus IRAD Oxide | Vertical Furnace | 300mm |
| 546 | Tokyo Electron Ltd. (TEL) | UW300Z | Batch Wafer Processing | 300mm |
| 547 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace | 300mm |
| 548 | Tokyo Electron Ltd. (TEL) | Trias W – Chamber Only | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 549 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 550 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 551 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 552 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD | 300mm |
| 553 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 554 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 555 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 556 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD | 300mm |
| 557 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | |
| 558 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | |
| 559 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing | 300mm |
| 560 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing | 300mm |
| 561 | Tokyo Electron Ltd. (TEL) | TELINDY ALD High-K | Vertical Furnace | 300mm |
| 562 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 563 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 564 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 565 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | |
| 566 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch | 300mm |
| 567 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing | |
| 568 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 569 | Tokyo Electron Ltd. (TEL) | ALPHA-303i process TBD | Vertical Furnace | 300mm |
| 570 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | 300mm |
| 571 | Tokyo Electron Ltd. (TEL) | ALPHA-303i process TBD | Vertical Furnace | 300mm |
| 572 | Tokyo Electron Ltd. (TEL) | Tactras Vigus – Chamber Only | Dielectric Etch | 300mm |
| 573 | Tokyo Electron Ltd. (TEL) | Unity Me 85 SCCM | Dielectric Etch | 200mm |
| 574 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 575 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch | 300mm |
| 576 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace | 300mm |
| 577 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch | 300mm |
| 578 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch | 300mm |
| 579 | Tokyo Electron Ltd. (TEL) | TELINDY Anneal | Vertical Furnace | 300mm |
| 580 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch | 300mm |
| 581 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 582 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 583 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing | |
| 584 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 585 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing | 300mm |
| 586 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 587 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | |
| 588 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 589 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 590 | Tokyo Electron Ltd. (TEL) | TELINDY-B | Vertical Furnace | 300mm |
| 591 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals | 300mm |
| 592 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals | 300mm |
| 593 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals | 300mm |
| 594 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Single Block (Coat/Develop) | 300mm |
| 595 | Tokyo Electron Ltd. (TEL) | Precio | Production Wafer Prober | 300mm |
| 596 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 597 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | 300mm |
| 598 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 599 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 600 | Tokyo Electron Ltd. (TEL) | Precio | Production Wafer Prober | 300mm |
| 601 | Tokyo Electron Ltd. (TEL) | Precio | Production Wafer Prober | 300mm |
| 602 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 603 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch | 300mm |
| 604 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 605 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) | 300mm |
| 606 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | 300mm |
| 607 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 608 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD | 300mm |
| 609 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch | 300mm |
| 610 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 611 | Tokyo Electron Ltd. (TEL) | NT333 | ALD (Atomic Layer Deposition) | 300mm |
| 612 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD | |
| 613 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 614 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace | 300mm |
| 615 | Tokyo Electron Ltd. (TEL) | TELFORMULA | Vertical Furnace | 300mm |
| 616 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 617 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals | 300mm |
| 618 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals | 300mm |
| 619 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing | 300mm |
| 620 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing | 300mm |
| 621 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace | 300mm |
| 622 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 623 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) | 300mm |
| 624 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace | 300mm |
| 625 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 626 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace | 300mm |
| 627 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace | 300mm |
| 628 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace | 300mm |
| 629 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch | 300mm |
| 630 | TOWA (OMRON) Laser Front Inc. | SL473G | Laser Scribe | 300mm |
| 631 | TOWA (OMRON) Laser Front Inc. | SL473G | Laser Scribe | 300mm |
| 632 | Toyoko Kagaku | Toyoko Kagaku Fume Hood | Fume Hood Workstation | N/A |
| 633 | Toyota Industries Corporation | T100L | Dry Pump | N/A |
| 634 | Trane | CVHF1720 | Chiller/Heat Exchanger | N/A |
| 635 | Trane | CVHF1720 | Chiller/Heat Exchanger | N/A |
| 636 | Ultratech | CGS-300 | Stress Measurement | 300mm |
| 637 | Ulvac Corporation | Entron-EX: Front-End Metallization | PVD (Physical Vapor Deposition) | 300mm |
| 638 | Unisem | UN-2002A-PG | Abatement – Scrubber | N/A |
| 639 | Ushio | UMA-2003 | UV Cure System | 300mm |
| 640 | Varian Semiconductor Equipment Associates (VSEA) | VIISta PLAD | High Dose Implant | 300mm |
| 641 | Varian Semiconductor Equipment Associates (VSEA) | VIISta 810 | Mid Current Implanter | 300mm |
| 642 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter | 300mm |
| 643 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter | 300mm |
| 644 | Varian Semiconductor Equipment Associates (VSEA) | VIISta HC | High Current Implanter | 300mm |
| 645 | VARIOUS | 1.25″ SILICON WAFER | Wafers | |
| 646 | VARIOUS | 1.5″ SILICON WAFER | Wafers | |
| 647 | VARIOUS | 1.875″ SILICON WAFER | Wafers | |
| 648 | VARIOUS | 2″ SILICON WAFER | Wafers | |
| 649 | VARIOUS | 2.25″ SILICON WAFER | Wafers | |
| 650 | VARIOUS | 2.5″ SILICON WAFER | Wafers | |
| 651 | VARIOUS | 2.875″ SILICON WAFER | Wafers | |
| 652 | VARIOUS | 3″ SILICON WAFER | Wafers | |
| 653 | VARIOUS | 3.25″ SILICON WAFER | Wafers | |
| 654 | VARIOUS | 200MM SILICON WAFER | Wafers | 200mm |
| 655 | VARIOUS | SILICON INGOT | SILICON INGOT | |
| 656 | VARIOUS | 100MM SILICON WAFER | Wafers | 100mm |
| 657 | VARIOUS | 125MM SILICON WAFER | Wafers | 125mm |
| 658 | VARIOUS | 150MM SILICON WAFER | Wafers | 150mm |
| 659 | Veeco Instruments Inc. | Dimension 7000 | Atomic Force Microscope (AFM) | 200mm |
| 660 | Veeco Instruments Inc. | Dimension Vx 340 | Atomic Force Profiler (AFP) | 300mm |
| 661 | Versum Materials / Merck | Variuos | Chemical Mix & Distribution | N/A |
| 662 | Wentworth Laboratories | pegasus s300 | Engineering Wafer Prober | 300mm |
| 663 | X-Tek | Orbita 160Xi | X-Ray Inspection System | 300mm |
| 664 | Zeiss | UMSP 80 | Spectrophotometer | |
| 665 | Zygo Corp. | UniFire 7900 | Overlay Measurement System | 300mm |
SS5319-0-11-1-1
