Top

AutoGlow 1000 Asher Etcher

Description

AutoGlow 1000 Low Cost Desktop Plasma Cleaner. Made in CA,USA.

PDF Download

Production plasma cleaner – AutoGlow 1000 is used for surface modification, photoresist removal, plasma descum, treatment prior to bonding, oxide etch, nitride etch, polymer etch and general plasma cleaning. The chamber is made of thick aluminum and reinforced on all sides to prevent internal bowing. The RF generator, MFC’s, baratron and all internal electronics are easy to reach for serviceability. The chamber has multiple removable and adjustable shelves to accommodate various types of carrier, samples including magazines, wafers or trays. Photoresist removal test show less than 8% uniformity using three shelf pairs. Multiple electrode shelves can be arranged for various plasma conditions: Reactive Ion Etch, Plasma processing and downstream plasma processing. The AutoGlow 1000 can process 300mm wafers.

Key Features:

  • Production proven computer controlled plasma system at low cost.
  • Chamber Dimensions: Height 18 inch, Width 16.25 inch; Max height between electrode shelves is 12.5 inch.
  • Shelf Dimension: (1) RF powered shelf width is 13.875 inch and depth is 16.75 inch; (2) Ground shelf width is 17 inch and depth is 18.75 inch. The AutoGlow 1000 can process 300mm wafers.
  • Can operate at low wattage or as high watts. 30 to 600 watts (13.56 MHz) 30 watts for gentle processing—high power for more aggressive applications.
  • 13.56 MHz (high frequency) with auto-tune.
  • Can set power in one watt increments—the RF generator and match network are tuned to accomplish this.
  • Come with RF generator, RF tuning network, software control system, chamber and gas delivery system.
  • Automatic Tuning—very fast and with extremely low reflected power—very well designed tuning network without arc, spark or tuning issues.
  • The Butterfly Throttle Valve allows for independent control of the process gas flow and the chamber pressure. Controlled by the system software.
  • The Isolation Valve is controlled by the software to open or close the line to the vacuum pump.
  • Genesis Software with touch screen with lock outs, advance control and diagnostics which confirm all modules are working.
  • Choice of up to four Mass Flow Controllers.
  • Chamber Electrode Configurations: Place Samples on any shelf for Direct Plasma Processing for the maximum load capacity. Recommended for most plasma treatment applications. Place Samples on the Bottom Powered Electrode Shelves for RIE Type Processing. Place Samples on the Bottom Grounded Shelves for Plasma Processing.
  • Designed for ease of service—RF generator and the electronics/gas distribution modules slide out the front.
  • Final testing is separate from manufacturing.
  • Being leak checked with a helium leak detector in manufacturing.
  • Have detailed technical manuals and instructional videos.
  • Have engineering drawings and documentation to module and component level for the entire system.
  • Reinforced lift points are included to help move the system.
  • Stainless Steel Fittings.
  • Nickel plated bus bars are an option.
  • CE marked and certified.

Genesis Software Control Systems :

  • System pre-process self-check (the software checks the MFC’s and pressure).
  • Graphical Display, Manual Control, Process Setup,
  • Multiple step recipes (up to 10)—very easy to configure.
  • Has adjustable gas stabilization times–and the software confirms MFC linearity.
  • Has data logging, store/download historical records.
  • Monitor RF on/off times during process and look at pressure curves during process.
  • Easy to Use—Operator only needs to press two buttons to start the process. Operator would then press the Vacuum button to remove product from the chamber.

Applications for AutoGlow 1000

  • Plasma cleaning
  • Plasma Descum
  • Plasma cleaning and treatment of Lead Frames
  • BioChip channel clean and treatment
  • PDMS applications (activation prior to bonding)
  • Surface modification
  • Etching Parylene
  • Plasma clean prior to various bonding needs
  • Plasma clean/treatment prior to wire bonding
  • Cleaning prior to deposition
  • Cleaning of medical devices
  • Plasma cleaning of PC Boards
  • Plasma Photoresist Removal (plasma strip)

300mm Plasma Etching of Oxide:

The AutoGlow 1000 showed SiO2 etching uniformity of less than 8% on a 300mm wafer using one electrode shelf set (powered bottom shelf, grounded electrode shelf above). An etch rate of 603 Angstroms/min was achieved on the 300mm plasma etch of oxide. This shows that the AutoGlow can be used for processing multiple 300mm wafers on multiple shelves. The AutoGlow 1000 channels the process gas to the front of the chamber in a balanced way to improve the uniformity on large substrates. Process gas is introduced to the front of the vacuum chamber and the reactive gas is drawn across the substrate(s) to the vacuum port in the rear of the chamber. The plasma is extremely uniform. Other films such as photoresist, polymers, silicon nitride and organics can also be processed in the AutoGlow 1000.

Testing performed for oxide etch:

  • CF4 and O2 as the process gas.
  • 1 Torr pressure.
  • 400 watts of power at 13.56 MHz.
  • 2 minutes for etch time.
  • 603 Angstroms/min etch rate.
  • 8% measured uniformity (max measurement-min etch /2 x average).
  • 300mm Plasma Etching of Oxide, resting on the lower powered electrode with ground electrode positioned above the powered electrode (RIE mode).
  • The AutoGlow 1000 can process multiple 300mm wafers on multiple electrode shelves.
  • Oxide Etching/plasma etching basics in the University of Texas, Austin.
  • If you have interest or would like to run samples, please contact us.

Others:

  • Shipping crates are certified for international shipment.
  • All systems are staged in a clean area, receive an IPA wipe down and are double bagged.
  • Testing Certificates and Final Testing Data are attached to system.
  • Systems conform to all international electrical standards and can operate in any location.

 

Other Plasma Equipment at low costs are available:

  1. Glow Plasma System:
    • Chamber: Anodized aluminum;
    • Process gases:  O2, He, Ar, N2, and even CF4 and SF6 ;
    • RF Power: 100 kHz 50 Watt solid state generator without turning ;
    • Main Applications: plasma cleaning, removing photoresist, prebond cleaning / conditioning, PDMS bonding and organic removal.
  2. AutoGlow plasma cleaning system
    • Chamber: Quartz;
    • Process Gaes: O2, Ar ;
    • RF Power: 10 watt to 300 watt, 13.56 MHz solid state generator;
    • Main Applications: plasma cleaning, argon plasma, oxygen plasma, PDMS bonding, oxygen plasma treatment, photo resist stripping, FA applications, Parylene removal, organic removal.
  3. AutoGlow 200
    • Chamber: Anodized aluminum;
    • Process gases: O2, Ar, SF6, or CF4 ;
    • RF Power: 10 watt to 300 watt, 13.56 MHz solid state generator;
    • Main Applications: plasma activation, plasma cleaning, organic removal, pre-deposition cleaning as well as etching applications.
  4. AutoGlow 300
    • Chamber: Anodized aluminum;
    • Process Gases: O2, Ar, SF6, or CF4;
    • RF Power: 10 watt to 300 watt, 13.56 MHz solid state generator;
    • Main Applications: plasma activation, plasma cleaning, organic removal, pre-deposition cleaning as well as etching applications.
  5. AutoGlow 300LF
    • Chamber: Anodized aluminum ;
    • Process Gases: O2, Ar, SF6, or CF5;
    • RF Power: 100 kHz solid state generator without turning;
    • Main Applications: plasma activation, plasma cleaning, organic removal, pre-deposition cleaning as well as etching applications.

The trademarks of the equipment and parts contained in this page belong to the Original Equipment Manufacturers. The info on the equipment is subject to change without notice. This is not purchase specifications.

Please contact us for more information on the product:

[dynamichidden dynamichidden-813 "CF7_URL"]

Your Name*:

Your Email:

Your Message:

Captchac Codecaptcha

Submit:

SS9134

“>快速退火炉,速升溫退火爐,保护气氛快速退火炉,保護氣氛快速退火爐,快速退火爐,红外灯加热,红外灯快速退火,卤素灯加热,高温计,红外高温计,等离子去胶机,等离子刻蚀,深刻蚀,各向同性,各向异性,等离子清洗,溅射台,蒸发台,磁控溅射台,直流电源溅射,高频溅射,自动刻蚀机,自动去胶机,手动去胶机,手动刻蚀机,干法去胶机,湿法去胶机,干法刻蚀机,湿法刻蚀机,半导体设备,半导体旧设备,半导体中古设备,半导体前道工艺设备,半导体后道工艺设备,半导体前道设备,半导体后道设备,半导体量测仪器,半导体量测设备,美国制造,紅外線燈加熱,紅外線燈快速退火,鹵素燈加熱,高溫計,紅外線高溫計,等離子去膠機,等離子蝕刻,深刻蝕,各向同性,各向異性,等離子清洗,濺射台,蒸發台,磁控濺射台,直流電源濺射,高頻濺射,自動蝕刻機,自動去膠機,手動去膠機,手動蝕刻機,乾式去膠機,濕式去膠機,乾法蝕刻機,濕蝕刻機,半導體設備,半導體舊設備,半導體中古設備,半導體前道製程設備,半導體後道製程設備,半導體前道設備,半導體後道設備,半導體量測儀器,半導體量測設備,美國製造,Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10, System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher, Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean,Gasonics AE 2001, Gasonics AE 2000LL Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Plasma RIE ,Reactive Ion Etch System, Reactive Ion Etch System, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915,Tegal 701,Tegal 703,Tegal 801,Tegal 803,Tegal 981e,Tegal 903e,Tegal 915, Tegal 965, Tegal 405, Tegal 401 Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Lam AutoEtch 490, Lam AutoEtch 590, Lam AutoEtch 690, Lam AutoEtch 790, Lam Rainbow 4400, Lam Rainbow 4420, Lam Rainbow 4428, Lam Rainbow 4500, Lam Rainbow 4520, Lam Rainbow 4528, Lam Rainbow 4600, Lam Rainbow 4620, Lam Rainbow 4628, Lam Rainbow 4700, Lam Rainbow 4720, Lam Rainbow 4728, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics AE 2001, Microwave Etcher, Microwave Plasma Etcher, Microwave Etch, Downstream Plasma Etch Enviro,ENVIRO-1XaENVIRO-1Xa ,2CENVIRO-Optima,Luminous NA,NA-8000NA-1300NA-1500 ,Multifilm,NE-550EXaNE-950EX, APIOSNE-5700Deep, Oxide Etching ,NLD-570EXaRISE System,RISE Series,Cluster Systems,SME SeriesuGmni Series,SRH SeriesULDiS Series,SMV-500FRoll-coater,SPW SeriesIn-line Systems,SIV SeriesSDH-4550LR&D,CS-200, 300mm,ENTRON-EXENTRON-EX2,Evaporation Roll Coater,EW SeriesR&D/Pilot Production,Ei-5In-line Systems, Ei-H series,Si Processing,IMX-3500SOPHI-200/260 ,SiC,IH-860,Brazing Furnace,FB SeriesFHHn series ,Vacuum Sintering,FSC SeriesVacuum,Induction Melting,FMI Series,Vacuum Heat Treatment,FHB-60CFHV Series,Single-Substrate,CC Series,CME Series,In-line Systems, ULGLAZE Series,Lyophilizer,DFB Series,Micropowder Dry, UPD-400D,FM Series,DFR Series,Centrifugal Type,CEH-400B,ULVAC Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition Nordson MARCH Plasmatreat Bdtronic Panasonic PVA TePla Diener Electronic Vision Semicon Samco Inc. Tantec SCI Automation PINK GmbH Thermosysteme Plasma Etch Shenzhen OKSUN. Plasma Surface Treating Equipment : Nordson MARCH, bdtronic, Diener electronic, AcXys Technologies, Europlasma, ME.RO, Tantec, Plasmatreat, Plasma Etch, PINK GmbH Thermosysteme, Kalwar Group, Arcotec, Shenzhen OKSUN

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers