Description
200mm Test Wafer 8 inch Test wafer Silicon Wafer
Maker: USIC
MOQ: 1 package with 25pcs. EXWORKS (Taoyuan,Taiwan). HTS code 381800.
- Diameter 300mm
- Type P
- Dopant Boron
- Orientation <100>
- Resistivity 0-100 ohm-cm
- Thickness 775±25µm
- TTV ≤25µm
- Bow ≤100µm
- Warp ≤100µm
- Particle ≥0.20µm Max 30ea
- Wafer ID Marking Backside, OCR+T7
- Front / Backside Surface Polished / Polished
- Surface Metal (Zn, Cu, Fe, Ni, Cr, K, Al, Na, Ca) ≤1E10 atom/cm2
- Packaging Box: FOSB ;Bags: PE/Al bag
Buyers accept the following terms if shopping.
- Must follow USA DOC import and export regulations.
- These wafer are subject to prior sale. Buyers accept backorder with a lead time (TBD).
- The photo here is only for your reference. It was not from the real wafers.
Please contact us if you are also interested in the the following 200mm 300mm wafers/silicon ingot.
- 200mm Si Test Wafer
- 300mm Si Test Wafer
- 200mm Al Wafer
- 300mm Al Wafer
- 200mm Si Oxide Wafer
- 300mm Si Oxide Wafer
- 300mm Silicon Ingot
- 350mm Silicon Ingot
