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IMSi UltraClean

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Description

 

Parameter
Specification
Growing Method CZ or MCZ
Type P
Dopant Boron
Orientation <100>
Resistivity 1-100ohm-cm
Diameter 300.00±0.2 mm
Thickness ≥760um, 775±25um or 700-800um
Bow/Warp ≤40um or better
TTV ≤5um or better
Particle ≥0.037um Max 100ea or better

Please contact us if you are also interested in the the following 200mm 300mm wafers/silicon ingot.

  • 200mm Si Test Wafer
  • 300mm Si Test Wafer
  • 200mm Al Wafer
  • 300mm Al Wafer
  • 200mm Si Oxide Wafer
  • 300mm Si Oxide Wafer
  • 300mm Silicon Ingot
  • 350mm Silicon Ingot

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