Description
Varian 3290 Sputtering Deposition System. The 3290 system utilizes an innovative dual cathode magnetron sputtering source to provide excellent control of film thickness and uniformity on six-inch wafers. INDIVIDUAL WAFER PROCESSING. The 3290 processes waters individually with a fixed wafer-to-source geometry during all process steps. This assures excellent wafer-to-wafer repeatability. Only the wafer itself is introduced into the deposition chamber, maximizing system cleanliness. CASSETTE-TO-CASSETTE WAFER HANDLING. Wafers are automatically removed from the cassette, processed serially and replaced in the same cassette by a patented wafer handling system. Each wafer is held vertically throughout all process steps to minimize contamination and enhance yields. The 3290 system sets the pace for state-of-the-art wafer sputtering. This new system is based upon the widely accepted and field-proven design of the acclaimed 3280. It provides significant improvements for even greater performance and reliability.
SYSTEM HIGHLIGHTS:
- ViaFiTM for 100% step coverage with aluminum alloy films.
- SECS II host computer interface software.
- Multipass software permits sequential layering of dissimilar metals for hillock control.
- Up to three Quantum deposition stations for extended versatility.
- Combined Preheat and RF etch station for sequential or simultaneous wafer preconditioning.
- Vacuum Isolated Preprocess Station (VIPS) for multi-level metal applications.
Valid time: Subject to prior sale without notice.
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ID-SS1184