Description
Please contact us for the availability of the used semiconductor equipment.
| Size | Module | Machine Function | Maker | Model |
| 12″ | HDP PSG | AMAT | Centura Ultima X | |
| 12″ | Depth Measurement (AFM) | Bruker | VX330 | |
| 12″ | Film Thickness (Cu) | Jordan-Valley | JVX6200 | |
| 12″ | VF Gate Oxide | TEL | Alpha-303i | |
| 12″ | ULT ALD-Oxide | HIKE | QuixaceII QLV2 | |
| 12″ | AEI | Leica | LDS3300M | |
| 12″ | AEI | Leica | LDS3300M | |
| 12″ | High Current IMP | AMAT | Quantum X | |
| 12″ | ADI | Leica | LDS3300C | |
| 12″ | ADI | Rudolph | AXI-935 | |
| 12″ | ADI | Leica | INS-3300+DUV | |
| 12″ | Barrier & Seed | Novellus | Inova NExT | |
| 12″ | Dielectric Constant Measurement | Semilab | 5130 | |
| 12″ | W.S. Oxide Etch | SES | BW3000-X | |
| 12″ | AFM (Profiler) | Bruker | X1D | |
| E200 | SOG Coater | DS | SC-W80A-AG | |
| E200 | Litho | SOG Coater | DS | SC-W80A-AG |
| E200 | PVD | PVD | Canon-ANELVA | I-1060SV2+1 |
| E200 | PVD | PVD | Canon-ANELVA | I-1060SV2+1 |
| E200 | Litho | inline Developper | YUASA | SR-8075 |
| E200 | ETCH | UV/O3 treatment | DS（SOKUDO) | DP-W８０Ａ-AV （UV） |
| E200 | DIFF | RTA(for every 5 wfrs) | WaferMasters | 5BAO-200 |
| E200 | WET | Sheet remove Washer | TYK | 132566 |
| E200 | WET | Nitride Etching Bath | TYK | 161028 |
| E200 | DIFF | Block Controller | HITACHI KOKUSAI ELECTRIC | CX-9620 |
| E200 | DIFF | Block Controller | HITACHI KOKUSAI ELECTRIC | CX-9620 |
| E200 | DIFF | Degital profiler | Okura | DP2301 |
| E200 | DIFF | Degital profiler | Okura | DP2301 |
| E200 | DIFF | Degital profiler | Okura | DP2301A01 |
| E200 | DIFF | Degital profiler | Okura | DP2301A01 |
| E200 | DIFF | Degital profiler | Okura | DP2301A01 |
| E200 | DIFF | EDSA | AMAT | – |
| E200 | ETCH | W Dry Etcher | Canon-ANELVA | ILD-4100SR |
| E200 | ETCH | W Dry Etcher | Canon-ANELVA | ILD-4100SR |
| E200 | ETCH | W Dry Etcher | Canon-ANELVA | ILD-4100SR |
| E200 | ETCH | OX Dry Etcher | TEL | UNITY-IEM |
| E200 | ETCH | OX Dry Etcher | Canon-ANELVA | ILD-4100SDⅡ |
| E200 | ETCH | OX Dry Etcher | Canon-ANELVA | ILD-4100SDⅡ |
| E200 | ETCH | OX Dry Etcher | Canon-ANELVA | ILD-4100SDⅡ |
| E200 | ETCH | OX Dry Etcher | Canon-ANELVA | ILD-4100SDⅡ |
| E200 | ETCH | OX Dry Etcher | Canon-ANELVA | ILD-4100SR |
| E200 | Litho | Overlay Measurement | TKK | MAC-92MV1 |
| E200 | Litho | Overlay Measurement | TKK | MAC-92MV1 |
| E200 | Litho | Overlay Measurement | TKK | MAC-92MV1 |
| E200 | Litho | Overlay Measurement | TKK | MAC-92MV1 |
| E200 | Litho | Overlay Measurement | TKK | MAC-110MV1 |
| E200 | Litho | Overlay Measurement | TKK | MAC-110MV1 |
| E200 | PVD | Surface reflection measurement | Beckman Coulter | DU-650 |
| E200 | CMP | Wafer Surface measurement | TOKYO SEIMITSU | Surfcom 590A-64 |
| E200 | CMP | Wafer Surface measurement | TOKYO SEIMITSU | Surfcom 578A |
| E200 | CMP | Thickness Measurement | DS | VM-8200 |
| E200 | CMP | Thickness Measurement | DS | VM-8200 |
| E200 | CMP | Thickness Measurement | DS | VM-2010 |
| E200 | CMP | Wafer Thickness measurement | TOKYO SEIMITSU | E-MF1000-100 |
| E200 | DIFF | Polyimide Bake Furnace | Koyo Thermo Systems | VF-5300B V35X |
| E200 | DIFF | Polyimide Bake Furnace | Koyo Thermo Systems | VF-5300B V35X |
| E200 | ETCH | OX Dry Etcher | TEL | UNITY-IEM |
| E200 | Litho | Polyimide Coater | DS | SD-W80A-AVQ |
| E200 | Litho | Polyimide Developper | DS | SD-W80A-AVQ |
| E200 | DIFF | Block Controller | HITACHI KOKUSAI ELECTRIC | CX-9620 |
| E200 | DIFF | High energy IMPLA | SEN | NV-GSD-HE |
| E200 | YE | Inspection SEM | JEOL | JWS-7515 |
| E200 | DIFF | LP-CVD(TEOS NSG) | TEL | α-808SC |
| E200 | DIFF | High current IMPLA | SEN | NV-GSDⅢ-90 |
