Description
Sputtering Target for Sputtering Deposition Equipment. Made in U.S.A.
| 1 | sputtering target NiSi 2/1 at% 2″x.110 |
| 2 | Sputtering Target, 3″ x .250″ MAK gun w/ keeper. W90Ti10 wt% |
| 3 | sputtering target, Al 2″x.250″ |
| 4 | Sputtering Target, Al 2″x.250″ |
| 5 | Sputtering Target, Al 2″x.250″ |
| 6 | Sputtering Target, Al2O3 2″x.3mm” |
| 7 | Sputtering Target, Al2O3, 2″ x .250″ w/ copper backing plate |
| 8 | Sputtering Target, AlCu 99/1 2″x.250″ |
| 9 | Sputtering Target, AlMn 50/50 at% 2″x.125″ |
| 10 | Sputtering Target, AlNd 97/3 wt% 2″x.250″ |
| 11 | sputtering target, AlNd 98/2 wt% 2″x.250″ |
| 12 | Sputtering Target, AlNi 22.3/77.7 wt% 2″x.200″ |
| 13 | Sputtering Target, AlSi 99.8/0.2 2″x.225″ |
| 14 | Sputtering Target, AlTi 96.5/3.5 wt % 2″x.125″ |
| 15 | Sputtering Target, AlTi 96.5/3.5 wt% 2″x.125″ |
| 16 | Sputtering Target, Aluminum (Al) 2″x.250″ |
| 17 | Sputtering Target, AZO 2″x.125″ |
| 18 | Sputtering Target, AZO 2″x.125″ |
| 19 | Sputtering Target, AZO 2″x.250″ |
| 20 | sputtering target, BiIn 10/1 at% 2″x.150″ |
| 21 | Sputtering Target, BiIn 4/1 at% 2″x5mm |
| 22 | Sputtering Target, BiSb 1/3 at% 2″x.250″ |
| 23 | Sputtering Target, BiSb 1/3 at% 2″x3/16″ |
| 24 | Sputtering Target, C amorphous 2″x.25″ |
| 25 | sputtering target, Chromium (Cr) 2″x.250″ |
| 26 | Sputtering Target, Co70Fe15Ni15 at%, 2″ x .125″ |
| 27 | Sputtering Target, CoAl 1/1 at% 2″x.250″ |
| 28 | Sputtering Target, CoFe 50/50 wt% 2″x.125″ |
| 29 | Sputtering Target, CoFe 68.9/31.1 wt% 2″x.110″ |
| 30 | Sputtering Target, CoFe 80/20 wt% 2″x.040″ |
| 31 | Sputtering Target, CoFe 90/10 at% 2″x3mm |
| 32 | Sputtering Target, CoFe 95/5 at% 2″x.09″ |
| 33 | sputtering target, CoFe 95/5 at% 2″x.145″ |
| 34 | Sputtering Target, CoFe 95/5 at% 2″x.145″ |
| 35 | Sputtering Target, CoFeAl 2/1/1 2″x.125″ |
| 36 | Sputtering Target, CoGd 95/5 wt% 2″x.175″ |
| 37 | Sputtering Target, CoNi 20/80 at% 2″x.120″ |
| 38 | Sputtering Target, CoNi 20/80 at% 2″x.150″ |
| 39 | Sputtering Target, CoNi 55/45 2″x.240″ |
| 40 | Sputtering Target, CoTaZr 90/5/5 at% 2″x.110″ |
| 41 | sputtering target, CoTi 1/1 at% 2″x.250″ |
| 42 | sputtering target, CoTi 1/1 at% 2″x.250″ |
| 43 | sputtering target, Cr 2″x.250″ |
| 44 | Sputtering Target, Cr 2″x.250″ |
| 45 | Sputtering Target, Cr2O3 2″x.125″ |
| 46 | Sputtering Target, Cu50Ni50 wt%, 2″ x .250″ |
| 47 | Sputtering Target, CuAl 40/60 2″x.250″ |
| 48 | Sputtering Target, CuGa 75/25 at% 2″x.250″ |
| 49 | Sputtering Target, CuGa 85/15 at% 2″x.250″ |
| 50 | Sputtering Target, CuSe 2″x.125″ |
| 51 | Sputtering Target, CuZnSnSSe 20/10/20/25/25 2″x.125″ |
| 52 | Sputtering Target, CuZnSnSSe 25/12.5/12.5/25/25 2″x.125″ |
| 53 | Sputtering Target, Fe 2″ x .060″ |
| 54 | Sputtering Target, Fe 2″x.025″ |
| 55 | Sputtering Target, Fe, 2″ x .250″ bonded to Cu backing plate |
| 56 | sputtering target, FeAl 96.5/3.5 2″x.090 |
| 57 | Sputtering Target, FeAl 96.5/3.5 2″x.090″ |
| 58 | Sputtering Target, FeAl 96/4 at% 2″x.090″ |
| 59 | Sputtering Target, FeAl 96/4 at% 2″x.090″ |
| 60 | Sputtering Target, FeAl 97.5/2.5 2″x.090″ |
| 61 | sputtering target, FeB 7/3 at% 2″x.125″ |
| 62 | Sputtering Target, FeCo 65/35 at% 2″x.235″ |
| 63 | Sputtering Target, FeMo 85/15 at% 2″x.120″ |
| 64 | Sputtering Target, FeSn 45/55 at% 2″x.125″ |
| 65 | Sputtering Target, FeTa 90/10 2″x.100″ |
| 66 | sputtering target, FeTb 30/70 wt% 2″x.120″ |
| 67 | sputtering target, GeTe 1/1 at% 2″x.125″ |
| 68 | Sputtering Target, ITO (In2O3(90)SnO2(10) 2″x.250″ bonded to Cu backing plate |
| 69 | Sputtering Target, Mg 2″x.250″ |
| 70 | Sputtering Target, MnAl 48/52 at% 2″x6mm |
| 71 | Sputtering Target, Mo 2″x.250″ |
| 72 | Sputtering Target, Mo 2″x.250″ |
| 73 | Sputtering Target, MoCr 85/15 at% 2″x.250″ |
| 74 | Sputtering Target, MoCu12 wt% 2″x.125″ |
| 75 | Sputtering Target, NbGe 75/25 at% 2″x.125″ |
| 76 | Sputtering Target, NbTi 70/30 wt% 2″x.060″ |
| 77 | Sputtering Target, Ni 2″x.125″ |
| 78 | Sputtering Target, Ni 2″x.250″ |
| 79 | sputtering target, Ni/Ti 10/90 wt% 2″x.250″ |
| 80 | Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 81 | Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 82 | Sputtering Target, Ni10Ti40Nb50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 83 | Sputtering Target, Ni10Ti90 wt%, 2″ x .250″ |
| 84 | Sputtering Target, Ni10Ti90 wt%, 2″ x .250″ |
| 85 | Sputtering Target, Ni20Ti80 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 86 | Sputtering Target, Ni80Al20 wt%, 2″ x .250″ |
| 87 | Sputtering Target, Ni90Ti5Al5 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 88 | Sputtering Target, Ni95Ti5 wt %, approximately 3″x.25″w/ 4″ copper backing plate |
| 89 | Sputtering Target, Ni95Ti5 wt% 2″x.250″ |
| 90 | Sputtering Target, NiaF 2″x.125″ |
| 91 | Sputtering Target, NiFe 7/3 at% 2″x.125″ |
| 92 | sputtering target, NiFe 79/21 at% 2″x.125″ |
| 93 | Sputtering Target, NiGe 45/55 at% 2″x.250″ |
| 94 | Sputtering Target, NiGe 60/40 at% 2″x.250″ |
| 95 | Sputtering Target, NiMnSn 50/36/14 at% 2″x.125″ |
| 96 | Sputtering Target, NiMoRe 77.6/20/2.4 at% 2″x.250″ |
| 97 | sputtering target, NiSi 2/1 at% 2″x.110″ |
| 98 | sputtering target, NiTi 10/90 wt% 2″x.250 |
| 99 | Sputtering Target, NiTi 10/90 wt% 2″x.250″ |
| 100 | sputtering target, NiTi 25/75 wt% 2″x.250″ |
| 101 | sputtering target, NiTi 25/75 wt% 2″x.250″ |
| 102 | Sputtering target, NiTi 50/50 at% 2″x.170″ |
| 103 | Sputtering Target, NiTi 50/50 at% 2″x.170″ |
| 104 | Sputtering Target, Sb 2″x.125″ |
| 105 | Sputtering Target, Sb 2″x.125″ |
| 106 | Sputtering Target, Sc, 2″ x .040″ |
| 107 | Sputtering Target, Si 2″x.125″ |
| 108 | Sputtering Target, Si76.4Al6.6B17 wt %, 2.92″x .200″ w/ 4″ copper backing plate |
| 109 | Sputtering Target, Si92Al8 wt% 1.75″ x .125″ bonded to 2″ copper backing plate |
| 110 | Sputtering Target, Sn92.5Mg7.5 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 111 | Sputtering Target, SnO2 2″x.125″ |
| 112 | Sputtering Target, SnS 2″x.125″ |
| 113 | Sputtering Target, SnS2 2″x.125″ |
| 114 | Sputtering Target, SnS2 2″x.125″ |
| 115 | Sputtering Target, Te 2″x.250″ |
| 116 | Sputtering Target, Ti 2″x.250″ |
| 117 | Sputtering Target, Ti47.3Sn52.7 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 118 | Sputtering Target, Ti50Ta50 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 119 | Sputtering Target, Ti75Sn25 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 120 | Sputtering Target, Ti95.3Y4.7 wt %, approx 3″x.25″w/ 4″ copper backing plate |
| 121 | Sputtering Target, Y 1.75″ x .125″ bonded to 2″ copper backing plate |
| 122 | Sputtering target, Yttrium 2″x.063″ |
| 123 | Sputtering Target, Zinc 2″ x .250″ |
| 124 | Sputtering Target, Zn 2″x.250″ |
| 125 | Sputtering Target, Zn target, 2″ x .250″ in plated copper cup |
| 126 | sputtering target, ZnAl 98/2 wt% 2″x.250″ |
| 127 | Sputtering Target, ZnO 2″x.125″ |
| 128 | Sputtering Target, ZnO target, 2″ x .250″ in copper cup |
| 129 | Sputtering Target, ZnO/AlO3 98/2 wt% 2″x.125″ |
| 130 | Sputtering Target, ZnOAl2O3 99.9/0.1 wt% 2″x.125″ |
| 131 | Sputtering Target, ZnOMgO 10 at% 2″x.125″ |
| 132 | Sputtering Target, Zr 2″x.250″ |
| 133 | Sputtering Target, Zr 2″x.250″ |
| 134 | Sputtering Target,ZnO 2″ x .250″ bonded to Cu backing plate |
Condition: New
Location: CA USA
Valid Time: Subject to prior sale. This item is only for end user
ID-SS380EB20221207
