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Nikon Nexiv VMV-K3040

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Description

Nikon Nexiv VMV-K3040 Multi-functional confocal video measurement System

The item is a complete and functional NEXIV VMZ-K3040 multi-functional confocal video measuring system.

The following info is from Nikon’s website. It is for your reference only

It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need–two-dimensional or three-dimensional–inspection and evaluation is exceptionally fast and accurate with this system!
The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.
Key benefits

Simultaneous wide-area height measurement with Nikon proprietary confocal optics
2D measurement with 15x brightfield zoom optics
Fully compatible with 300 mm wafer measurement at semiconductor fabs
General model for a wide range of needs

Applications

IC Packages: Flip Chip/COF(Bump)/COG, CSP (FBGA)/SIP (Bump, Wire), Interposer (Pad height)
MEMS
Probe Card (Silicon Probe, Au Probe)
Precise Glass Components (Micro Lens, Contact Lens)
Photo Spacer Width/Height for Color Filt

The Item is subject to prior sale without notice.

The Item is only for end user.

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