Description
APPLIED MATERIALS VERASEM 3D:
- AUTOMATED CD METROLOGY SYSTEM
- Wafer Specification
- Wafer Size: 200MM
- Wafer Shape: SNNF (Semi Notch No Flat)
- Wafer : 6”, 8” or 12”
- Electron Optical System
- Electron Gun Schottky emission source (fei)
- Accelerating voltage 300V to 2000V
- Probe Current Low 5pA / Medium 10pA / High 20pA
- Electromagnetic Lens 3 Stage Electromagnetic Lens
System with boosting voltage Beam Deflector Module - Objective Lens
- Scan Coil 2-Stage Electromagnetic Deflection (X- and Y-Axes)
- Magnification 1,000x to 400,000x (100um to 0.25um FOV)
- Wafer imaging ability Entire surface of 8” wafer
- Asspect Ratio >14 : 1
- Tilt Function 5 degrees (4 Direction)
- Resolution 3nm (500V)
- SECS/GEM Communication Interface
- Automated Image Archiving Function Always / Online Setup / Never
- Measurement Function Average/Maximum/Minimum/Contact Hole/
- Line Edge Analysis/CH Analysis/Slope
- Measurement Algorithm Normal / Foot / Threshold
Condition: Unit pulled from a working service, however due to lack of power supply unable to fully test. Sold As-Is. Complete,working,functional test or refurbished conditions are optional at extra cost.
Valid time: Subject to prior sale without notice. Appreciate your time.
ID-SS380-e
