Description
AG Associates Heatpulse 2146
Wafers from 3″ to 6″
Configured for 4″ wafers
Temp. range: 700 to 1100°C
Cooling rate: 120°C/sec (programmable)
Auto cassette to cassette wafer handling
Configured for 4″ wafers
Temp. range: 700 to 1100°C
Cooling rate: 120°C/sec (programmable)
Auto cassette to cassette wafer handling
Please contact us if you are interested in the AG Associates Heatpulse 2146 RTP. We do not own this. This is only for end user.
