Description
Used Semiconductor Equipment Parts
Location: Asia
These are subject to prior sale. These are only for end user. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
Item | Manufacturer | Model | Wafer Size | Process | Description |
1 | AST | PEVA-600E | – | Evaporator | E-Gun |
2 | BPS | LLS EVO | 6″ | Sputter | Sputter |
3 | Branchy | E570 | – | Evaporator | E-Gun |
4 | EO TECHNICS | CSM3000 | 8″~12″ | Laser Marking | WLCSP Laser Marking System |
5 | HITACHI | WA3300 | 12″ | AFM | Atomic Force Microscope (AFM) |
6 | RECIF | SPP300 | 12″ | Sorter | Wafer Sorter |
7 | RVSI | WS 3800 | 8″ | Inspection | 2D,3D AOI Wafer Inspection System |
8 | SPTS (STS) | Multiplex ICP HR | 8″ | Dry Etcher | MACS ICP HR Etch System (Deep Reactive Ion Etcher) |
9 | SPTS (STS) | Multiplex ICP | 4~6″ | Dry Etcher | MESC multiplex AOE (Advanced Oxide Etch) |
10 | SPTS (STS) | PRO ICP | 8″ | Dry Etcher | CPX Pegasus Etch System (Deep Reactive Ion Etcher) |
11 | SUSS | MA8 Gen2 | 8″ | Aligner | Aligner |
12 | SUSS | SB8e | 8″ | Bonder | Bonder |
13 | TRION | 4~6″ | Dry Etcher | RIE (Reactive Ion Etcher) |
SS7736-1-2-1-1