Description
ESSEC WIRE BONDER 3100 OPTIMA:
- Bond placement accuracy: ± 2.5 µm (3 sigma)
- Ultrasonic frequency: 130 kHz
- Flying bondhead
- Fixed electrode (EFO currents upto 400 mA)
- Sprint UPH: 17 wires/second (UPH depends on material/ process requirements)
- Maximum bonding area: 52 mm x 70 mm (2″ x 2.7″)
- Process zone temperature: ambient to 300°C
- Various looping profiles, maximum loop length of 9 mm
- Gold and copper wire (17.5 µm–50µm diameter) ball-wedge bonding
Condition: It was complete,working, however due to lack of power supply unable to fully test. Sold As-Is. Complete,working,functional test or refurbished conditions are optional at extra cost.
Valid time: Subject to prior sale without notice.
Contact us (sales@semistarcorp.com) for more info pls. Appreciate your time.
ID-SS380-e
