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Trion Technology Oracle Plasma Etch

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Description

Please contact us for the availability of the Trion Technology Oracle Plasma Etch 200mm used Semiconductor Equipment.

Manufacturer Trion Technology
Model Oracle
Wafer Size Range
  Minimum 50 mm
  Maximum 200 mm
  Set Size 200 mm
Number of Chambers 1
Process Capabilities Oxide Etch
Chamber 1 Description RIE Dielectric Etch
Phantom III RIE Reactor
Controller Type PC Controller Type
Elevator Type Brooks Automation VCE 6
Process Gases CF4, CHF3, Ar, O2

The items are subject to prior sale without notice. These items are only for end users.

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