Description
Semiconductor equipment parts in Asia. Valid Time: Subject to prior sale without notice. These items are only for end user.
Special For Sale
1) TEL TE-8500 ETCHER 8″ & Process Parts 19set
2) ULVAC ENTRON-EX W300 (8CH) 300mm Sputter PVD
3) Nikon OPTIPHOT-300D Inspection MICROSCOPE 12″
4) LEICA DM8000M Inspection Microscope 8″
5) Plasmalab ICP380 & PLASMALAB100 ICP Etcher + PECVD
6) LAM NOVELLUS GASONICS L3510 8″Ashers
7) LAM SEZ 223 Wet
8) DNS SSW-80B-AR Scrubber
9) Hitachi S-8820 CDSEM As-is offer
10) AMAT Edura 5500 300mm PVD 5set
11) Nikon NSR- 2205 i11D Stepper
12) Nikon NSR- 2205 i11D Stepper
SS1159-S-13
Steppers and tracks:
| NO | Machine | Maker | Model | Inch | Resolution |
| 1 | Stepper | Nikon | NSR-S207D | 8″-12″ | 0.11um |
| 2 | Stepper | Nikon | NSR-S208D | 8″-12″ | 0.11um |
| 3 | Stepper | Nikon | NSR-S308F | 12 | 0.12um |
| 4 | Stepper | Nikon | NSR-SF140 | 12 | 0.16um |
| 5 | Stepper | Nikon | NSR-S307 | 8″-12″ | 0.12um |
| 6 | Stepper | Nikon | SF-200 | 6-8 | 0.15um |
| 7 | Stepper | Nikon | SF-130 | 6-9 | 0.16um |
| 8 | Stepper | Nikon | Scanner S305B | 8 | |
| 9 | Stepper | Nikon | Scanner 204B | 6 – 8 | 0.15um |
| 10 | Stepper | Nikon | Scanner 204B | 6 – 8 | 0.15um |
| 11 | Stepper | Nikon | Scanner 203B | 6 – 8 | 0.18um |
| 12 | Stepper | Nikon | NSR-TFH-i14DL | 6 – 8 | 0.5um |
| 13 | Stepper | Nikon | NSR-2205i12D | 6 – 8 | 0.35um |
| 14 | Stepper | Nikon | NSR-2205i11D | 6 – 8 | 0.35um |
| 15 | Stepper | Nikon | NSR-4425i | 6 – 8 | 0.35um |
| 16 | Stepper | Nikon | NSR-2205i11C | 6 – 8 | 0.40um |
| 17 | Stepper | Nikon | NSR-2205i10D | 6 – 8 | 0.45um |
| 18 | Stepper | Nikon | NSR-2205EX14C | 8 | 0.25um |
| 19 | Stepper | Nikon | NSR-1755i8A | 6 – 8 | 0.45um |
| 20 | Stepper | Nikon | NSR-1755i8A | 6 – 8 | 0.45um |
| 21 | Machine | Maker | Model | Inch | Resolution |
| 22 | Stepper | Nikon | NSR-1755G7A | 6 | 0.5um |
| 23 | Stepper | Nikon | NSR-1755i7B | 6 | 0.5um |
| 24 | NSR-1755i7A | 6 | 0.5um | ||
| 25 | Stepper | Nikon | NSR1505 G6E | 6 | 0.65um G-line |
| 26 | Stepper | Canon | FPA3000i4 | 6-8 | 0.35um |
| 28 | Track | TEL | ACT8 (2C2D) | 8 | Double Block |
| 29 | Track | TEL | ACT8 (2C4D) | 8 | Double Block |
| 30 | Track | TEL | ACT12(1C2D) | 12 | Single Block |
| 31 | Track | TEL | CLEAN TRACK ACT 12 | 12 | |
| 32 | Track | TEL | CLEAN TRACK LITHIUS Pro | 12 | |
| 33 | Track | TEL | Mark-8 1C2D | 8 | |
| 34 | Track | TEL | Mark-8 2C2D | 8 | |
| 35 | Track | TEL | Mark-7 1C2D | 8 | |
| 36 | Track | DNS | SK80BW 3C3D | 8 | |
| 37 | Track | DNS | SK80A 2C 1D | 8 |
SS1519-S-13
Used Equipment for sale:
| No | Equip. | Maker | Model | Size |
| 1 | FIB | TESCAN | Ga-FIB S9000G FIB+SEM | 8 |
| 2 | FIB | TESCAN | Xe (Amber X) | 8 |
| 3 | CVD | AMAT | P5000 MarkII | 6 |
| 4 | CVD | AMAT | P5000 MarkII | 6 |
| 5 | CVD | AMAT | Amat Endura 5500 | 8 |
| 6 | PVD | AMAT | Amat Centura | 8 |
| 7 | OVERLAY | KLA-Tencor | 5200XP | 8 |
| 8 | FESEM | Hitachi | SU8040 FESEM | 8 |
| 9 | CDSEM | Hitachi | Hitachi S-8820 | 8 |
| 10 | CDSEM | Hitachi | Hitachi S-8820S | 8 |
| 11 | Track | TEL | TEL Mark8 | 8 |
| 12 | Track | TEL | TEL Mark8 | 8 |
| 13 | Track | TEL | TEL Mark8 | 8 |
| 14 | Track | TEL | TEL ACT8 | 8 |
| 15 | Track | TEL | TEL ACT12 | 12 |
| 16 | CMP | Ebara | F-Rex 300S | 12 |
| 17 | CVD | AMAT | C3 Dual ALTUS | 12 |
| 18 | RTP | AMAT | Centura 1 | 12 |
| 19 | RTP | AMAT | Vantage Vulcan | 12 |
| 20 | RTP | AMAT | Vantage Radiance+ | 12 |
| 21 | Aligner | Canon | MPA600 | 8 |
| 22 | CMP | AMAT | REFLEXION LK | 12 |
| 23 | DIFF | TEL | ALPHA-805 | 8 |
| 24 | DIFF | TEL | ALPHA-8SE | 8 |
| 25 | DIFF | KE | DJ-853V-J3 | 8 |
| 26 | DIFF | KE | DJ-823V | 8 |
| 27 | ETCH | AMAT | P-5000 MXP | 8 |
| 28 | ETCH | AMAT | P-5000 MXP+ | 8 |
| 29 | CVD | AMAT | P-5000 SACVD | 8 |
| 30 | CVD | AMAT | Producer SE | 12 |
| 31 | CVD | AMAT | Producer SE | 12 |
| 32 | ETCH | AMAT | LAM 2300 Exelan Flex Ex | 12 |
| 33 | PVD | AMAT | Endura CL Versa | 12 |
| 34 | ETCH | AMAT | VECTOR EXPRESS | 12 |
| 35 | ETCH | AMAT | STRATA | 12 |
| 36 | CVD | AMAT | Centura WxZ | 12 |
| 37 | ETCH | LAM | 2300 VERSYS KIYO45 | 12 |
| 38 | Wet | LAM | SEZ223 | 8 |
| 39 | PVD | AMAT | Endura 5500 | 12 |
| 40 | Scrubber | DNS | SSW-80B-AR | 8 |
| 41 | CVD | WJ | WJ999 | 8 |
| 42 | ETCH | TEL | TE-8500 & Process Parts 19set | 6 |
| 43 | Ashers | LAM NOVELLUS | GASONICS L3510 Plasma Cleaner | 8 |
| 44 | ICP /CVD | Oxford | Lasmalab ICP380 & PLASMALAB100 ICP Etcher | 8 |
| 45 | Profiler | Veeco | 200Si | 8 |
| 46 | Film Thickness | Rudolph | FE4D | 8 |
| 47 | AFM | Veeco | Demension 5000 | 6~8 |
| 48 | Profiler | KLA-Tencor | P-15 | 6 |
| 49 | WET | DNS | SU-3200 | 12 |
SS1519-S-13
12 inch Used equipment for sale:
| No | Equip. | Maker | Model | Description | |
| 1 | CMP | AMAT | REFLEXION LK | Multi-Process | |
| 2 | CMP | Ebara | F-Rex 300S | STI Oxide CMP System | |
| 3 | CMP | Ebara | F-Rex 300S | W CMP System | |
| 4 | CMP | Ebara | F-Rex 300S | W CMP System | |
| 5 | CVD | AMAT | Producer SE | 3Twin PESIN | |
| 6 | CVD | Lam Novellus | Concept Three Dual ALTUS | W CVD system | |
| 7 | CVD | LAM | VECTOR EXPRESS AHM | AHM | |
| 8 | CVD | LAM | Strata-GX | 3 CH | |
| 9 | ETCH | LAM | 2300 Exelan | Exelan | |
| 10 | PVD | AMAT | Endura | 3CH, 4CH | |
| 11 | PVD | AMAT | Endura CL Versa | TTN 3CH + Degas STD 2CH | |
| 12 | RTP | AMAT | Centura 1 platform + 2 DPN + 2 ISSG Radiance+ |
RTP system with 3 process chambers (gate oxidation & oxide nitridation) |
|
| 13 | RTP | AMAT | Vantage Vulcan | 2 chambers | |
| 14 | RTP | AMAT | Vantage Vulcan | 2 chambers | |
| 15 | RTP | AMAT | Vantage Radiance+ | 2 chambers | |
| 16 | RTP | AMAT | Vantage Radiance | 2 chambers | |
| 17 | WET | LAM | EOS | 8 Chambers (FN IPA+O3+FOM) | |
| 18 | WET | LAM | EOS | 16 Chambers | |
| 19 | WET | TEL | Cellesta+ | 12 chamber | |
| 20 | ETCH | LAM | 2300e5 Exelan | Flex FX | |
| 21 | WET | DNS | SU-3200 | Single Wafer Processing | |
| 22 | Track | TEL | CLEAN TRACK ACT 12 | Single Block (Resist Coater/Developer) | |
| 23 | Track | TEL | CLEAN TRACK ACT 12 | Multi Block (Resist Coater/Developer) | |
| 24 | Track | TEL | CLEAN TRACK LITHIUS | SINGLE BLOCK | |
| 25 | PVD | AMAT | Endura II Aluminum Interconnect | Aluminum Interconnect | |
| 26 | PVD | AMAT | Endura II Chambers | Multiple | |
| 27 | PVD | AMAT | Endura II Front-End | Metallization | |
| 28 | PVD | ULVAC | Entron-EX W300 | Muilt- 8Chamber | |
| 29 | PVD | Lam Novellus | INOVA | ||
| 30 | MET | KLA | Archer 500 AIM | Overlay Measurement System | |
| 31 | MET | KLA | Surfscan SP3 – Shipping Kit | Particle Measurement | |
| 32 | MET | KLA | ASET-F5x | Film Thickness Measurement System | |
| 33 | ETCH | AMAT | Centura AP DPS II Polysilicon | Polysilicon Etch | |
| 34 | ETCH | AMAT | Centura AP DPS AdvantEdge Metal | Metal Etch | |
| 35 | ETCH | AMAT | Centura AP AdvantEdge G5 Metal | Metal Etch | |
| 36 | ETCH | AMAT | Producer | Etch eXT Dielectric | |
| 37 | ETCH | LAM | 2300e6 KIYO EX | Polysilicon Etch | |
| 38 | ETCH | LAM | 2300e6 Exelan Flex HX | Dielectric Etch | |
| 39 | ETCH | LAM | 2300e4 KIYO MCX | Metal Etch | |
| 40 | ETCH | LAM | 2300 KIYO EX | Polysilicon Etch | |
| 41 | ETCH | LAM | 2300 Versys | Metal Etch | |
| 42 | ETCH | LAM | 2300e4 Exelan Flex ES | Dielectric Etch | |
| 43 | ETCH | LAM | 2300e4 Exelan Flex GX | Dielectric Etch | |
| 44 | ETCH | LAM | 2300e4 Exelan | Flex ES | |
| 45 | ETCH | LAM | 2300e4 Exelan | Flex GX | |
| 46 | ETCH | TEL | Tactras Vesta NV3 | NV3 | |
| 47 | ECD | Lam Novellus | SABRE 3D | ECD (Electro Chemical Deposition) | |
| 48 | ETCH | TEL | Tactras NCCP SCCM | NCCP SCCM | |
| 49 | CVD | AMAT | Producer SE | PECVD TEOS | |
| 50 | CVD | TEL | Triase+ Ti/TiN | Metal CVD | |
| 51 | ETCH | TEL | Tactras Vesta NV3 | Polysilicon Etch | |
| 53 | CVD | AMAT | Producer SE | SACVD HARP | |
| 54 | CVD | AMAT | Producer GT | PECVD Silane | |
| 55 | CVD | Lam Novellus | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) | |
| 56 | CVD | TEL | Triase+ | Ti/TiN | |
| 57 | CVD | TEL | Triase+ EX-II Ti/TiN | Metal CVD Ti/TiN | |
| 58 | CVD | Lam Novellus | Concept Three SPEED MAX (LITE) | STI 3CH | |
| 59 | CMP | AMAT | Reflexion LK | Poly/STI | |
| 60 | CMP | AMAT | Reflexion LK | Oxide | |
| 61 | Furnace | Kokusai | ZESTONE DJ-1223VN-DF | HQ-SiO2(SL) | |
| 62 | Furnace | TEL | FORMULA Nitride | Vertical Furnace Nitride | |
| 63 | Furnace | TEL | INDY Plus IRAD Oxide | Vertical Furnace Oxide |
SS1519-S-13
| 1 | Track | DNS | SK80BW 3C3D |
| 2 | Track | DNS | SK80A 2C 1D |
| 3 | CVD | AMAT | P5000 PLIS Standard TEOS USG x3 Chamber |
| 4 | Stepper | Nikon | S203B |
| 5 | Stepper | Nikon | S204B |
| 6 | Stepper | Nikon | NSR 2205 i11D |
| 7 | Stepper | Nikon | NSR 4425 |
| 8 | Defect Review SEM | HITACHI | RS-5500 |
| 9 | PARTICLE COUNTER | KLA | SP3 |
| 10 | Flatness Measuring | KLA (ADE) | AFS-3220 |
| 11 | Wafer sight3 | KLA | PHX DF 5.0 |
| 12 | Surface Profiler | KLA | P-15 |
| 13 | Wafer Inspection | Leica | INM300 |
| 14 | Edge Polisher | BBS | E-450 Prime |
| 15 | Double Size Polisher | Peter Wolters | AC-1500P |
| 16 | Double Size Polisher | Hamai | 300mm |
| 17 | FURNACES | TEL | ALPHA 8S POLC3 |
| 18 | FURNACES | TEL | 805CN LP CVD |
| 19 | MOCVD | AIXTRON | AIX200/4RFS(2″X3) |
| 20 | Sputter | TEAMs | ITO |
| 21 | Evaporator | AST | PEVA-600I |
| 22 | Bonder | EVG | 510 Wafer bonder |
| 23 | Etcher | Amat | Centura2 DPS+ Poly Etch |
| 24 | CVD | AMAT | Centura Ultima |
| 25 | Stepper | Nikon | NSR-2005 I 9C |
| 26 | Stepper | Nikon | NSR 2205 I 12D |
| 27 | Stepper | Nikon | NSR-SF200 |
| 28 | Track | TEL | Mark-7 1C2D |
| 29 | Track | TEL | ACT8 2C4D, Double Block |
| 30 | Track | TEL | ACT12 Single Block |
| 31 | SEM | Hitachi | FESEM S4700 I |
| 32 | SEM | Hitachi | FESEM S4700 II |
| 33 | SEM | Hitachi | FESEM S4800 II |
| 34 | Lithography | Hitachi | HL8000M |
| 35 | Lithography | Hitachi | HL7800M |
| 36 | Prober | TEL | P-12XL Probe |
| 37 | CVD | AMAT | P5000 |
| 38 | Saw | DISCO | DFD641 saw |
| 39 | MOCVD | Aixtron | Crius II |
| 40 | MOCVD | Nippon | Sanso |
| 41 | Etcher | Maxis | 300LA ICP |
| 42 | CVD | AMAT | P5000 |
| 43 | Sputter | ULVAC | ENTRON-EX W300 Chamber(4CH) |
| 44 | Etcher | Plasma | Therm Versaline ICP-RIE #2 PSS ICP 4″x4 |
| 45 | E-Beam | ULVAC | Ulvac ei-5K |
| 46 | E-Beam | ULVAC | Ulvac ei-7K |
| 47 | E-Beam | CHA | Revolution |
| 48 | Aligner | USHIO | UX-4440 Aligner |
| 49 | Track | DNS | SK3000 |
| 50 | Wet | DNS | SU3200 |
| 51 | Wet | DNS | SU3100 |
| 52 | PECVD | Oxford | Plasmalab ICP380 & Plasmalab100 ICP Etcher 100 RIE+PECVD |
| 53 | CMP | Ebara | EPO222 CMP |
| 54 | CMP | Amat | mirra MESA CMP |
| 55 | Track | TEL | Mark V 2C2D |
| 56 | CVD | AMAT | Centura EPI 4CH |
| 57 | Spin wet | SEZ | SP203 |
| 58 | Wet Station | TEL | UW300Z (200mm) |
| 59 | Sputter | Barian | XM90 PVD |
| 60 | Thermal Shock Chamber | ESPEC | TSA-41L-A -70℃ ~300℃ |
| 61 | Thermal Shock Chamber | ESPEC | TSA 715W -65℃~ 200℃ |
| 62 | Temp & Humid Chamber | ESPEC | PR-4KTH -20℃~+180℃ |
| 63 | PECVD | AKT | AKT-1600A |
| 64 | Sputter | ULVAC | SMD450C |
| 65 | Dry Etcher_PE | TEL | ME-450II |
| 66 | Stepper | NIKON | FX601 |
| 67 | Track | TEL | CS450 |
| 68 | Aligner | CANON | MPA3000W |
| 69 | Oven | KOYO | GLO-67-ASN |
| 70 | H/T Thickness Measurment |
K-MAC | ST8000 |
| 71 | Particle Counter | TORAY | IQ530 |
| 72 | Pattern Inspection | KLA | KLA6020 |
| 73 | Pattern Inspection | ORBOTECH | FPI-7098 |
| 74 | Review Station | OLYMPUS | MHL-525 |
SS1159-00-6-1-1















