Description
Semiconductor equipment. Valid Time: Subject to prior sale without notice. These items are only for end user.
| 1 | Advanced Technology Inc. | Cypress GEN2 | Lead Inspection Equipment |
| 2 | Advanced Technology Inc. | Cypress | Lead Inspection Equipment |
| 3 | Advantest | R3768 | Network Analyzer |
| 4 | Advantest | T5377S | Memory Tester |
| 5 | Agilent Technologies Inc. | 7500 | Spectrometry |
| 6 | Alcatel | ADS 1202H | Dry Pump |
| 7 | Alcatel | ADP 81 | Dry Pump |
| 8 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch |
| 9 | Applied Materials (AMAT) | Centura AP DPS II Metal | Metal Etch |
| 10 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 11 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 12 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Minos Poly | Polysilicon Etch |
| 13 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 14 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 15 | Applied Materials (AMAT) | Endura II Copper Barrier/Seed | PVD (Physical Vapor Deposition) |
| 16 | Applied Materials (AMAT) | Centura AP iSprint | Metal CVD (Chemical Vapor Deposition) |
| 17 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 18 | Applied Materials (AMAT) | Producer Etch XT Dielectric | Dielectric Etch |
| 19 | Applied Materials (AMAT) | Producer Etch XT Dielectric | Dielectric Etch |
| 20 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 21 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 22 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 23 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 24 | Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) |
| 25 | Applied Materials (AMAT) | Centura AP DPS II Metal | Metal Etch |
| 26 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
| 27 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
| 28 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 29 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly | Polysilicon Etch |
| 30 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal – Chamber Only | Metal Etch |
| 31 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal – Chamber Only | Metal Etch |
| 32 | Applied Materials (AMAT) | Reflexion | Multi-Process CMP |
| 33 | Applied Materials (AMAT) | Reflexion | Multi-Process CMP |
| 34 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 35 | Applied Materials (AMAT) | Producer Etch eXT Poly | Polysilicon Etch |
| 36 | Applied Materials (AMAT) | SEMVision G3 | SEM – Defect Review (DR) |
| 37 | Applied Materials (AMAT) | SEMVision G3 Lite | SEM – Defect Review (DR) |
| 38 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 39 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 40 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 41 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 42 | Applied Materials (AMAT) | Centura AdvantEdge Mesa2 | Polysilicon Etch |
| 43 | Applied Materials (AMAT) | Centris AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 44 | Applied Materials (AMAT) | Reflexion – Dielectric | Dielectric CMP |
| 45 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 46 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch |
| 47 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 48 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch |
| 49 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 50 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 51 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 52 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 53 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 54 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 55 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 56 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 57 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 58 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 59 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 60 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 61 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 62 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 63 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 64 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 65 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 66 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 67 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 68 | ASM International | Eagle XP EmerALD | ALD (Atomic Layer Deposition) |
| 69 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 70 | ASM International | A412 Anneal | Vertical Furnace |
| 71 | ASM International | A412 Anneal | Vertical Furnace |
| 72 | ASM International | A412 Anneal | Vertical Furnace |
| 73 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 74 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 75 | ASM International | A412 Anneal | Vertical Furnace |
| 76 | ASM International | A412 Doped Poly | Vertical Furnace |
| 77 | ASML | YieldStar S-200B | Overlay Measurement System |
| 78 | ASML | YieldStar S-250 | Overlay Measurement System |
| 79 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
| 80 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
| 81 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
| 82 | Axcelis Technologies Inc. | HE3 | High Energy Implanter |
| 83 | BOC Edwards | Spectra-N | Nitrogen Generator |
| 84 | CAMECA | EX-300 | Implant Dosing Measurement |
| 85 | Canon | Surpass 300 | Stripper/Asher |
| 86 | Canon | Surpass 320 | Stripper/Asher |
| 87 | Canon | Surpass 320 | Stripper/Asher |
| 88 | Canon | Surpass 320 | Stripper/Asher |
| 89 | Canon | FPA-6000 ES5 | 248nm (KrF) Scanner |
| 90 | Canon | Surpass 300 | Stripper/Asher |
| 91 | Canon | Surpass 300 | Stripper/Asher |
| 92 | Canon | Surpass 300 | Stripper/Asher |
| 93 | Canon | Surpass 300 | Stripper/Asher |
| 94 | Canon | Surpass 300 | Stripper/Asher |
| 95 | Canon | Surpass 300 | Stripper/Asher |
| 96 | Canon | Surpass 300 | Stripper/Asher |
| 97 | Canon | Surpass 300 | Stripper/Asher |
| 98 | Canon | Surpass 300 | Stripper/Asher |
| 99 | Canon | Surpass 300 | Stripper/Asher |
| 100 | Canon | Surpass 300 | Stripper/Asher |
| 101 | Carl Zeiss Group | Axiotron 300 | Microscope |
| 102 | Cascade | Alessi REL-5500 | Engineering Wafer Prober |
| 103 | Cooljag Thermal Solutions | SP3-D/SQ | CPU Cooling Fan |
| 104 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 105 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 106 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 107 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 108 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 109 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
| 110 | Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) |
| 111 | Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) |
| 112 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 113 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
| 114 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
| 115 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 116 | Despatch Industries | LND 2-11 | Cure Oven |
| 117 | Disco Hi-Tec | DFL7361 | Laser Saw |
| 118 | Ebara | FREX300S | Dielectric CMP |
| 119 | Edwards | HMB3000 | Booster of dry pump |
| 120 | Edwards | Atlas TPU+WESP | Abatement – Scrubber |
| 121 | Edwards | IH1800 | Dry Pump |
| 122 | Edwards | iH1800SC | Dry Pump |
| 123 | Edwards | iH80 | Dry Pump |
| 124 | Edwards | IGX100M | Dry Pump |
| 125 | Edwards | QDP40 | Dry Pump |
| 126 | ESCO Ltd. | EMD-WA1000S | Temperature Desorption Analyzer |
| 127 | Espec | IPHH-201 | Environmental Chamber |
| 128 | Espec | IPHH-201 | Environmental Chamber |
| 129 | Espec | EGNU28-12CWL | Environmental Chamber |
| 130 | Espec | ESX-3CW | Environmental Chamber |
| 131 | EVGA Corporation | Supernova 1300 G2 | PC Power Supplies |
| 132 | EVGA Corporation | 850 GQ | PC Power Supplies |
| 133 | FA Systems Automation (S) Pte Ltd. | Wire Bond Inspection | Wire bond inspection (3VI/3O) |
| 134 | FEI Company | Tecnai G2 F30 | TEM |
| 135 | Graco Inc. | Therm-O-Flow 20 | Hot Melt System |
| 136 | Graco Inc. | Therm-O-Flow 20 | Hot Melt System |
| 137 | GS Industry | Parts Cleaner (Organic) | Parts Cleaner/Dryer |
| 138 | Hermes Microvision (HMI) | eP3 XP | E-beam Inspection |
| 139 | Hermes Microvision (HMI) | eP3 XP | E-beam Inspection |
| 140 | Hitachi | RCF3550AZP1 | Chiller/Heat Exchanger |
| 141 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 142 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 143 | Hitachi (Semiconductor) | CG-4100 | SEM – Critical Dimension (CD) Measurement |
| 144 | Hitachi (Semiconductor) | CG-4100 | SEM – Critical Dimension (CD) Measurement |
| 145 | Hitachi (Semiconductor) | CG-4100 | SEM – Critical Dimension (CD) Measurement |
| 146 | Hitachi (Semiconductor) | CG-4100 | SEM – Critical Dimension (CD) Measurement |
| 147 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 148 | Hitachi (Semiconductor) | U-702 | Metal Etch |
| 149 | Hitachi (Semiconductor) | U-702 | Metal Etch |
| 150 | JEOL | JWS-7555 | SEM – Defect Review (DR) |
| 151 | JEOL | JFS-9855S | Focused Ion Beam System |
| 152 | JUSUNG Engineering Co., Ltd. | Cyclone Plus | ALD (Atomic Layer Deposition) |
| 153 | JUSUNG Engineering Co., Ltd. | Cyclone Plus | ALD (Atomic Layer Deposition) |
| 154 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 155 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 156 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 157 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 158 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 159 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 160 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 161 | kaijo | KRF-300 | Carrier/Pod Cleaner |
| 162 | Keysight / Agilent / Hewlett-Packard (HP) | 41000 | Parametric Tester |
| 163 | Keysight / Agilent / Hewlett-Packard (HP) | 4284A | LCR & Resistance Meter |
| 164 | KLA-Tencor Corp. | KLA-TENCOR DUAL SMIF HANDLER | Parts/Options |
| 165 | KLA-Tencor Corp. | eS20XP | E-beam Inspection |
| 166 | KLA-Tencor Corp. | eS37 | E-beam Inspection |
| 167 | KLA-Tencor Corp. | eS32 | E-beam Inspection |
| 168 | KLA-Tencor Corp. | WaferSight | Wafer Characterization |
| 169 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
| 170 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
| 171 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
| 172 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
| 173 | KLA-Tencor Corp. | eS32 | E-beam Inspection |
| 174 | KLA-Tencor Corp. | eS32 | E-beam Inspection |
| 175 | KLA-Tencor Corp. | Archer 300 AIM | Overlay Measurement System |
| 176 | KLA-Tencor Corp. | KLA-TENCOR DUAL OPEN HANDLER | Parts/Options |
| 177 | KLA-Tencor Corp. | Surfscan SP2 | Particle Measurement |
ID-SS5319-0-9
