Description
Semiconductor equipment from Fabs. Valid Time: Subject to prior sale without notice. These items are only for end user.
| 1 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 2 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 3 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 4 | Accretech/TSK | UF3000EX-e | Production Wafer Prober |
| 5 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 6 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 7 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 8 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 9 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 10 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 11 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 12 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 13 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 14 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 15 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 16 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 17 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 18 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 19 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 20 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 21 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 22 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 23 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 24 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 25 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 26 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 27 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 28 | Accretech/TSK | UF3000 | Production Wafer Prober |
| 29 | Adcotech Corp. | 11-602 | Lead Trim |
| 30 | Advanced Technology Inc. | Cypress GEN2 | Lead Inspection Equipment |
| 31 | Advanced Technology Inc. | Cypress | Lead Inspection Equipment |
| 32 | Advanced Thermal Sciences (ATS) | DEX-20A | Chiller/Heat Exchanger |
| 33 | Advantest | R3768 | Network Analyzer |
| 34 | Advantest | T5383 | Memory Tester |
| 35 | Advantest | T5383 | Memory Tester |
| 36 | Advantest | T5383 | Memory Tester |
| 37 | Advantest | T5383 | Memory Tester |
| 38 | Advantest | T5383 | Memory Tester |
| 39 | Advantest | T5383 | Memory Tester |
| 40 | Advantest | T5383 | Memory Tester |
| 41 | Advantest | T5383 | Memory Tester |
| 42 | Advantest | T5385 | Memory Tester |
| 43 | Advantest | T5385 | Memory Tester |
| 44 | Advantest | T5385 | Memory Tester |
| 45 | Advantest | T5385 | Memory Tester |
| 46 | Advantest | T5385 | Memory Tester |
| 47 | Advantest | T5385 | Memory Tester |
| 48 | Advantest | T5385 | Memory Tester |
| 49 | Advantest | T5385 | Memory Tester |
| 50 | Advantest | T5385 | Memory Tester |
| 51 | Advantest | T5385 | Memory Tester |
| 52 | Aetrium | 1164 | Dynamic Life Test System |
| 53 | Agilent Technologies Inc. | 7500 | Spectrometry |
| 54 | Airgard | Cyclone | Abatement – Exhaust Management System |
| 55 | Alcatel | A1803H | Dry Pump |
| 56 | Alcatel | ADS 1802H | Dry Pump |
| 57 | Alcatel | ADS1802P | Dry Pump |
| 58 | Alcatel | ADS 1202H | Dry Pump |
| 59 | Alcatel | ADP 81 | Dry Pump |
| 60 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch |
| 61 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 62 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 63 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Minos Poly | Polysilicon Etch |
| 64 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 65 | Applied Materials (AMAT) | VeritySEM 4i | SEM – Critical Dimension (CD) Measurement |
| 66 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 67 | Applied Materials (AMAT) | Endura II Copper Barrier/Seed | PVD (Physical Vapor Deposition) |
| 68 | Applied Materials (AMAT) | Centura AP iSprint | Metal CVD (Chemical Vapor Deposition) |
| 69 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 70 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 71 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 72 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 73 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 74 | Applied Materials (AMAT) | Endura II Liner/Barrier | PVD (Physical Vapor Deposition) |
| 75 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
| 76 | Applied Materials (AMAT) | Centura AP AdvantEdge G5 Mesa T2 Poly | Polysilicon Etch |
| 77 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 78 | Applied Materials (AMAT) | Centura AP – Mainframe Only (Poly Etch) | Polysilicon Etch |
| 79 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Metal – Chamber Only | Metal Etch |
| 80 | Applied Materials (AMAT) | Centura AP DPS AdvantEdge G2 Poly – Chamber Only | Polysilicon Etch |
| 81 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 82 | Applied Materials (AMAT) | Producer Etch eXT Poly | Polysilicon Etch |
| 83 | Applied Materials (AMAT) | SEMVision G3 | SEM – Defect Review (DR) |
| 84 | Applied Materials (AMAT) | SEMVision G3 Lite | SEM – Defect Review (DR) |
| 85 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 86 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 87 | Applied Materials (AMAT) | Centura AP Ultima X | HDP CVD (Chemical Vapor Deposition) |
| 88 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch |
| 89 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 90 | Applied Materials (AMAT) | Centura AdvantEdge Mesa2 | Polysilicon Etch |
| 91 | Applied Materials (AMAT) | Centris AdvantEdge G5 Mesa Poly | Polysilicon Etch |
| 92 | Applied Materials (AMAT) | Reflexion LK Tungsten | Tungsten CMP |
| 93 | Applied Materials (AMAT) | Producer SE APF | PECVD (Chemical Vapor Deposition) |
| 94 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 95 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 96 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 97 | Applied Materials (AMAT) | Endura II Aluminum Interconnect | PVD (Physical Vapor Deposition) |
| 98 | Applied Materials (AMAT) | SEMVision G3 | SEM – Defect Review (DR) |
| 99 | Applied Materials (AMAT) | Centura AP Enabler | Dielectric Etch |
| 100 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 101 | Applied Materials (AMAT) | Centura AP eMax CT | Dielectric Etch |
| 102 | Applied Materials (AMAT) | Endura II Front-End Metallization | PVD (Physical Vapor Deposition) |
| 103 | Applied Materials (AMAT) | Producer GT Eterna FCVD | PECVD (Chemical Vapor Deposition) |
| 104 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 105 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 106 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 107 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 108 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 109 | Applied Materials AKT | AKT Applied G6 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 110 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 111 | Applied Materials AKT | AKT Applied G5 PECVD 5.7 | PECVD (Chemical Vapor Deposition) |
| 112 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 113 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 114 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 115 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 116 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 117 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 118 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 119 | ASM International | Eagle XP EmerALD | ALD (Atomic Layer Deposition) |
| 120 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 121 | ASM International | A412 Anneal | Vertical Furnace |
| 122 | ASM International | A412 Anneal | Vertical Furnace |
| 123 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 124 | ASM International | Eagle XP | PECVD (Chemical Vapor Deposition) |
| 125 | ASM International | A412 Anneal | Vertical Furnace |
| 126 | ASM International | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) |
| 127 | ASM International | A412 Doped Poly | Vertical Furnace |
| 128 | ASM Pacific Technology Ltd. | AB530 | Wire Bonder |
| 129 | ASML | YieldStar S-200B | Overlay Measurement System |
| 130 | ASML | YieldStar S-250 | Overlay Measurement System |
| 131 | Assembly Technologies | M-800 | Wafer Mounter |
| 132 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
| 133 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
| 134 | Aviza Technology, Inc. | RVP-300 | Vertical Furnace |
| 135 | Axcelis Technologies Inc. | HE3 | High Energy Implanter |
| 136 | Bausch & Lomb | StereoZoom 4 | Microscope |
| 137 | Bausch & Lomb | StereoZoom 4 | Microscope |
| 138 | Bausch & Lomb | StereoZoom 4 | Microscope |
| 139 | BOC Edwards | Spectra-N | Nitrogen Generator |
| 140 | Bold Technologies, Inc. | Bold Wet Bench | Batch Wafer Processing |
| 141 | CAMECA | EX-300 | Implant Dosing Measurement |
| 142 | Canon | Surpass 320 | Stripper/Asher |
| 143 | Canon | Surpass 320 | Stripper/Asher |
| 144 | Canon | Surpass 320 | Stripper/Asher |
| 145 | Canon | Surpass 320 | Stripper/Asher |
| 146 | Canon | Surpass 320 | Stripper/Asher |
| 147 | Canon | FPA-6000 ES5 | 248nm (KrF) Scanner |
| 148 | Canon | Surpass 300 | Stripper/Asher |
| 149 | Canon | Surpass 300 | Stripper/Asher |
| 150 | Canon | Surpass 300 | Stripper/Asher |
| 151 | Canon | Surpass 300 | Stripper/Asher |
| 152 | Canon | Surpass 300 | Stripper/Asher |
| 153 | Canon | Surpass 300 | Stripper/Asher |
| 154 | Canon | Surpass 300 | Stripper/Asher |
| 155 | Canon | Surpass 300 | Stripper/Asher |
| 156 | Canon | Surpass 300 | Stripper/Asher |
| 157 | Canon | Surpass 300 | Stripper/Asher |
| 158 | Canon | Surpass 300 | Stripper/Asher |
| 159 | Carl Zeiss Group | Axiotron 300 | Microscope |
| 160 | Cascade | Alessi REL-5500 | Engineering Wafer Prober |
| 161 | Cascade | Summit 12000 | Engineering Wafer Prober |
| 162 | CIM / IASON | CUL-WE44-1-B-D-01 | Chiller/Heat Exchanger |
| 163 | Clean Rooms International Inc. | Q523.6247.62G03T3 – Laminar Flow Hood | Fume Hood Workstation |
| 164 | Clean Rooms International Inc. | SAM24MS – Laminar Flow Hood | Fume Hood Workstation |
| 165 | Cohu, Inc. | Ismeca NY20 | Test Handler |
| 166 | Control Laser Corporation. | FALIT | Package Auto Decap System |
| 167 | Cooljag Thermal Solutions | SP3-D/SQ | CPU Cooling Fan |
| 168 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 169 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 170 | Dainippon Screen Mfg. Co. (DNS) | SS-3000 | Wafer Scrubber |
| 171 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 172 | Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) |
| 173 | Dainippon Screen Mfg. Co. (DNS) | SC-W80A-AVG | Spin On Glass (SOG) |
| 174 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 175 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
| 176 | Dainippon Screen Mfg. Co. (DNS) | MP-3000 | Single Wafer Processing |
| 177 | Dainippon Screen Mfg. Co. (DNS) | SU-3000 | Single Wafer Processing |
| 178 | Dainippon Screen Mfg. Co. (DNS) | FC-3000 | Batch Wafer Processing |
| 179 | DAS | ESCAPE DUO | Chemical/Gas Treatment System |
| 180 | DAS | ESCAPE DUO | Chemical/Gas Treatment System |
| 181 | Despatch Industries | LND 2-11 | Cure Oven |
| 182 | DIGI Matex Inc. | DC-120 | Balance/Scales |
| 183 | Disco Hi-Tec | DFL7361 | Laser Saw |
| 184 | Ebara | FREX300S2 | Multi-Process CMP |
| 185 | Ebara | FREX300S2 | Multi-Process CMP |
| 186 | Ebara | FREX300 | Dielectric CMP |
| 187 | Ebara | FREX300S | Tungsten CMP |
| 188 | Ebara | Various | Dry Pump |
| 189 | Ebara | FREX300S | Dielectric CMP |
| 190 | Edwards | GX600N | Dry Pump |
| 191 | Edwards | iXH4550HT | Dry Pump |
| 192 | Edwards | Atlas Etch | Abatement – Scrubber |
| 193 | Edwards | HMB3000 | Booster of dry pump |
| 194 | Edwards | Atlas TPU+WESP | Abatement – Scrubber |
| 195 | Edwards | IH1800 | Dry Pump |
| 196 | Edwards | iH1800SC | Dry Pump |
| 197 | Edwards | iH80 | Dry Pump |
| 198 | Edwards | IGX100M | Dry Pump |
| 199 | Edwards | QDP40 | Dry Pump |
| 200 | Electro Scientific Industries | 9850 | Laser Repair System |
| 201 | Electro Scientific Industries | 9850 | Laser Repair System |
| 202 | Electro Scientific Industries | 9850 | Laser Repair System |
| 203 | Electro Scientific Industries | 9850 | Laser Repair System |
| 204 | Electro Scientific Industries | 9850 | Laser Repair System |
| 205 | ESCO Ltd. | EMD-WA1000S | Temperature Desorption Analyzer |
| 206 | Espec | IPHH-201 | Environmental Chamber |
| 207 | Espec | IPHH-201 | Environmental Chamber |
| 208 | Espec | EGNU28-12CWL | Environmental Chamber |
| 209 | Espec | ESX-3CW | Environmental Chamber |
| 210 | EVGA Corporation | Supernova 1300 G2 | PC Power Supplies |
| 211 | EVGA Corporation | 850 GQ | PC Power Supplies |
| 212 | FA Systems Automation (S) Pte Ltd. | Wire Bond Inspection | Wire bond inspection (3VI/3O) |
| 213 | FEI Company | Tecnai G2 F30 | TEM |
| 214 | Flowstar Inc. | 3×10 CAA3060 Laminar Flow Hood | Fume Hood Workstation |
| 215 | Flowstar Inc. | 4×10 CAA3060 Laminar Flow Hood | Fume Hood Workstation |
| 216 | Flowstar Inc. | 3×10 CAA3060 Laminar Flow Hood | Fume Hood Workstation |
| 217 | FLUKE | Various | Digital Multimeter |
| 218 | General Electric (GE) | Phoenix aminer | X-ray Inspection |
| 219 | Graco Inc. | Therm-O-Flow 20 | Hot Melt System |
| 220 | Graco Inc. | Therm-O-Flow 20 | Hot Melt System |
| 221 | Hermes Microvision (HMI) | eP3 XP | E-beam Inspection |
| 222 | Hermes Microvision (HMI) | eP3 XP | E-beam Inspection |
| 223 | Hitachi | RCF3550AZP1 | Chiller/Heat Exchanger |
| 224 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 225 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 226 | Hitachi (Semiconductor) | CG-4100 | SEM – Critical Dimension (CD) Measurement |
| 227 | Hitachi (Semiconductor) | S-9360 | SEM – Critical Dimension (CD) Measurement |
| 228 | Hitachi (Semiconductor) | S-9360 | SEM – Critical Dimension (CD) Measurement |
| 229 | Hitachi (Semiconductor) | U-7050A | Metal Etch |
| 230 | Hitachi (Semiconductor) | HL-800D | E-beam Lithography System |
| 231 | Hitachi (Semiconductor) | CG-4100 | SEM – Critical Dimension (CD) Measurement |
| 232 | Hitachi (Semiconductor) | CG-4100 | SEM – Critical Dimension (CD) Measurement |
| 233 | Hitachi (Semiconductor) | U-702 | Metal Etch |
| 234 | Hitachi (Semiconductor) | U-702 | Metal Etch |
| 235 | HSEB Dresden GMBH | Axiospect 300 | Optical Review System |
| 236 | IAS / Integrated Air Systems Inc. | LFM5 Laminar Flow Hood | Fume Hood Workstation |
| 237 | JEOL | JWS-7555 | SEM – Defect Review (DR) |
| 238 | JEOL | JFS-9855S | Focused Ion Beam System |
| 239 | JULABO GmbH | PRESTO W85 | Chiller/Heat Exchanger |
| 240 | JUSUNG Engineering Co., Ltd. | Cyclone Plus | ALD (Atomic Layer Deposition) |
| 241 | JUSUNG Engineering Co., Ltd. | Cyclone Plus | ALD (Atomic Layer Deposition) |
| 242 | Kashiyama Ind., Ltd. | SDE1203TZ | Dry Pump |
| 243 | Kashiyama Ind., Ltd. | ME40K | Dry Pump |
| 244 | Keysight / Agilent / Hewlett-Packard (HP) | 4082A | Parametric Tester |
| 245 | Keysight / Agilent / Hewlett-Packard (HP) | 41000 | Parametric Tester |
| 246 | Keysight / Agilent / Hewlett-Packard (HP) | 4284A | LCR & Resistance Meter |
| 247 | Keysight / Agilent / Hewlett-Packard (HP) | 4082A | Parametric Tester |
| 248 | KLA-Tencor Corp. | KLA-TENCOR DUAL SMIF HANDLER | Parts/Options |
| 249 | KLA-Tencor Corp. | KLA-TENCOR DUAL SMIF HANDLER | Parts/Options |
| 250 | KLA-Tencor Corp. | eS20XP | E-beam Inspection |
| 251 | KLA-Tencor Corp. | eS37 | E-beam Inspection |
| 252 | KLA-Tencor Corp. | eS32 | E-beam Inspection |
| 253 | KLA-Tencor Corp. | WaferSight | Wafer Characterization |
| 254 | KLA-Tencor Corp. | Archer 10 | Overlay Measurement System |
| 255 | KLA-Tencor Corp. | Archer 10 | Overlay Measurement System |
| 256 | KLA-Tencor Corp. | 2800 | Brightfield Inspection |
| 257 | KLA-Tencor Corp. | TeraScan STARLight 536 | Reticle Inspection |
| 258 | KLA-Tencor Corp. | AIT UV | Darkfield Inspection |
| 259 | KLA-Tencor Corp. | eS32 | E-beam Inspection |
| 260 | KLA-Tencor Corp. | eS32 | E-beam Inspection |
| 261 | KLA-Tencor Corp. | Surfscan SP3 | Particle Measurement |
| 262 | KLA-Tencor Corp. | Archer 100 | Overlay Measurement System |
| 263 | KLA-Tencor Corp. | KLA-TENCOR DUAL OPEN HANDLER | Parts/Options |
| 264 | Kokusai Electric Co., Ltd | Zestone III Alloy | Vertical Furnace |
| 265 | Kokusai Electric Co., Ltd | Zestone-V(B) DJ-1205V | Vertical Furnace |
| 266 | Kokusai Electric Co., Ltd | Zestone-V(B) DD-1205V | Vertical Furnace |
| 267 | Kokusai Electric Co., Ltd | Zestone-V(B) DD-1205V | Vertical Furnace |
| 268 | Kokusai Electric Co., Ltd | Quixace II Poly | Vertical Furnace |
| 269 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 270 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 271 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 272 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 273 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 274 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 275 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 276 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 277 | Kokusai Electric Co., Ltd | Quixace Nitride | Vertical Furnace |
| 278 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 279 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiN | Vertical Furnace |
| 280 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiN | Vertical Furnace |
| 281 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiN | Vertical Furnace |
| 282 | Kokusai Electric Co., Ltd | Zestone-III: DD-1223V | Vertical Furnace |
| 283 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiN | Vertical Furnace |
| 284 | Kokusai Electric Co., Ltd | Quixace II Nitride | Vertical Furnace |
| 285 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiN | Vertical Furnace |
| 286 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiN | Vertical Furnace |
| 287 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiN | Vertical Furnace |
| 288 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiO2 | Vertical Furnace |
| 289 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiO2 | Vertical Furnace |
| 290 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiO2 | Vertical Furnace |
| 291 | Kokusai Electric Co., Ltd | Quixace Ultimate ALD SiO2 | Vertical Furnace |
| 292 | Kokusai Electric Co., Ltd | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 293 | Kokusai Electric Co., Ltd | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 294 | Kokusai Electric Co., Ltd | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 295 | Kokusai Electric Co., Ltd | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 296 | Kokusai Electric Co., Ltd | Quixace II Doped Poly | Vertical Furnace |
| 297 | Kokusai Electric Co., Ltd | Quixace II Doped Poly | Vertical Furnace |
| 298 | Kokusai Electric Co., Ltd | Quixace II Doped Poly | Vertical Furnace |
| 299 | Kokusai Electric Co., Ltd | Quixace Nitride | Vertical Furnace |
| 300 | Kokusai Electric Co., Ltd | Zestone-III(C) DJ-1223V | Vertical Furnace |
| 301 | Kulicke & Soffa (KnS/ADT/Alphasem) | 982 | Wafer Dicing Saw |
| 302 | Kulicke & Soffa (KnS/ADT/Alphasem) | 1488 | Wire Bonder |
| 303 | Kulicke & Soffa (KnS/ADT/Alphasem) | 1488 | Wire Bonder |
| 304 | Kulicke & Soffa (KnS/ADT/Alphasem) | 484-8 | Wire Bonder |
| 305 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch |
| 306 | LAM Research | 2300 Exelan Flex EX | Dielectric Etch |
| 307 | LAM Research | 2300 Exelan Flex EX+ – Chamber Only | Dielectric Etch |
| 308 | LAM Research | 2300 Exelan Flex EX+ | Dielectric Etch |
| 309 | LAM Research | 2300 Exelan Flex – Chamber Only | Dielectric Etch |
| 310 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 311 | LAM Research | Rainbow 4720 | Metal Etch |
| 312 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 313 | LAM Research | 2300 Exelan | Dielectric Etch |
| 314 | LAM Research | 2300 Exelan | Dielectric Etch |
| 315 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch |
| 316 | LAM Research | 2300 Exelan Flex FX | Dielectric Etch |
| 317 | LAM Research | 2300 Versys Metal – Chamber Only | Metal Etch |
| 318 | LAM Research | 2300 Versys Metal – Chamber Only | Metal Etch |
| 319 | LAM Research | 2300 Versys Metal – Chamber Only | Metal Etch |
| 320 | LAM Research | 2300 Versys Metal – Chamber Only | Metal Etch |
| 321 | LAM Research | 2300 Versys KIYO Poly | Polysilicon Etch |
| 322 | LAM Research | 2300 KIYO Metal/HiK | Metal Etch |
| 323 | LAM Research | 2300 Versys KIYO Poly | Polysilicon Etch |
| 324 | LAM Research | 2300 Exelan Flex | Dielectric Etch |
| 325 | LAM Research | 2300 Versys KIYO Poly | Polysilicon Etch |
| 326 | LAM Research | 2300 KIYO MCX | Metal Etch |
| 327 | Leica Inc. | INS10 | Microscope |
| 328 | Leica Inc. | INM20 | Microscope |
| 329 | Leica Inc. | LDS3300C | Macro-Defect |
| 330 | Linear Technology | 208 volt Power conditioner | Power Conditioner |
| 331 | Mattson Technology, Inc. | Aspen III ICP | Stripper/Asher |
| 332 | Mattson Technology, Inc. | Aspen III ICP | Stripper/Asher |
| 333 | Micro Automation, Inc. | M-1006 | Saws |
| 334 | miscellaneous furniture | Office Tables and Chairs | Office |
| 335 | Mitsubishi | DWC-90 | Wire EDM (Electrical Discharge Machine) |
| 336 | MIYACHI UNITEK | Micropull III | Bond / Wire Pull Tester |
| 337 | MPI Corporation | LEDA P6801 | LED Die Prober |
| 338 | MSI | N210-MD1G/D3 | Graphics Cards |
| 339 | MSI | GT 710-1GD3H LP | Graphics Cards |
| 340 | Muratec Murata Machinery, Ltd. | SRC330 | Wafer Stocker |
| 341 | Nikon | AMI-3300 | Macro-Defect |
| 342 | Nikon | AMI-3300 | Macro-Defect |
| 343 | Nikon | OPTIPHOT 200C | Microscope |
| 344 | Nikon | AMI-3500 | Macro-Defect |
| 345 | Nikon | OPTIPHOT 200C | Microscope |
| 346 | Nikon | ECLIPSE L300N | Microscope |
| 347 | Nikon | ECLIPSE L300N | Microscope |
| 348 | Nikon | ECLIPSE L300N | Microscope |
| 349 | Nikon | ECLIPSE L300N | Microscope |
| 350 | Nikon | ECLIPSE L300N | Microscope |
| 351 | Nikon | OPTISTATION V | Optical Review System |
| 352 | Nikon | OPTISTATION V | Optical Review System |
| 353 | Nikon | OPTISTATION 3100 | Optical Review System |
| 354 | Nikon | OPTISTATION 3100 | Optical Review System |
| 355 | NISHIYAMA | TWW-24KCPVB-5P | Chiller/Heat Exchanger |
| 356 | Nordson Asymtek | S2-930 | Adhesive Dispenser |
| 357 | Nordson Asymtek | S2-930 | Adhesive Dispenser |
| 358 | Novellus Systems Inc. | Concept Three Altus Max EFX | WCVD (Chemical Vapor Deposition) |
| 359 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 360 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 361 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 362 | Novellus Systems Inc. | GAMMA Express | Stripper/Asher |
| 363 | Novellus Systems Inc. | Concept Three Altus Max | WCVD (Chemical Vapor Deposition) |
| 364 | Novellus Systems Inc. | VECTOR Express | PECVD (Chemical Vapor Deposition) |
| 365 | Novellus Systems Inc. | VECTOR Express | PECVD (Chemical Vapor Deposition) |
| 366 | Novellus Systems Inc. | VECTOR Express | PECVD (Chemical Vapor Deposition) |
| 367 | Novellus Systems Inc. | SABRE | ECD (Electro Chemical Deposition) |
| 368 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 369 | Novellus Systems Inc. | Concept Three Altus | WCVD (Chemical Vapor Deposition) |
| 370 | Novellus Systems Inc. | Concept Three Speed MAX | HDP CVD (Chemical Vapor Deposition) |
| 371 | NPC incorporated | EL Inspection Machine | EL/PL Inspection |
| 372 | NPC incorporated | VARIOUS ASSEMBLIES | VARIOUS ASSEMBLIES |
| 373 | NPC incorporated | EL Inspection Machine | EL/PL Inspection |
| 374 | NPC incorporated | EL Inspection Machine | EL/PL Inspection |
| 375 | Olympus | AL3100 | Macro-Defect |
| 376 | Olympus | VMZ | Microscope |
| 377 | Olympus | BH-2 | Microscope |
| 378 | Olympus | Beta | Microscope |
| 379 | Orthodyne Electronics | M20B | Wire Bonder |
| 380 | Oxford Instruments | Plasmalab 80 Plus | Multi-Process Etch |
| 381 | Oxford Instruments | X-Strata980 | X-ray Fluorescence Spectrometer |
| 382 | P.S.K. Tech Inc. | Supra IV | Stripper/Asher |
| 383 | Pfeiffer Vacuum GmbH | Various | Dry Pump |
| 384 | Philips | PW2830 | X-ray Fluorescence Spectrometer |
| 385 | Philips | PW2830 | X-ray Fluorescence Spectrometer |
| 386 | Plasma System Corp. | DES-220 | Stripper/Asher |
| 387 | Plasma System Corp. | SA-2000 | Stripper/Asher |
| 388 | Plasma-Therm I.P. Inc. | 790 Etch | Multi-Process Etch |
| 389 | Plasma-Therm I.P. Inc. | BatchTop VII PECVD | PECVD (Chemical Vapor Deposition) |
| 390 | PVA TePla America, Inc. | M4L | Plasma Cleaner |
| 391 | ReVera | RVX1000 | Film Thickness Measurement System |
| 392 | ReVera | RVX1000 | Film Thickness Measurement System |
| 393 | Rigaku | MFM310 | X-ray Reflectivity (XRR) |
| 394 | Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger |
| 395 | Risshi / Maruyama | YR-8020SC | Chiller/Heat Exchanger |
| 396 | Robert Bürkle GmbH | YPSATOR 2022-5S | Cooling Press |
| 397 | Robert Bürkle GmbH | YPSATOR 2022-5S | Cooling Press |
| 398 | Robert Bürkle GmbH | RCF-12M1800 | Roller Coater |
| 399 | Rorze | RSC222 | Wafer Sorter |
| 400 | Rorze | RSC222 | Wafer Sorter |
| 401 | Royce Instruments | DE22 | Die Ejector |
| 402 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 403 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 404 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 405 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 406 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 407 | Rudolph Technologies, Inc. | NSX 105 | Macro-Defect |
| 408 | S.E.S. CO., LTD. | BW3000X | Batch Wafer Processing |
| 409 | S.E.S. CO., LTD. | BW3000X | Batch Wafer Processing |
| 410 | Semiconductor Equipment Corp.(SEC) | Model 860 Eagle | Flip Chip Bonder |
| 411 | Semifab Inc. | LVAL 800/36 | Fume Hood Workstation |
| 412 | Semifab Inc. | LVAL 800/36 | Fume Hood Workstation |
| 413 | Semifab Inc. | LVAL 800/36 | Fume Hood Workstation |
| 414 | Semifab Inc. | LVAL 800/36 | Fume Hood Workstation |
| 415 | Semifab Inc. | LVAL 800/36 | Fume Hood Workstation |
| 416 | Semifab Inc. | LVAL 800/36 | Fume Hood Workstation |
| 417 | Semitool Inc. | Raider ECD310 | ECD (Electro Chemical Deposition) |
| 418 | Semitool Inc. | Raider ECD310 | ECD (Electro Chemical Deposition) |
| 419 | SEZ Group | DV-34 | Single Wafer Processing |
| 420 | SEZ Group | DV-34 | Single Wafer Processing |
| 421 | Shibaura Engineering Works Ltd. | CDE-300 | Metal Etch |
| 422 | Showa Denko | abatement series | Chemical/Gas Treatment System |
| 423 | SIB Tempress | EMB 1100 | Wire Bonder |
| 424 | SIB Tempress | EMB 1100 | Wire Bonder |
| 425 | SilverStone Technology Co | SST-ST45SF | PC Power Supplies |
| 426 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 427 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 428 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 429 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 430 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 431 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 432 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 433 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 434 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch |
| 435 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch |
| 436 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch |
| 437 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch |
| 438 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch |
| 439 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch |
| 440 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch |
| 441 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch |
| 442 | SINGULUS TECHNOLOGIES AG | SILEX II ISOEDGE 5600 | Etch |
| 443 | SINGULUS TECHNOLOGIES AG | SILEX II DHF 5600 | Etch |
| 444 | SINGULUS TECHNOLOGIES AG | SILEX II CLEANTEX 2800 | Etch |
| 445 | Sokudo Co., Ltd. | RF-300A | Multi Block (Resist Coater/Developer) |
| 446 | Standard Research Systems | SR560 — Low-noise voltage preamplifier | Parts/Peripherals |
| 447 | Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter |
| 448 | Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter |
| 449 | Sun Yang Tech Sdn Bhd | AFR-01 | Strip Sorter |
| 450 | TDK | AFM-1505 | Flip Chip Bonder |
| 451 | TDK | AFM-1505 | Flip Chip Bonder |
| 452 | TDK | AFM-1505 | Flip Chip Bonder |
| 453 | TDK | AFM-1505 | Flip Chip Bonder |
| 454 | TDK | AFM-1503 | Flip Chip Bonder |
| 455 | TDK | AFM-1503 | Flip Chip Bonder |
| 456 | TDK | AFM-1503 | Flip Chip Bonder |
| 457 | TDK | AFM-1505 | Flip Chip Bonder |
| 458 | TDK | AFM-1505 | Flip Chip Bonder |
| 459 | TDK | AFM-1505 | Flip Chip Bonder |
| 460 | TDK | AFM-1503 | Flip Chip Bonder |
| 461 | Tecdia Inc. | TEC-1228AL | Wafer Breaker |
| 462 | Technos | TVD-900 ICP-MS | Spectrometry |
| 463 | Thermal Product Solutions | Blue M POM7-136F | Cure Oven |
| 464 | Thermaltake Technology | Toughpower 750W Gold | PC Power Supplies |
| 465 | Thermo Electron Corporation | Napco 8100-TD | Test Chamber |
| 466 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 467 | Tokyo Electron Ltd. (TEL) | Triase+ Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 468 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 469 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 470 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 471 | Tokyo Electron Ltd. (TEL) | TELINDY Plus Oxide | Vertical Furnace |
| 472 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD |
| 473 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD |
| 474 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 475 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 476 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 477 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 478 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 479 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD HighK | Vertical Furnace |
| 480 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 481 | Tokyo Electron Ltd. (TEL) | Cellesta+ | Single Wafer Processing |
| 482 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 483 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 484 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 485 | Tokyo Electron Ltd. (TEL) | Tactras RLSA Poly | Polysilicon Etch |
| 486 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 487 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 488 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 489 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 490 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 491 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 492 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 493 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 494 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 495 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 496 | Tokyo Electron Ltd. (TEL) | TELINDY Plus IRAD Oxide | Vertical Furnace |
| 497 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Single Block (Coat/Develop) |
| 498 | Tokyo Electron Ltd. (TEL) | TELINDY OXIDE | Vertical Furnace |
| 499 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 500 | Tokyo Electron Ltd. (TEL) | Tactras Vigus RK3 – Chamber Only | Dielectric Etch |
| 501 | Tokyo Electron Ltd. (TEL) | Trias W – Chamber Only | Metal CVD (Chemical Vapor Deposition) |
| 502 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 503 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 504 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 505 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD |
| 506 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 507 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 508 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 509 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 510 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 511 | Tokyo Electron Ltd. (TEL) | TELINDY Nitride | Vertical Furnace |
| 512 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 513 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Single Block (Coat/Develop) |
| 514 | Tokyo Electron Ltd. (TEL) | Trias W | MOCVD |
| 515 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 516 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 517 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 518 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 519 | Tokyo Electron Ltd. (TEL) | ALPHA-303i TEOS | Vertical Furnace |
| 520 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 521 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Anneal | Vertical Furnace |
| 522 | Tokyo Electron Ltd. (TEL) | Triase+ EX-II Plus Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 523 | Tokyo Electron Ltd. (TEL) | Telius 305 DRM | Dielectric Etch |
| 524 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 525 | Tokyo Electron Ltd. (TEL) | TELINDY Plus ALD | Vertical Furnace |
| 526 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 527 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 528 | Tokyo Electron Ltd. (TEL) | TELINDY OXIDE | Vertical Furnace |
| 529 | Tokyo Electron Ltd. (TEL) | TELINDY OXIDE | Vertical Furnace |
| 530 | Tokyo Electron Ltd. (TEL) | TELINDY Nitride | Vertical Furnace |
| 531 | Tokyo Electron Ltd. (TEL) | UW300Z | Batch Wafer Processing |
| 532 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 533 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 534 | Tokyo Electron Ltd. (TEL) | TELFORMULA | Vertical Furnace |
| 535 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 536 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 537 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 538 | Tokyo Electron Ltd. (TEL) | Expedius | Batch Wafer Processing |
| 539 | Tokyo Electron Ltd. (TEL) | Tactras Vesta | Polysilicon Etch |
| 540 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 541 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN | Metal CVD (Chemical Vapor Deposition) |
| 542 | Tokyo Electron Ltd. (TEL) | CLEAN TRACK LITHIUS | Multi Block (Resist Coater/Developer) |
| 543 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 544 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 545 | Tokyo Electron Ltd. (TEL) | Trias Ti/TiN Chamber | Parts/Peripherals |
| 546 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 547 | Tokyo Electron Ltd. (TEL) | ALPHA-303i Nitride | Vertical Furnace |
| 548 | Tokyo Electron Ltd. (TEL) | TELFORMULA ALD High-K | Vertical Furnace |
| 549 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 550 | Tokyo Electron Ltd. (TEL) | TELFORMULA Nitride | Vertical Furnace |
| 551 | Tokyo Electron Ltd. (TEL) | Telius SP-305 SCCM | Dielectric Etch |
| 552 | TOWA (OMRON) Laser Front Inc. | SL473G | Laser Scribe |
| 553 | TOWA (OMRON) Laser Front Inc. | SL473G | Laser Scribe |
| 554 | Toyoko Kagaku | Toyoko Kagaku Fume Hood | Fume Hood Workstation |
| 555 | Trio-Tech International | G-203 | Bubble Tester |
| 556 | Ultron Systems Inc | UH115 | Wafer Mounter |
| 557 | Unisem | UN-2002A-PG | Abatement – Scrubber |
| 558 | Unknown | Cabinet | Misc Parts |
| 559 | Unknown | Cabinet | Misc Parts |
| 560 | Unknown | Seal Boats | Misc Parts |
| 561 | Ushio | UMA-2003 | UV Cure System |
| 562 | Vacuum Instruments Corporation (VIC) | MS-50GT | Leak Detector |
| 563 | Varian Semiconductor Equipment Associates (VSEA) | VIISta PLAD | High Dose Implant |
| 564 | Varian Semiconductor Equipment Associates (VSEA) | VIISta PLAD | High Dose Implant |
| 565 | Varian Semiconductor Equipment Associates (VSEA) | VIISta 3000HP | High Energy Implanter |
| 566 | Varian Semiconductor Equipment Associates (VSEA) | VIISta P2LAD | Low/Ultra Low Energy Implanter |
| 567 | Various | Various | Parts/Peripherals |
| 568 | Various | Various | Parts/Peripherals |
| 569 | Veeco Instruments Inc. | Dimension 7000 | Atomic Force Microscope (AFM) |
| 570 | Veeco Instruments Inc. | Dimension X1D | Atomic Force Microscope (AFM) |
| 571 | Veeco Instruments Inc. | Dimension X1D | Atomic Force Microscope (AFM) |
| 572 | Veeco Instruments Inc. | Dimension Vx 340 | Atomic Force Profiler (AFP) |
| 573 | Versum Materials / Merck | Variuos | Chemical Mix & Distribution |
| 574 | VISHAY | SI4162DY-T1-GE3 | SOIC-8 |
| 575 | VON ARDENNE | XEA NOVA | Coating Equipment |
| 576 | VON ARDENNE | XEA NOVA | Coating Equipment |
| 577 | VON ARDENNE | XEA NOVA | Coating Equipment |
| 578 | VON ARDENNE | XEA NOVA | Coating Equipment |
| 579 | Watkins-Johnson | 6CS-58(H) | Hermetic Seal Equipment |
| 580 | Wentworth Laboratories | pegasus s300 | Engineering Wafer Prober |
| 581 | West Bond, Inc. | 7200CR | Die Bonder |
| 582 | WTC | ESD Bag Sealer | Bag Sealer |
| 583 | Zen Voce Corporation | BM388 | Solder Ball Mount |
SS5319-0-10-1-1
