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Plasma-Therm VII 734MF RIE Reactive Ion Etch System

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Description

Please contact us for the availability of the Plasma-Therm VII 734MF RIE Reactive Ion Etch System used Semiconductor Equipment.

Manufacturer Plasma-Therm
Model VII 734
Wafer Size Range
  Minimum 50 mm
  Maximum 200 mm
Process RIE/Plasma Deposition
Controller Type Microprocessor Controller Type

The items are subject to prior sale without notice. These items are only for end users.

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