Description
K&S 984-6 Precision Wafer Dicing Saw:
- Sub-micron accuracy.
- 4 in. spindle.
- 208V, 1 Ph, 50/60 Hz, 15A.
- 4 in. dicing technology for superior sawing.
- Automated process control.
- Used for cutting hard materials up to 6 in. dia.
Condition: It was complete,working, however due to lack of power supply unable to fully test. Sold As-Is. Complete,working,functional test or refurbished conditions are optional at extra cost.
Valid time: Subject to prior sale without notice.
Contact us (sales@semistarcorp.com) for more info pls. Appreciate your time.
ID-SS380-e
