Description
Parameters | Specifications |
Growing Method | CZ or MCZ |
Type | P |
Dopant | Boron |
Orientation | <100> |
Resistivity | 1-100ohm-cm |
Diameter | 300.00±0.2 mm |
Thickness | ≥650um, ≥700um, 775±25um |
Bow/Warp | ≤100um or better |
TTV | ≤25um or better |
Particle | ≥0.30um Max 30ea or better |
Please contact us if you are also interested in the the following 200mm 300mm wafers/silicon ingot.
- 200mm Si Test Wafer
- 300mm Si Test Wafer
- 200mm Al Wafer
- 300mm Al Wafer
- 200mm Si Oxide Wafer
- 300mm Si Oxide Wafer
- 300mm Silicon Ingot
- 350mm Silicon Ingot