Description
- 26″x44″ footprint with enclosed panels ideal for clean rooms
- Fully automatic PC based, recipe driven
- LabVIEW user interface
- EMO protection and safety interlocks
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Ion Beam and PVD |
NRP-4000 PECVD and RIE/ ICP/DRIE |
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PECVD and Sputtering |
RIE/ICP/DRIE and Sputtering |
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NLP-4000 PECVD PEALD |
NLE-4000 PAALE PEALD |
NANO-MASTER’S NLP-4000 HYBRID PEALD/PECVD SYSTEM
Due to the chamber design and planar ICP source, both ALD and PECVD processes can be ran within the same NLP-4000 system without the need of mechanical reconfiguration. The hybrid system al-lows for deposition of both thin ALD films and thick PECVD films within the same chamber and process (“recipe”).
HYBRID SYSTEM:
The Nano-Master NLE-4000 series of hybrid system provides both Plasma-Enhanced Atomic Layer Etch-ing (PEALD) and Plasma-Assisted Atomic Layer Etching (PAALE) capability in the same process chamber making it a state-of-the-art ALE tool for Research and Development. Widely used in na-noscale fabrication, MEMS, quantum devices, and advanced semiconductor technologies, our hy-brid PAALE/PEALD system is able to provide damage-free Plasma Assisted Atomic Layer Etching. Nano-Master ALE systems provide soft Atomic Layer Etching using our unique Planar Inductive Coupling Plasma (ICP) source.
NANO-MASTER’S HYBRID PEALD/PAALE SYSTEM ATOMIC LAYER ETCHING:
Atomic Layer Etching (ALE) is a precise material removal technique used in semiconductor manu-facturing that operates at the atomic level. This method ensures ultra-thin layer removal with high fidelity, allowing for selective etching of specific materials while minimizing damage to adja-cent areas. ALE enables precise control over surface morphology, making it essential for advanced device architectures. Characterized by low etch rates, it is ideal for applications requiring meticu-lous layer management typically in the order of monolayers. The process involves alternating cy-cles of surface modification and etching, which enhance uniformity and reproducibility. Addition-ally, ALE is compatible with a variety of materials, including silicon, metals, and dielectrics, and it reduces substrate damage, preserving electrical properties.
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Nano-Master Main Equipment: Thin Film | Etch | Cleaning | Space Simulation | Hybrid
SS10840