CHA Industries SSC 1000 Sputtering System

Description

Please contact us for the availability of the CHA Industries SSC 1000 Sputtering System used Semiconductor Equipment.

Manufacturer	CHA Industries
Model	SSC 1000
Description	Sputtering System
Other Information	System Specifications Combination high-vac valve,trap and pump Micrometer adjustable,variable orifice throttle valve CTI ON Board 10 cryopump with 9600 compressor(water cooled) CTI On Board auto regeneration control Edwards E2M80 mechanical pump Mass-Vac Posi-Trap model 345040 molecular sieve trap Soft vent Soft roughing Vacuum manifolding Granville-Phillips model 307 ion gauge control 28.5″ diameter by 16″ tall deposition chamber 29″ Diameter process/source chamber mounting plates Source plate has two blank off plates for unused 8″ source positions Upper mounting plate for cathode,heater array and lower plate for fixturing Upper and lower plate hoists Motorized hoists with adjustable limit switches Flag shutter Advanced Energy 3KW RF sputter power supply Heater array/Heater power supply for high pressure operation (1) Magnetron Cathode: 8 inch Inficon IC 5 rate and thickness deposition controller,configured for time/power control with 3.5″ floppy disc drive intergrated for control of the shutter and sputter power supply. Mass flow gas control (02/Ar) MKS model 247 power supply/readout Two model 2179 mass flow controlers with positive shutoff valves MKS model 250 pressure controler MKS model 627 pressure transducer Industrial grade Siemens PC, 64MB RAM,10.4″ TFT color monitor Windows NT 4.0 WONDERWARE software Controls multi layer,sequential process intergrating the operation,all the controls and power supplies Manual vent switch Roughing over-time and chamber over pressure interlocks
Power Requirements	120/208 V 100.0 A 60 Hz 3 Phase