Description
Aluminum Nitride Substrate
Application
Thermal dissipation plate for LED, and high power components such as CPU and converter
Material Characteristics
High thermal conductivity, corrosion resistant at high temperature, and high thermal stability
Material Comparison Chart:
| Nature | density(g/㎝3 ) | density(g/㎝3 ) | (10-6 / ℃) | (Kgf/㎜2 ) | (J/㎏*°K) | (GPa) | (MPa) | (MPa) | (MPa) | (MPa*m0.5 ) | (Poisson’s ratio) | (℃) |
| Al2-O3 | 3.9 | 3.9 | 8 | 1600 | 880 | 370 | 262 | 2600 | 380 | 3.6 | 0.26 | 2053 |
| ZrO2 | 6 | 6 | 10.1 | 1400 | 400 | 200 | 700 | 1850 | 690 | 9.5 | 0.23 | 2700 |
| SiC | 3.2 | 3.2 | 4 | 2300 | 700 | 410 | 400 | 3900 | 550 | 4.6 | 0.19 | 2700 |
| Si3 N4 | 3.3 | 3.3 | 2.3 | 1500 | 700 | 310 | 524 | 2500 | 780 | 7.7 | 0.24 | 1900 |
| Cellon Sialon | 3.2 | 3.2 | 3 | 1600 | 620 | 300 | 450 | 3500 | 600 | 6.5 | 0.23 | 1900 |
| WC | 15 | 15 | 6 | 1600 | 390 | 700 | 896 | 6100 | 550 | 25 | 0.18 | 2870 |
| Glass | 2.5 | 2.5 | 0.5 | 1000 | 740 | 70 | – | 1100 | 69 | 1 | 0.2 | 2200 |
| BN | 2 | 2 | 2 | 220 | 1850 | 62 | 41 | 143 | 73 | – | 0.13 | 2600 |
| AlN | 3.2 | 3.2 | 4.4 | 1200 | 730 | 340 | 400 | 2070 | 350 | 2.6 | 0.25 | 2400 |
| B4 C | 2.5 | 2.5 | 5.6 | 3200 | 930 | 450 | 350 | 2800 | 400 | 3 | 0.15 | 2450 |
| Steel | 7.8 | 7.8 | 13.6 | 126 | 448 | 200 | 520 | – | – | 14 | 0.3 | 1450 |
Relatively high thermal conductivity of the substrate table:
| Substrate material | FR4 | MCPCB | LTCC | Al2-O3 | SiC | AlN |
| (W/m*°K) | 0.7~1.2 | 2~6 | 8~15 | 20~28 | 120~140 | 140~180 |
| Insulativity(Ω×㎝) | 1014 | 108 | 1013 | 1015 | 108 | 1011 |
| (0.25cm2 ) (W) | <0.2 | 0.5~1 | 1~1.5 | 2~3 | 3~15 | 15~20 |
| Board size | To large-scale | To large-scale | No more 6″×6″ | No more 6″×6″ | No more 6″×6″ | No more 6″×6 |
The items are subject to prior sale without notice. These items are only for end users.
SS5624
