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TYTAN 4600 FURNACE

Description

Tystar Equipment: MINI SERIES | STANDARD SERIES | NANO SEREIS | SOLAR SERIES | Photo-Enhanced CVD | Tystar Instruments: GAS CONTROL| MASS FLOW TESTER | FLOW CALIBRATOR


Model: TYTAN 4600 ATMOSPHERIC PLCVD, TYTAN MINI SERIES for diffusion, oxidation and LPCVD applications

Overview

TYTAN furnace systems are field-proven furnaces that have served the semiconductor industry since the early 80’s. They are now proving their worth not only in the semiconductor but also in the MEMS industry. The TYTAN systems are used for a variety of processes such as diffusion, oxidation, anneal, and most importantly low pressure chemical vapor deposition(LPCVD).
The systems are based on a patented isothermal chamber design that offers a number of benefits. Thanks to this innovative design, the system requires considerably less floor space and electrical power than conventional furnaces of equal capacity. The isothermal feature also offers superior process uniformity. The systems are now well accepted as a solidly reliable and super-performing production tool in the industry. The TYTAN design incorporates several of the most advanced concepts required for high performance processing equipment.
Tystar boasts of its large installed customer base. Tystar has about 1,600 process tubes installed around the world, and most of them are still operating well. The large customer base is a testament to Tystar’s adamant dedication to customer support and strong commitment to customer satisfaction. Process guarantees and specifications are per customer agreement. The process results are highly accurate and predictable by virtue of its integrated control system. The system controls eliminate possible human errors to a large extent.

Tystar’s isothermal system design makes TYTAN systems very affordable while keeping the quality of job and parts used at the highest standards. The unique isothermal design concept also offers other benefits such as a smaller foot print, which saves expensive clean room space and offers higher cost efficiency by reducing gas and electricity more than 50 %. Not all furnace brands are the same. In addition to the benefits of the isothermal feature, a TYTAN system comes with a multitude of unique proprietary features that are absent in our competing brands. These unique features offer many advantages that are listed at “33 Reasons to Pick Tystar“.

Wafer contamination and particle deposition are key concerns of furnace system users. High-purity, chemically resistant materials are carefully selected for the gas distribution system and for all components coming in contact with the wafers inside the hot wall reactor chamber. Great care is exercised in pre-cleaning and assembling furnace parts. Point-of-use gas filters are used for all process gases entering the hot reactor tubes.

The highest priority of all is the safety for the users and the equipment itself as well. Safety features of the TYSTAR systems are integrated into, not simply afterthoughts. Toxic and hazardous gas leakage is reduced to an absolute minimum by using high quality components, orbitally welded gas lines and safety shut-off valves for each gas loop and for each manifold line. Gas controls are designed in a fail-safe manner with a minimum of operator dependence. Systems will automatically default to a nitrogen purge mode in case of an emergency. Safety interlocks are widely used in the gas control system to provide adequate gas purge cycles, time delays and temperature interlocks. The operator and equipment safety is assured by the 45 year experience of Tystar engineering staff in the matter.

The trademarks of the equipment and parts contained on this page belong to the Original Equipment Manufacturers.

Please provide info below for an official quotation with the following form. Appreciate your time.

  1. Substrate size, shape, thickness, materials:
  2. Voltage (208V, 220V, 240V, 380V,415V,480V, Unsure):
  3. AC Frequency (50Hz, 60Hz, Unsure):
  4. Laminar Flow Station – Laminar flow creates a class 10 clean room environment (Yes, No, Unsure):
  5. Plasma Cleaner function (Yes, No):
  6. Ultra High Vacuum Tubes – Pressures lower than 10-8 Torr  (Yes, No):
  7. Number of Tubes (1,2,3,4, 4+):
    No.1 No.2 No.3 No.4
    Process Type *
    Gas Loops (1,2,3,4,5,Unsure)

    * (1) Atmosphere – Anneal ; (2) Atmosphere – Wet oxidation – Pyrogenic; (3) Atmosphere – Wet oxidation – Drip Feed Flash Vaporizer; (4) Atmosphere – Dry oxidation; (5) Atmosphere – Solid Source Doping – P Type; (6) Atmosphere – Solid Source Doping – N Type; (7) Atmosphere – Liquid Source Doping – POCL3; (8) Atmosphere – Liquid Source Doping – BBr3; (9) Atmosphere – Sintering; (10) Atmosphere – Carbon Nanotubes; (11) LPCVD – Silicon Nitride /Low Stress; (12) LPCVD – High Temperature Oxide; (13) LPCVD – Polysilicon (Doped/Undoped); (14) LPCVD – Low temperature Oxide; (15) LPCVD – PSG; (16) LPCVD – BPSG;

  8. Purchase Time Limit (1-3 months, 4-6 months, 6+ months, Unsure):
  9. Did you use any Furnace/LPCVD which met your requirements of your applications? If yes, which model and brand?

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Vertical Oxidation Furnace : ASM International l Tempress l Tokyo Electron Limited l Centrotherm Photovoltaics l Koyo Thermo Systems Co.,Ltd. l Kokusai Electric Corporation l KE Semiconductor Equipment Co.,Ltd. l Applied Materials l NAURA Technology Group Co.,Ltd. l Beijing E-town Semiconductor Technology Co.,Ltd. | Tystar

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers