Tystar Equipment: MINI SERIES | STANDARD SERIES | NANO SEREIS | SOLAR SERIES | Photo-Enhanced CVD | Tystar Instruments: GAS CONTROL| MASS FLOW TESTER | FLOW CALIBRATOR
Stochiometric Silicon Nitride LPCVD
- Typical film thickness: 0.1 – 2 µm
- Refractive index at 550 nm / 1.98 – 2.0
- Batch Size: 50
- Deposition rate: 3 – 4.5 nm/min
- Gases: dichlorosilane, ammonia
- Uniformity: ± 3%
- Residual Stress: 1000 – 1250 MPa
- Deposition Gas Ratio: 3:1
- Deposition Temperature: 800 – 830 °C Gradient
