Description
Please contact us if you are interested in the EVG 501 Wafer Bonder . The EVG 501 Wafer Bonder is only for end users and are subject to prior sale without notice. Appreciate your time.
The EVG 501 is a wafer bonding station capable of running 6″ substrate with the current setup we have. Tool has the capability of doing:
Eutectic bonding
* Uses temperature and pressure only
* Uses an intermediate metal layer (usually gold)
Thermal compression bonding
* Uses temperature and pressure only
* Bonding of metal to metal layers
Direct or fusion bonding
* Can be done only with oxide intermediate layer to lower the bonding temperature
Bonding quality IR testing
* Use IR projector to verify the bounding uniformity and rough alignment check
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