PVA Tepla PS-210

SOLD. Please check other plasma asher equipment.

PVA Tepla PS-210 Microwave Plasma Surface Treatment Etch System

The Microwave Plasma System 210 is ideal for: Plasma surface modification. Plasma cleaning of organic surfaces. Bond strength enhancement. Plasma etch applications. Plasma asher applications. Increased or decreased wetability. Any other plasma system application.

Controller: Windows® O/S based touchscreen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided. Microwave Power. Display: Color 10.4-inch touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.

Quartz Chamber: 9.5 in. dia. x 9 in.

Four process gas inputs.

Previous Gases Used: O2, CF4, N2, AR.

Includes vacuum pump.

230V, 1 Ph, 50/60 Hz, CE.