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UV-600

The UV-600 UV-OZONE Cleaning System is a bench top system with a sealed cleaning chamber and can accommodate samples up to 165 mm x 165 mm x 10 mm thick. The wafer to be cleaned is placed on a semiconductor grade quartz tray which is mounted on linear bearings for smooth, easy sample loading and unloading

 

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Description

The MPT Pristine Series includes a matrix of products designed to address the spectrum of specialized cleaning requirements. The Pristine series UV-600 is an integrated system for UV-Ozone cleaning of semiconductor and optical surfaces, providing a clean hydrocarbon-free surface which significantly improves thin film adhesion. The simultaneous application of ozone and UV light is highly effective in removing residual organic and carbon contamination. The UV-600 UV-OZONE Cleaning System is a bench top system with a sealed cleaning chamber and can accommodate samples up to 165 mm x 165 mm x 10 mm thick. The wafer to be cleaned is placed on a semiconductor grade quartz tray which is mounted on linear bearings for smooth, easy sample loading and unloading. A timer set and display feature allows timing of the cleaning process from 1-999.9 minutes. An audible alarm sounds periodically upon completion of the cleaning process. Safety interlocks are provided to shut off the UV radiation if the door is opened or the exhaust is interrupted.UV-600

The irradiation chamber is sealed during operation, with an oxygen gas inlet and an ozone vent providing complete isolation of the ozone from the clean room. The closed chamber is class-10 clean room compatible and provides a clean, particle-free environment for the sample during irradiation. A 0-10 SLPM flowmeter is used to control the oxygen flow during the cleaning process. The oxygen flow is automatically shut off after termination of the process.

APPLICATIONS

  • Pre gate oxidation cleaning.
  • Pre-epitaxial cleaning.
  • Photoresist stripping and descum.
  • Controlled growth of sacrificial oxides on compound semiconductors.
  • Final cleaning of bond pads prior to wire bonding.
  • Cleaning of optical surfaces and photomasks prior to coating.
  • Cleaning of quartz resonators and surface acoustic wave components prior to packaging for maximum device stability.
FEATURES

  • Ultra-clean, class-10 compatible sealed cleaning chamber.
  • Semiconductor quartz process tray contacts wafer at edges only.
  • High intensity UV source provides rapid cleaning cycles.
  • Optional UV intensity monitor displays UV output in mW/cm2.

 

OPTIONS

  • UV intensity monitor
  • Elevated substrate temperature capability–up to 500 deg.C.
  • Simultaneous double-sided cleaning.
  • Variety of wafer trays for different substrates.
  • Cassette-to-cassette production system.

 

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Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing,JIPELEC, ag2146,JetClip,JetStar, AST SHS2000, AST STEAG 2800,  ssintegration, Rapid Thermal Oxide,JetFirst ,Mattson, annealsys, heatpulse ,ag 2146,Koyo Thermo Systems,AST STEAG-MATTSON 2800, heat pulse, Solaris, Eclipse ,modularpro, RLA-1000, AG Heatpulse,  rapid thermal processor, Steag AST SHS2000, Solaris 75, Solaris75,STEAG Electronic Systems ,eng-sol, Annealsys, RLA-3000, Engineering Solutions ,Solaris 150, Rapid Thermal Annealer , AS-Master ,modularpro,RTO ,Modular  Process Technology, Solaris150,AS-One,AS-Micro.Modular Process Technology supplies advanced RTP process solutions with the industry’s highest productivity. The MODULAR One™ multi-chamber RTP system enables high capacity manufacturing of leading edge devices and sets a new standard of performance and reliability for 300mm or 200mm wafer processing. Modular Process Technology also supplies the RTP-3000, a production 300mm or 200mm RTP system, the RTP-3000autoloader, a production susceptor solution for the compound semiconductor sector,  the RTP-800S for pilot production, the RTP-600S for process monitoring and process development, and the UV-RTP and UV stand alone systems which incorporate UV-Ozone processing capability. The following is a list of our products:Rapid Thermal Processing Production System: MODULAR One™ (200 mm);Rapid Thermal Processing System: RTP-3000 (300 mm or 200mm or 200mm w/Susceptor Autoloader) ; Rapid Thermal Processing System: RTP-800S (200 mm); Rapid Thermal Annealing System: RTP-600S (150 mm) ;UV-RTP System: UV-RTP-600 (150 mm);UV-OZONE Cleaning System: UV-600 (150 mm)

Modular Process Technology is a semiconductor equipment manufacturer of Rapid Thermal Processing Systems, hybrid UV-RTP  systems, and stand alone UV Ozone Cleaning Systems. There are many unique features incorporated into our product lines which make our products attractive to advanced research and development and manufacturing. Modular Process Technology has in-depth experience in fundamental materials science research and process development. Our extensive process technology is reflected in the quality of our system design and integration. 

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