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Unaxis Shuttleline ICP RIE

Unaxis Shuttleline ICP RIE

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Description

Please contact us if you are interested in the Unaxis Shuttleline ICP RIE. The Unaxis Shuttleline ICP RIE is only for end users and are subject to prior sale without notice. Appreciate your time.

The Unaxis Shuttleline System is an Inductive Coupled Plasma (ICP) reactor that is used for reactive ion etches. With the ICP, the etching system will be characterized with high plasma density, low process pressure, high etch rate, good etch uniformity, and low energy ion damage. A CCD end point detector is attached to the reactor, which provides a capability to determine the ending time of an etching process. Equipped with a heat exchanger, the Shuttleline ICP system allows the substrate temperature to be controlled from room temperature to 200°C.

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