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Ultron UH108

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Description

Ultron UH108 backlap tape applicator with Take-up roller assembly and static eliminator for 4-6 inch wafers

Location: CA, U.S.A.

These are  subject to prior sale. These are only for end user. Appreciate your time.

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.

OEM Info for your reference:

OPTIONS:
– Protective Film Take-up Roller Assembly: A gear-driven take-up Roller Assembly is available for use with protective layer-backed films, which automatically winds the protective layer onto a plastic core for easy handling and disposal.
– Static Eliminator (with or without Power Safety Interlock Switch): A static ionization bar prevents static build-up caused from either the film unwinding or from the separation of the film from the protective layer.
– ‘CE’ Mark
[Model UH108-8]:
– 5″ Wafer Capability
– 6″ Wafer Capability
FEATURES:
– Adjustable spring-loaded roller assembly ensures bubble-free lamination
– Adjustable cutting angle, depth, and diameter to control the amount of film overhang
– Adjustable roller pressure from topside to accommodate different film requirements
and various wafer thicknesses
– Cuts film to edge of wafer, including flats, within 0.005″
– Vacuum-securing wafer stage
– Wafer-centering mechanism
– Retractable cutting knife blade for operator safety
– Adjustable alignment pins accommodate any wafer size
– Adjustable cutter assembly for either a “contact cut” (wafers with alignment flat(s)) OR a “non-contact cut” (wafers with an alignment notch)
– Spring-loaded tensioner bar prevents wafer stress due to film stretch
– Operates with backed or non-backed film. Optional Take-up Roller Assembly available for film with backed liner.

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SS7270-1-2-1-1 and SS7270W

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers